Dr. Fangcheng Wang received his Ph.D. from Xi'an Jiaotong University in 2019. Subsequently, Dr. Wang joined in Tsinghua University for post-doc research. Currently, Dr. Wang is currently an associate professor of the Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences. His research interests include temporary bonding and debonding materials and processes for wafer-level packaging.