基本信息
李金辉  男  硕导  中国科学院深圳先进技术研究院
电子邮件: jh.li@siat.ac.cn
通信地址: 深圳市南山区西丽大学城学苑大道1068号
邮政编码: 518055

研究领域

  主要从事集成电路芯片先进封装材料研究,包括晶圆级封装光敏聚酰亚胺材料、智能响应电子材料等。

招生信息

   
招生专业
070305-高分子化学与物理
070304-物理化学
招生方向
集成电路芯片封装光刻胶
光敏聚酰亚胺
高分子及复合材料

教育背景

2012-09--2017-07   中国科学院大学   博士
学历
博士

学位
工学博士

工作经历

   
工作简历
2020-12~现在, 中国科学院深圳先进技术研究院, 副研究员
2020-09~2020-12,中国科学院深圳先进技术研究院, 助理研究员一级
2018-08~2020-08,中国科学院深圳先进技术研究院, 博士后/助理研究员
2017-08~2018-07,香港城市大学, Research associate

专利与奖励

   
奖励信息
(1) 深圳市科技进步二等奖, 二等奖, 市地级, 2022
(2) 优秀员工, 研究所(学校), 2020
(3) 优秀共产党员, , 研究所(学校), 2020
(4) 深圳市海外高层次人才, 市地级, 2019
(5) 优秀员工, 研究所(学校), 2019
(6) 学术新星, 研究所(学校), 2019
(7) 优秀员工, 研究所(学校), 2018
专利成果
( 1 ) 一种化合物作为聚酰亚胺固化促进剂的应用、聚酰亚胺前驱体及其制备方法和应用, 发明专利, 2021, 第 2 作者, 专利号: CN112321827A

( 2 ) 一种聚酰亚胺复合材料及其制备方法和应用, 发明专利, 2020, 第 1 作者, 专利号: CN112029098A

( 3 ) 一种光或热引发的自修复弹性体及其制备方法和应用, 发明专利, 2020, 第 1 作者, 专利号: CN111471154A

( 4 ) 一种改性氧化石墨烯、浆料、复合薄膜及其制备方法和应用, 发明专利, 2020, 第 1 作者, 专利号: CN110818951A

( 5 ) 一种导电复合微球及其制备方法和应用、包含其的柔性压力传感器, 专利授权, 2021, 第 3 作者, 专利号: CN110987288B

( 6 ) 一种带有大体积侧基的二胺单体及其制备方法和应用, 发明专利, 2020, 第 3 作者, 专利号: CN110655472A

( 7 ) 一种自修复微型超级电容器及其制备方法, 专利授权, 2021, 第 3 作者, 专利号: CN110265227B

( 8 ) 一种聚酰胺酸酯、制备方法以及负性聚酰亚胺组合物和应用, 发明专利, 2019, 第 3 作者, 专利号: CN109988312A

( 9 ) 一种化合物在促进聚酰亚胺低温固化中的应用、聚酰亚胺前体组合物及其用途, 发明专利, 2019, 第 4 作者, 专利号: CN109946925A

( 10 ) 自修复水凝胶的制备方法, 专利授权, 2021, 第 3 作者, 专利号: CN109988265B

( 11 ) 一种负性光敏聚酰亚胺的组合物及其应用, 发明专利, 2019, 第 4 作者, 专利号: CN109824833A

( 12 ) 一种聚酰亚胺前体、树脂组合物、固化薄膜及其制备方法, 发明专利, 2019, 第 4 作者, 专利号: CN109867787A

( 13 ) 一种聚酰亚胺前体、制备方法以及树脂组合物及其应用, 发明专利, 2019, 第 4 作者, 专利号: CN109942817A

( 14 ) 一种用于感光性聚酰亚胺前体的显影剂及图案化方法, 发明专利, 2019, 第 4 作者, 专利号: CN109765763A

( 15 ) 一种可自修复的聚合物电解质及其制备方法和应用, 专利授权, 2021, 第 3 作者, 专利号: CN109796716B

( 16 ) 一种高灵敏度可拉伸柔性应变传感器及其制备方法, 发明专利, 2018, 第 3 作者, 专利号: CN107655398A

( 17 ) 自修复有机硅改性聚氨酯弹性体及其制备方法, 发明专利, 2017, 第 3 作者, 专利号: CN107082862A

( 18 ) 一种三维结构复合气凝胶、其制备方法及用途, 专利授权, 2020, 第 3 作者, 专利号: CN106902715B

( 19 ) 石墨烯/碳纳米管复合气凝胶的制备方法及石墨烯/碳纳米管复合气凝胶, 发明专利, 2017, 第 3 作者, 专利号: CN106629684A

( 20 ) 一种三维石墨烯应变传感器的制备方法, 发明专利, 2017, 第 2 作者, 专利号: CN106441380A

( 21 ) 一种智能聚合物复合材料、制备方法及其应用, 发明专利, 2016, 第 4 作者, 专利号: CN106221196A

( 22 ) 改性环氧树脂及其制备方法、改性环氧树脂组合物及其制备方法, 发明专利, 2015, 第 2 作者, 专利号: CN104761704A

( 23 ) 一种改性氟化石墨烯量子点、光敏复合材料及其应用, 发明专利, 2022, 第 1 作者, 专利号: CN115403831B

( 24 ) 三维纳米碳/聚酰亚胺复合气凝胶材料及其制备方法和用途, 发明专利, 2020, 第 1 作者, 专利号: CN 111607227 B

( 25 ) 一种高粘合强度的聚酰亚胺及其制备和应用, 发明专利, 2022, 第 3 作者, 专利号: CN114805805B

( 26 ) 一种化合物作为聚酰亚胺固化促进剂的应用、聚酰亚胺前驱体及其制备方法和应用, 发明专利, 2020, 第 2 作者, 专利号: CN112321827B

( 27 ) 聚酰胺酸组合物、聚酰亚胺组合物、聚酰亚胺薄膜及聚酰亚胺覆铜板, 发明专利, 2021, 第 2 作者, 专利号: CN 113061338B

出版信息

   
发表论文
(1) A strategy to prepare low-temperature curable photosensitive polyimide with good comprehensive performance, Chemical Engineering Journal, 2023, 通讯作者
(2) Synthesis of poly (amic ester) with controlled molecular weight for photosensitive polyimide in advanced package, Materials Today Communications, 2023, 通讯作者
(3) Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications, ELECTRONICS, 2023, 通讯作者
(4) Aminoquinoline-functionalized fluorographene quantum dots for low-temperature curable and low-dielectric photosensitive polyimide nanocomposites, COMPOSITES COMMUNICATIONS, 2023, 通讯作者
(5) Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion, Polymer, 2023, 通讯作者
(6) 临时键合技术在晶圆级封装领域的研究进展, Research Progress of Temporary Bonding Technology in Wafer Level Packaging, 电子与封装, 2023, 第 3 作者
(7) Low-dielectric and low-temperature curable fluorinated nano carbon/polyimide composites with 6-aminoquinoline for end capping, POLYMER COMPOSITES, 2023, 通讯作者
(8) Exploring the Impact of Blend and Graft of QuinolineDerivative in Low-Temperature Curable Polyimides, Macromol. Rapid Commun, 2023, 通讯作者
(9) Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups, Polymer Chemistry, 2023, 通讯作者
(10) Constructing High Performance Low-temperature Curable PI Materials by Manipulating the Side Group Effects of Diamine, Journal of Materials Chemistry C, 2023, 通讯作者
(11) Comprehensive properties study of polyimide with fluorinated nanofillers, Polymer Composites, 2023, 通讯作者
(12) Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets, COMPOSITES PART B-ENGINEERING, 2022, 通讯作者
(13) A strategy to construct low temperature curable copolyimides with pyrimidine based diamine, POLYMER, 2022, 通讯作者
(14) Adhesion and Interface Studies of the Structure-Controlled Polyimide with Smooth Copper for High-Frequency Communication, ADVANCED MATERIALS INTERFACES, 2022, 通讯作者
(15) Laser Lift-Off Technologies for Ultra-Thin Emerging Electronics: Mechanisms, Applications, and Progress, ADVANCED MATERIALS TECHNOLOGIES, 2022, 通讯作者
(16) Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package, POLYMER, 2022, 通讯作者
(17) Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages br, ACS APPLIED POLYMER MATERIALS, 2022, 通讯作者
(18) Stretchable and self-healable polyelectrolytes for flexible and sustainable supercapacitor, JOURNAL OF POWER SOURCES, 2021, 第 2 作者
(19) Natively stretchable micro-supercapacitors based on a PEDOT:PSS hydrogel, JOURNAL OF MATERIALS CHEMISTRY C, 2021, 第 1 作者
(20) Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole, POLYMER, 2021, 通讯作者
(21) Selective metallization of glass with improved adhesive layer and optional hydrophobic surface, COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2021, 通讯作者
(22) Fluorinated graphene/polyimide nanocomposites for advanced electronic packaging applications, JOURNAL OF APPLIED POLYMER SCIENCE, 2021, 通讯作者
(23) A comprehensive study of pyrazine-contained and low-temperature curable polyimide, POLYMER, 2021, 第 5 作者
(24) Comprehensive properties study of low-temperature imidized polyimide with curing accelerators, JOURNAL OF MATERIALS CHEMISTRY C, 2020, 通讯作者
(25) A synergistic self-assembled 3D PEDOT:PSS/graphene composite sponge for stretchable microsupercapacitors, JOURNAL OF MATERIALS CHEMISTRY A, 2020, 第 2 作者
(26) A flexible strain sensor based on CNTs/PDMS microspheres for human motion detection, SENSORS AND ACTUATORS A-PHYSICAL, 2020, 第 2 作者
(27) 光敏聚苯并噁唑的研究现状与发展趋势, Research Status and Development Trend of Photosensitive Polybenzoxazole, 材料导报, 2020, 第 2 作者
(28) Low temperature microwave fabrication of three-dimensional graphene/polyimide foams with flexibility strain responsivity, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2020, 第 2 作者
(29) Low-Dielectric Constant and Low-Temperature Curable Polyimide/POSS Nanocomposites, MACROMOLECULAR MATERIALS AND ENGINEERING, 2019, 通讯作者
(30) Self-healable polyelectrolytes with mechanical enhancement for flexible and durable supercapacitor, Chem. Eur. J, 2019, 
(31) Highly Ordered 3D Porous Graphene Sponge for Wearable Piezoresistive Pressure Sensor Applications, CHEMISTRY-A EUROPEAN JOURNAL, 2019, 第 2 作者
(32) UV-triggered self-healing polyurethane with enhanced stretchability and elasticity, POLYMER, 2019, 通讯作者
(33) Highly sensitive strain sensors based on hollow packaged silver nanoparticle-decorated three-dimensional graphene foams for wearable electronics, RSC ADVANCES, 2019, 通讯作者
(34) Effects of quinoline on the imidization temperature and properties of polyimide, MATERIALS RESEARCH EXPRESS, 2019, 通讯作者
(35) Highly Ordered Three-Dimensional Porous Graphene Sponge for Wearable Piezoresistive Pressure Sensor Applications, Chem. Eur. J, 2019, 
(36) Alkaline monomer for mechanical enhanced and self-healing hydrogels based on dynamic borate ester bonds, POLYMER, 2019, 通讯作者
