Marine electronics and sensors;

Oceanic technology;

Flexible and stretchable electronics;

Soft robotics;

We are always looking for talented international Master and Ph.D. students to join our group.

2013.01 –     Ph.D. in Electrical Engineering, Advisor: Prof. Jan Vanfleteren

2017.06        IMEC and Ghent University, BELGIUM

2009.09 –     M.S. in Electronics Engineering

2010.07        Katholieke Universiteit Leuven, BELGIUM

Dr. Yang is Professor (Full) at Institute of Deep-Sea Science and Engineering, Chinese Academy of Sciences. He is the Leader of Ocean Sensors Group @ IDSSE, CAS. He is also the Associate Editor of IEEE Sensors Journal, a prestigious internationally recognized journal.

His multidisciplinary group conducts applied and fundamental research on flexible electronics, sensors, actuators, and energy harvesting devices and their application in marine technology, ocean technlogy, and oceanographic and deep-ocean applications. He has published over 50 research papers in reputed journals and peer reviewed international conferences, 3 submitted/granted patents and software inventions, and several book chapters.

Yang obtained his Ph.D. in Electrical Engineering from IMEC and Ghent University, Belgium, in May 2017. Professor Yang holds JSPS Fellowship from Japan in past. Since November 2020, Yang became an Associate Professor at the Institute of Deep-Sea Science and Engineering, Chinese Academy of Sciences, China. Besides his academic background, Yang has industrial experience in Royal Philips Electronics.

2022.07 –     Professor

Present         Institute of Deep-Sea Science and Engineering, CAS, CHINA

2020.11 –     Associate Professor

2022.06        Institute of Deep-Sea Science and Engineering, CAS, CHINA

2021.01 –     Associate Editor

Present         IEEE Sensors Journal

2020.06 –     Staff Scientist

2020.10        Pacific Northwest National Laboratory (PNNL), USA

2018.04 –     Postdoc, Advisor: Daniel Deng

2020.05        Pacific Northwest National Laboratory (PNNL), USA

2017.07 –     JSPS Postdoctoral Fellow, Advisor: Prof. Tsuyoshi Sekitani

2018.03        Osaka University, JAPAN

2011.01 –     Embedded Software Engineer

2012.12        Royal Philips Electronics, BELGIUM

Prof. Yang is active in peer reviewing activities, including high-impact journals such as Advanced Science, Advanced Materials, Advanced Energy Materials, Advanced Functional Materials, IEEE Transactions and so on, and now serves the Associate Editor of IEEE Sensors Journal, as well as Editorial/Reviewer Board of Sensors, Journal of Composites Science, and Crystals:

Advanced Science, Advanced Functional Materials, Small, Advanced Energy Materials, Advanced Engineering Materials, Composites Science and Technology, Advanced Electronic Materials, Advanced Materials Technologies, Review of Scientific Instruments, Smart Materials and Structures, IEEE Sensors Journal, IEEE Access, Nanotechnology, Journal of Physics D: Applied Physics, PLOS One, Materials & Design, Applied Physics Letters, Journal of Alloys and Compounds, MDPI Sensors, MDPI Electronics, ISA Transactions, Physical Chemistry Chemical Physics, Animal Biotelemetry, Journal of Adhesion Science and Technology, Journal of Applied Physics, AIP Advances, AIP Transactions, IEEE Transactions on Instrumentation and Measurement, Measurement Science and Technology, Flexible and Printed Electronics, Advanced Materials Interfaces, Chemical Communications, MDPI Polymers, 2D Materials, Structural Control and Health Monitoring, Journal of Composites Science, Journal of Materials Chemistry A, Journal of Materials Chemistry C, Journal of Micromechanics and Microengineering

Yang is an author of over 30 SCI-indexed papers with 500+ citations, most of which are published in high-impact journals, including 4 cover journal articles, 1 feature article in high-impact journals (JCR Q1).

(Highlight) Yang, Y. and Deng, ZD. (2019). Stretchable sensors for environmental monitoring. Applied Physics Reviews. 6(1), 011309. (IF:19.162)

Yang, Y., Lu, J., Pflugrath, B., Li, H., Martinez, J., Regmi, S., Wu, B., Xiao, J., Deng, ZD. Lab-on-a-Fish: Wireless, miniaturized, fully integrated, implantable biotelemetric tag for real-time in vivo monitoring of aquatic animals. IEEE Internet of Things Journal. (IF: 9.471)

Yang, Y., Ding, S., Araki, T., Jiu, J., Sugahara, T., Wang, J., ... & Suganuma, K. (2016). Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light. Nano Research. 9(2), 401-414. (IF: 8.897)

Yang, Y., Xu, K., Vervust, T., & Vanfleteren, J. (2018). Multifunctional and miniaturized flexible sensor patch: Design and application for in situ monitoring of epoxy polymerization. Sensors and Actuators B: Chemical. 261, 144-152. (IF: 7.46)

(Journal Front Cover) Yang, Y., Chiesura, G., Plovie, B., Vervust, T., Luyckx, G., Degrieck, J., Sekitani, T., Vanfleteren, J. (2018). Design and Integration of Flexible Sensor Matrix for in Situ Monitoring of Polymer Composites. ACS Sensors. 3(9), 1698-1705. (IF: 7.711)

(Journal Front Cover) Yang, Y., Vervust, T., Dunphy, S., Van Put, S., … & Vanfleteren, J. (2018). 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology. Advanced Electronic Materials. 4(8), 1800071. (IF: 7.295)

Yang, Y.^*, Plovie, B., Chiesura, G., Vervust, T., Daelemans, L., Mogosanu, D., Wuytens, P., De Clerck, K., Vanfleteren, J.^* (2021). Real time and in situ prediction of the degree of cure and glass transition temperature of an epoxy resin using a fully integrated flexible dielectric monitoring sensor system. IEEE Transactions on Instrumentation and Measurement. 70. (IF: 4.016)

Yang, Y., Chiesura, G., Vervust, T., Bossuyt, F., Luyckx, G., Degrieck, J., & Vanfleteren, J. (2016). Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites. Sensors and Actuators A: Physical. 243, 103-110. (IF: 3.407)

(Journal Front Cover) Yang, Y., Chiesura, G., Vervust, T., Degrieck, J., & Vanfleteren, J. (2016). Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers. Journal of Polymer Science Part B: Polymer Physics. 54(20), 2028-2037. (IF: 3.318)

Wu, B., Yang, Y.*, Liu, D., Niu, C., Gross, M., Seymour, L., Lee, H., Le, P., Vo, T., Deng, ZD., Dufek, E., Whittingham, S., Liu, J. and Xiao, J. (2019). Good Practices for Rechargeable Lithium Metal Batteries. Journal of the Electrochemical Society. 166(16), A4141. (IF: 3.12)

Li, W., Yang, Y., Zhang, B., Li, L., Liu, G., L, C., Jiu, J., Suganuma, K. (2019). 3D stretchable and transparent conductors with controllable strain-distribution based on template-assisted transfer printing. ACS Applied Materials & Interfaces. 11(2), 2140-2148. (IF: 8.097)

Li, W., Yang, Y., Zhang, B., Li, CF., Jiu, J., Suganuma, K. (2018) Highly Densified Cu Wirings Fabricated from Air-stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility. Advanced Materials Interfaces. 5(19), 1800798. (IF: 4.834)

Plovie, B., Yang, Y., Guillaume, J., … & Vanfleteren, J. (2017). Arbitrarily Shaped 2.5D Circuits using Stretchable Interconnects Embedded in Thermoplastic Polymers. Advanced Engineering Materials. 19(8), 1700032. (IF: 2.319)

Plovie, B., Yang, Y., Dunphy, S., Dhaenens, K., Van Put, S., Bossuyt, F., Vanfleteren, J. (2019) Stretchable mould interconnect optimization: peeling automation and carrierless techniques. IEEE Transactions on Components Packaging and Manufacturing Technology. 9.5 (2019): 955-962. (IF:1.66)

Zhang, Z., Chen, C., Yang, Y., … & Suganuma, K. (2019). Low-temperature and pressureless sinter joining of Cu with micro/submicron Ag paste in air. Journal of Alloys and Compounds. 780, 435-442. (IF: 3.315)

Zhang, B., Li, W., Yang, Y., Chen, C., Li, C., Suganuma, K. (2019). Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics. Journal of Materials Science. 54 (8), 6381-6392. (IF: 2.993)

Chiesura, G., Lamberti, A., Yang, Y., Luyckx, G., Van Paepegem, W., Degrieck, J., Vanfleteren, J, & Vanlanduit, S. (2016). RTM production monitoring of the A380 Hinge Arm droop nose mechanism. Sensors. 16(6), 866. (IF: 2.033)

Li, C., Cauwe, M., Yang, Y., Schaubroeck, D., Mader, L., Op de beeck, M. (2019) Ultra-Long-Term Reliable Encapsulation using an Atomic Layer Deposited HfO₂ / Al₂O₃ / HfO₂ Triple-Interlayer for Biomedical Implants. Coatings. 9(9), 579. (IF: 2.33)

(Journal Front Cover) Zang, X., Yan, L., Yang, Y., Pan, H., Nie, Z., Deng, ZD., Wang, W. (2019) Monitoring the state-of-charge of a vanadium redox flow battery with the acoustic attenuation coefficient: an in operando noninvasive method. Small Method. 3(12), 1900494. 

Li, C., Li, W., Zhang, H., Jiu, J., Yang, Y., Li, L., Gao, Y., Liu, Z., Suganuma, K. (2019) Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics. ACS Applied Materials & Interfaces. 11(3), 3231-3240. (IF: 8.097)

Zhou, K., Han, C., Li, C., Jiu, J., