硅基光电集成

   

080903-微电子学与固体电子学

硅基光电子器件与集成

2011-08--2015-08   新加坡南洋理工大学   博士学位

美国Inphi公司 Staff R&D Engineer

   

[1] 孙佳琪, 杨妍, 欧祥鹏, 唐波, 李志华, 王文武. 一种硅基电光调制器及其制备方法. CN: CN113176675A, 2021-07-27.
[2] 杨妍, 唐波, 孙富君, 欧祥鹏, 李志华. 一种低功耗热光器件及其制作方法. CN: CN113176674A, 2021-07-27.
[3] 杨妍. 一种光器件. CN: CN112859387A, 2021-05-28.
[4] 张鹏, 唐波, 李志华, 李彬, 杨妍, 刘若男. 一种耦合光栅的制备方法. CN: CN110161606B, 2021-04-27.
[5] 李彬, 李志华, 谢玲, 唐波, 张鹏, 杨妍, 刘若男. 氮化硅膜的生长方法及厚膜氮化硅波导器件的制备方法. CN: CN112680715A, 2021-04-20.
[6] 杨妍. 一种光器件及其制作方法. CN: CN112612148A, 2021-04-06.
[7] 欧祥鹏, 杨妍, 孙佳琪, 孙富君, 唐波, 李志华. 混合等离子体波导及其制备方法. CN: CN112612077A, 2021-04-06.
[8] 杨妍. 一种电光器件及其制造方法. CN: CN112558217A, 2021-03-26.
[9] 杨妍. 一种光器件及其制造方法. CN: CN112558219A, 2021-03-26.
[10] 杨妍, 唐波, 张鹏, 李彬, 刘若男, 李志华, 谢玲, 王文武. 一种热光器件及其制造方法. CN: CN112558331A, 2021-03-26.
[11] 李彬, 李志华, 唐波, 张鹏, 杨妍, 刘若男. 一种光电探测器及其制备方法. CN: CN112563349A, 2021-03-26.
[12] 杨妍. 一种半导体器件的制造方法及半导体器件. CN: CN112466804A, 2021-03-09.
[13] 唐波, 张鹏, 杨妍, 李志华, 刘若男, 李彬, 黄凯, 谢玲, 王文武. 利用图形反转制作光子晶体的方法及光子晶体. CN: CN112462468A, 2021-03-09.
[14] 唐波, 张鹏, 杨妍, 李志华, 刘若男, 李彬, 黄凯, 谢玲, 王文武. 利用侧墙转移制作硅基光子器件的方法及硅基光子器件. CN: CN112462470A, 2021-03-09.
[15] 唐波, 张鹏, 杨妍, 李志华, 刘若男, 李彬, 黄凯, 谢玲, 王文武. 制作光子晶体的方法及光子晶体. CN: CN112462452A, 2021-03-09.
[16] 杨妍. 一种铜再布线层的制造方法、硅光器件及芯片. CN: CN112420523A, 2021-02-26.
[17] 杨妍. 一种铜互连线的制造方法及半导体器件. CN: CN112420601A, 2021-02-26.
[18] 唐波, 张鹏, 杨妍, 李志华, 刘若男, 李彬, 黄凯, 谢玲, 王文武. 双层硅基光子器件的制作方法及双层硅基光子器件. CN: CN112327412A, 2021-02-05.
[19] 唐波, 张鹏, 杨妍, 李志华, 刘若男, 李彬, 黄凯. 一种硅波导及其制备方法. CN: CN112198588A, 2021-01-08.
[20] 杨妍, 李志华, 王文武. 一种表面电极离子阱与硅光器件的集成结构及三维架构. CN: CN110943133A, 2020-03-31.
[21] 杨妍, 李志华, 谢玲, 张鹏, 唐波, 李彬, 刘若男, 刘道群. 一种栅格形铜电极结构及其制备方法. CN: CN110867428A, 2020-03-06.
[22] 杨妍. 一种硅光转接板及三维架构的集成方法. CN: CN110854025A, 2020-02-28.
[23] 杨妍, 李志华, 王文武, 谢玲, 张鹏. 表面电极离子阱与硅光寻址及探测器、及架构的集成方法. CN: CN110854235A, 2020-02-28.
[24] 李彬, 李志华, 杨妍. 一种厚膜氮化硅的区域挖槽制备方法. CN: CN110459464A, 2019-11-15.

   

[1] Yulin Chi, Jieshan Huang, Zhanchuan Zhang, Jun Mao, Zinan Zhou, Xiaojiong Chen, Chonghao Zhai, Jueming Bao, Tianxiang Dai, Huihong Yuan, Ming Zhang, Daoxin Dai, Bo Tang, Yan Yang, Zhihua Li, Yunhong Ding, Leif K Oxenlwe, Mark G Thompson, Jeremy L OBrien, Yan Li, Qihuang Gong, Jianwei Wang. A programmable qudit-based quantum processor. Nature Communications. 2022, 13(1): http://dx.doi.org/10.1038/s41467-022-28767-x.
[2] Tianxiang Dai, Yan Yang, Xiaoyong Hu, Qihuang Gong, Jianwei Wang. Topologically Protected Quantum Entanglement Emitters. Nature Photonics[J]. 2022, [3] Xiangpeng Ou, Yan Yang. Thermo-optically Tunable Slot Waveguide-based Dual Mode-splitting Resonators with Enhanced Sharp Lineshapes. Optics Express[J]. 2022, [4] Ou, Xiangpeng, Yang, Yan, Tang, Bo, Li, Donghao, Sun, Fujun, Zhang, Peng, Liu, Ruonan, Li, Bin, Li, Zhihua. Low-loss silicon nitride strip-slot mode converter based on MMI. OPTICS EXPRESS[J]. 2021, 29(12): 19049-19057, [5] Chen, Xiaojiong, Deng, Yaohao, Liu, Shuheng, Pramanik, Tanumoy, Mao, Jun, Bao, Jueming, Zhai, Chonghao, Dai, Tianxiang, Yuan, Huihong, Guo, Jiajie, Fei, ShaoMing, Huber, Marcus, Tang, Bo, Yang, Yan, Li, Zhihua, He, Qiongyi, Gong, Qihuang, Wang, Jianwei. A generalised multipath delayed-choice experiment on a large-scale quantum nanophotonic chip. 2021, http://arxiv.org/abs/2105.05580.
[6] Li, Donghao, Li, Bin, Tang, Bo, Zhang, Peng, Yang, Yan, Liu, Ruonan, Xie, Ling, Li, Zhihua. Characteristics of Crack-Free Silicon Nitride Films Deposited by LPCVD for Photonic Applications. JOURNAL OF ELECTRONIC MATERIALS[J]. 2021, 50(12): 6862-6869, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000701383500003.
[7] Xiaojiong Chen, Yaohao Deng, Shuheng Liu, Tanumoy Pramanik, Jun Mao, Jueming Bao, Chonghao Zhai, Tianxiang Dai, Huihong Yuan, Jiajie Guo, ShaoMing Fei, Marcus Huber, Bo Tang, Yan Yang, Zhihua Li, Qiongyi He, Qihuang Gong, Jianwei Wang. A generalized multipath delayed-choice experiment on a large-scale quantum nanophotonic chip. NATURE COMMUNICATIONS[J]. 2021, 12(1): https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8105384/.
[8] Tao, Jin, Wu, Lin, Yang, Yan, Liu, Zicheng, Qiu, Ying, Zheng, Guoxing, Yu, Shaohua. Light Spin Angular Momentum Spatial Mode Converter Based on Dielectric Metasurface. JOURNAL OF LIGHTWAVE TECHNOLOGY[J]. 2021, 39(8): 2438-2442, https://www.webofscience.com/wos/woscc/full-record/WOS:000633442200021.
[9] Ou, Xiangpeng, Yang, Yan, Sun, Fujun, Zhang, Peng, Tang, Bo, Li, Bin, Liu, Ruonan, Liu, Daoquin, Li, Zhihua. Wide-range, ultra-compact, and high-sensitivity ring resonator biochemical sensor with CMOS-compatible hybrid plasmonic waveguide. OPTICS EXPRESS[J]. 2021, 29(12): 19058-19067, [10] Yang Yan. High-performance waveguide-integrated Ge/Si lateral avalance photodiode. Micronanoelectronic Technology. 2020, [11] Deng, Liangui, Deng, Juan, Guan, Zhiqiang, Tao, Jin, Chen, Yang, Yang, Yan, Zhang, Daxiao, Tang, Jibo, Li, Zhongyang, Li, Zile, Yu, Shaohua, Zheng, Guoxing, Xu, Hongxing, Qiu, ChengWei, Zhang, Shuang. Malus-metasurface-assisted polarization multiplexing. LIGHT-SCIENCE & APPLICATIONS[J]. 2020, 9(1): https://doaj.org/article/3b0c15f63a9a4c839f2671cbf724f9a4.
[12] Bi, Xiaojun, Li, Jian, Gu, Zhen, Tang, Bo, Sheng, Chaodi, Yang, Yan, Xu, Qinfen. High Sensitivity and Dynamic-Range 25 Gbaud Silicon Receiver Chipset With Current-Controlled DC Adjustment Path and Cube-Shape Ge-on-Si PD. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS[J]. 2020, 67(11): 3991-4001, https://www.webofscience.com/wos/woscc/full-record/WOS:000583739900032.
[13] Zhang, Peng, Tang, Bo, Yang, Yan, Li, Bin, Liu, Ruonan, Xie, Ling, Li, Zhihua, Lin, Fujiang, Wang, Y, Kidger, TE, Matoba, O, Wu, R. Test System for Wafer-Level Silicon-Photonics Testing. OPTICAL DESIGN AND TESTING Xnull. 2020, 11548: [14] 高巍, 刘道群, 唐波, 张鹏, 李彬, 杨妍, 申人升, 常玉春, 李志华. 高性能波导集成型锗/硅水平APD. 微纳电子技术. 2020, 57(10): 765-770, http://lib.cqvip.com/Qikan/Article/Detail?id=7103059979.
[15] Deng, Juan, Yang, Yan, Tao, Jin, Deng, Liangui, Liu, Daoqun, Guan, Zhiqiang, Li, Gongfa, Li, Zile, Yu, Shaohua, Zheng, Guoxing, Li, Zhongyang, Zhang, Shuang. Spatial Frequency Multiplexed Meta-Holography and Meta-Nanoprinting. ACS NANO[J]. 2019, 13(8): 9237-9246, https://www.webofscience.com/wos/woscc/full-record/WOS:000484077800073.
[16] Cui, Yuan, Zheng, Guoxing, Chen, Ming, Zhang, Yilun, Yang, Yan, Tao, Jin, He, Taotao, Li, Zile. Reconfigurable continuous-zoom metalens in visible band. CHINESE OPTICS LETTERS[J]. 2019, 17(11): 69-74, http://lib.cqvip.com/Qikan/Article/Detail?id=7100541123.
[17] Dai, Qi, Deng, Liangui, Deng, Juan, Tao, Jin, Yang, Yan, Chen, Ming, Li, Zhongyang, Li, Zile, Zheng, Guoxing. Ultracompact, high-resolution and continuous grayscale image display based on resonant dielectric metasurfaces. OPTICS EXPRESS[J]. 2019, 27(20): 27927-27935, https://www.webofscience.com/wos/woscc/full-record/WOS:000488282800068.
[18] Zhang, Peng, Tang, Bo, Li, Bin, Yang, Yan, Liu, Ruonan, Li, TingTing, Li, Zhihua, Lin, Fujiang, Li, M, Jalali, B, Asghari, MH. Low Cost Test System for Silicon Photonics Testing. REAL-TIME PHOTONIC MEASUREMENTS, DATA MANAGEMENT, AND PROCESSING IVnull. 2019, 11192: [19] Yang Yan, Rusli, Yu Mingbin, IEEE. RF Modeling of the 3D Electro-Photonic Integration based on SOI Photonic TSV Interposer. 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC)null. 2019, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000483036000201.
[20] Yang Yan. Ultracompact, high-resolution and continuous grayscale image display based on resonant dielectric metasurface. Optics Express. 2019, [21] Fu, Rao, Li, Zile, Zheng, Guoxing, Chen, Ming, Yang, Yan, Tao, Jin, Wu, Lin, Deng, Qiling. Reconfigurable step-zoom metalens without optical and mechanical compensations. OPTICS EXPRESS[J]. 2019, 27(9): 12221-12230, [22] Wu, Lin, Yang, Yan, Liu, Zichen, Tao, Jin. Polarization controlled couplings of surface plasmon with asymmetrical nanoslit pairs. CURRENT APPLIED PHYSICS[J]. 2019, 19(8): 928-932, http://dx.doi.org/10.1016/j.cap.2019.04.008.
[23] 李东浩, 李彬, 唐波, 刘道群, 张鹏, 杨妍, 刘若男, 李志华. CMOS工艺兼容的8英寸硅光平台. 微纳电子与智能制造. 2019, 131-140, http://lib.cqvip.com/Qikan/Article/Detail?id=00002FUILH387JP167DO6JP169R.
[24] Yang Yan. Design and Characterization of Taveling-wave Electrodes for InP-based Rectangular Mach-Zehnder High Speed Electro-Optic Modulators. ACTA Photonica Sinica. 2017, [25] Yang Yan. 3D silicon photonics packaging based on TSV interposer for high density on-board optics module. IEEE 66th Electronic Components and Technology Conference (ECTC). 2016, [26] Yang Yan. 3D electro-optical integration based on high-performance Si photonics TSV interposer. OFC. 2016, [27] Yang Yan. High-performance Si photonics interposer featuring RF travelling-wave electrode (TWE) via Cu-BEOL. OFC. 2015, [28] Yang, Yan, Hu, Xiaonan, Song, Junfeng, Fang, Qing, Yu, Mingbin, Tu, Xiaoguang, Lo, GuoQiang, Rusli. Thermo-Optically Tunable Silicon AWG With Above 600 GHz Channel Tunability. IEEE PHOTONICS TECHNOLOGY LETTERS[J]. 2015, 27(22): 2351-2354, https://www.webofscience.com/wos/woscc/full-record/WOS:000362360900009.
[29] Yang, Yan, Fang, Qing, Yu, Mingbin, Tu, Xiaoguang, Rusli, Rusli, Lo, GuoQiang. High-efficiency Si optical modulator using Cu travelling-wave electrode. OPTICS EXPRESS[J]. 2014, 22(24): 29978-29985, https://www.webofscience.com/wos/woscc/full-record/WOS:000345770500065.
[30] Fang, Qing, Tu, Xiaoguang, Song, Junfeng, Jia, Lianxi, Luo, Xianshu, Yang, Yan, Yu, Mingbin, Lo, Guoqiang. PN-type carrier-induced filter with modulatable extinction ratio. OPTICS EXPRESS[J]. 2014, 22(24): 29914-29920, http://ir.semi.ac.cn/handle/172111/26002.
[31] Yang, Yan, Yu, Mingbin, Rusli, Fang, Qing, Song, Junfeng, Ding, Liang, Lo, GuoQiang. Through-Si-via (TSV) Keep-Out-Zone (KOZ) in SOI Photonics Interposer: A Study of the Impact of TSV-Induced Stress on Si Ring Resonators. IEEE PHOTONICS JOURNAL[J]. 2013, 5(6): https://doaj.org/article/240e271391734ce0972a2b9f3a5d0b57.

   

（ 1 ） 离子阱量子比特的可扩展三维集成硅光寻址与探测, 主持, 国家级, 2020-01--2022-12
（ 2 ） 光电微系统高速光互连接口IP化技术研究, 主持, 国家级, 2019-10--2020-12
（ 3 ） 硅基几何相位超构表面在空分复用光通信中的应用研究, 主持, 市地级, 2019-06--2021-06
（ 4 ） 基于400Gbps光互连硅基集成电路设计技术研究, 主持, 研究所（学校）, 2019-01--2020-12
（ 5 ） 硅基光电集成, 主持, 部委级, 2019-01--2020-12

（1）RF modeling of the 3D electro-photonic integration based on SOI photonic TSV interposer   2019-06-12

   

北京大学