(37) Self-Healable Polyelectrolytes with Mechanical Enhancement for Flexible and Durable Supercapacitors, CHEMISTRY-A EUROPEAN JOURNAL, 2019, 第 2 作者
(38) Biomimetic, recyclable, highly stretchable and self-healing conductors enabled by dual reversible bonds, CHEMICAL ENGINEERING JOURNAL, 2019, 第 6 作者
(39) Enhanced thermal conductivity of networked stainless steel/ZnO/PU composite for thermal pad application, MATERIALS RESEARCH EXPRESS, 2019, 第 2 作者
(40) Nacre-inspired highly stretchable piezoresistive Cu-Ag nanowire/graphene synergistic conductive networks for strain sensors and beyond, JOURNAL OF MATERIALS CHEMISTRY C, 2019, 第 5 作者
(41) Self-healing and shape memory linear polyurethane based on disulfide linkages with excellent mechanical property., MACROMOLECULAR RESEARCH, 2018, 第 2 作者
(42) Three-dimensional graphene structure for healable flexible electronics based on diels-alder chemistry., ACS APPLIED MATERIALS & INTERFACES, 2018, 第 1 作者
(43) Self-healable Silver Nanowire-Based Composite for Elastic Strain Sensor, ADVANCED FUNCTIONAL MATERIALS (CMC 2017), 2018, 第 2 作者
(44) Self-Healable and Mechanically Reinforced Multidimensional-Carbon/Polyurethane Dielectric Nanocomposite Incorporates Various Functionalities for Capacitive Strain Sensor Applications, MACROMOLECULAR CHEMISTRY AND PHYSICS, 2018, 第 3 作者
(45) Fabrication of a flexible and stretchable three-dimensional conductor based on au–ni@graphene coated polyurethane sponge by electroless plating, JOURNAL OF MATERIALS CHEMISTRY C, 2018, 通讯作者
(46) An Omni-Healable and Highly Sensitive Capacitive Pressure Sensor with Microarray Structure, CHEMISTRY-A EUROPEAN JOURNAL, 2018, 通讯作者
(47) Shearing strength of temporary bonding adhesive applied to different substrates, PROCEEDINGS OF 2018 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS, TECHNOLOGIES AND APPLICATIONS (ICTA 2018), 2018, 第 4 作者
(48) A Stretchable and Flexible Strain Sensor Based on Graphene Sponge, ADVANCED FUNCTIONAL MATERIALS (CMC 2017), 2018, 第 2 作者
(49) Ultrafast Self-Healing Nanocomposites via Infrared Laser and Their Application in Flexible Electronics., ACS APPLIED MATERIALS & INTERFACES, 2017, 第 2 作者
(50) Recent Advancements in Flexible and Stretchable Electrodes for Electromechanical Sensors: Strategies, Materials, and Features., ACS APPLIED MATERIALS & INTERFACES, 2017, 第 2 作者
(51) A covalently cross-linked reduced functionalized graphene oxide/polyurethane composite based on Diels-Alder chemistry and its potential application in healable flexible electronics., JOURNAL OF MATERIALS CHEMISTRY C, 2017, 第 1 作者
(52) Fabrication of highly reinforced and compressible graphene/carbon nanotube hybrid foams via a facile self-assembly process for application as strain sensors and beyond., JOURNAL OF MATERIALS CHEMISTRY C, 2017, 第 1 作者
(53) Effects of composition on the properties of dual physically cross-linked hydrogel composed of polyvinyl alcohol and poly (acrylamide-co-acrylic acid)., JOURNAL OF POLYMER RESEARCH, 2017, 第 4 作者
(54) Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond, SMALL, 2017, 第 3 作者
(55) Facile preparation of nitrogen/sulfur co-doped and hierarchical porous graphene hydrogel for high-performance electrochemical capacitor, JOURNAL OF POWER SOURCES, 2017, 第 1 作者
(56) Controllable Synthesis and Study on Morphology of Copper Nanowires., JOURNAL OF THE CHINESE CHEMICAL SOCIETY, 2017, 第 2 作者
(57) Highly stretchable and sensitive strain sensor based on facilely prepared three-dimensional graphene foam composite, ACS APPLIED MATERIALS & INTERFACES, 2016, 第 1 作者
(58) High-Strength, Tough, Fatigue Resistant, and Self-Healing Hydrogel Based on Dual Physically Cross-Linked Network, ACS APPLIED MATERIALS & INTERFACES, 2016, 第 4 作者
(59) 'Three-Dimensional Graphene-Based Composite for Elastic Strain Sensor Applications, MRS ADVANCES, 2016, 第 1 作者
(60) Facile preparation of folded structured single-walled carbon nanotube hybrid paper: Toward applications as flexible conductor and temperature-driven switch, CARBON, 2015, 第 3 作者
(61) Thermally reversible and self-healing novolac epoxy resins based on Diels-Alder chemistry, JOURNAL OF APPLIED POLYMER SCIENCE, 2015, 第 1 作者
(62) Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias, 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, 第 4 作者
(63) A facile method to prepare highly compressible three-dimensional graphene-only sponge, JOURNAL OF MATERIALS CHEMISTRY A, 2015, 第 1 作者
(64) In situ synthesis of silver nanostructures on magnetic Fe3O4@organosilicon microparticles for rapid hydrogenation catalysis, RSC ADVANCES, 2015, 第 3 作者
(65) 基于Diels-Alder反应的自修复聚合物材料, Self-healing Polymers Based on Thermally Reversible Diels-Alder Chemistry, 高分子通报, 2014, 第 1 作者
(66) In situ polymerization of mechanically reinforced, thermally healable graphene oxide/polyurethane composites based on Diels-Alder chemistry, JOURNAL OF MATERIALS CHEMISTRY A, 2014, 第 1 作者

科研活动

   
科研项目
( 1 ) 晶圆级封装再布线光敏聚酰亚胺材料, 负责人, 研究所自主部署, 2019-10--2020-08
( 2 ) 自修复可拉伸微型超级电容器关键材料及器件构筑研究, 负责人, 国家任务, 2018-11--2020-08
( 3 ) 基于三维弹性碳材料的高灵敏压力传感器的制备及应用研究, 负责人, 研究所自主部署, 2016-11--2018-11
( 4 ) 面向扇出型封装再布线的低介电光敏聚酰亚胺的制备及构效关系研究, 负责人, 国家任务, 2020-01--2022-12
( 5 ) 高端芯片减薄工序临时键合光敏材料及关键装备, 参与, 地方任务, 2020-01--2023-12
( 6 ) 功能微结构阵列的新型加工理论与关键技术, 参与, 国家任务, 2017-01--2020-12
( 7 ) 面向集成电路超薄芯片制造的临时键合胶材料, 参与, 中国科学院计划, 2019-01--2019-12
( 8 ) 半导体晶圆级先进封装及关键材料研发及应用, 参与, 中国科学院计划, 2017-01--2018-12
( 9 ) 先进封装聚酰亚胺新型单体合成及低温固化性能研究, 负责人, 地方任务, 2023-01--2025-12
( 10 ) 晶圆级封装用孪晶铜再布线的电镀制备、组织性能调控、结构设计和服役可靠性研究, 参与, 地方任务, 2022-10--2025-09
( 11 ) 集成电路先进封装阻焊干膜研发及应用研究, 负责人, 国家任务, 2023-07--2025-06
( 12 ) 光成像阻焊干膜材料联合实验室, 负责人, 其他, 2024-01--2026-12
参与会议
(1)A Novel Photosensitive Polyimide for High-resolution Selective Electroless Plating   1. Tao Wang; Jinhui Li*; Fangfang Niu*; Guoping Zhang*; Rong Sun   2022-08-10
(2)Influence of material property of photosensitive polyimide on typical structural stress in redistribution layer of fan-out package   2. Xingwang Lai; Cheng Zhong; Zixin Yang; Guangtao Xu; Jinhui Li*; Fangfang Niu*; Guoping Zhang*   2022-08-10
(3)Influence of rigidity and flexibility of polyimide segment on the adhesion between polyimide and copper   3. Zhen Sun; Jinhui Li*; Guoping Zhang*, Rong Sun   2022-08-10
(4)Copper adhesion promoters for polyimide:Heterocyclic compounds additives containing amino and hydroxyl groups   Yingying Li, Guoping Zhang*, Jinhui Li*, Changqing Li, Ao Zhong, Deliang Sun   2021-10-14
(5)Low Temperature Curing Copolyimide with Monomer Containing Pyrazine Moiety   Changqing Li, Guoping Zhang*, Jinhui Li*, Yingying Li   2021-10-14
(6)Novel Low-dielectric Fluorinated Carbon Fiber/Polyimide Materials with High Elongation   3. Tao Wang, Jinhui Li*, Fangfang Niu*, Liang Shan, Guoping Zhang,* Rong Sun and Ching-Ping Wong   2021-10-14
(7)Exploration of the synthesis method of quaternary copolymerized thermoplastic polyimide   Jinshan Liu, Jinhui Li*, Fangfang Niu*, Tao Wang, Wen Liu, Guoping Zhang*, Rong Sun   2021-10-14
(8)Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package   Wen Liu, Jinhui Li*, Jinshan Liu, Tao Wang, Ao Zhong, Guoping Zhang*, Qiang Liu, Rong Sun, Daquan Yu*   2021-10-14
(9)Low temperature curable polyimides for advanced package application   Yuying Sui, Jinhui Li*, Tao Wang, Liang Shan, Qiang Liu, Guoping Zhang*   2021-04-09
(10)Low CTE Polyimide for Advanced Package Application   Ao Zhong, Jinhui Li*, Liang Shan*, Qiang Liu, Guoping Zhang* and Rong Sun   2021-04-09
(11)Development of low temperature curing polyimides with quinoline   2019-08-12
(12)Intrinsic low dielectric constant and low dielectric loss polyimides: the effect of molecular chain regularity   2019-08-12
(13)Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature   2017-05-30
(14)Three-Dimensional Graphene-Based Composite for Elastic Strain Sensor Applications   2016-03-28
(15)Three-dimensional graphene foam for highly sensitive pressure sensors   2016-03-13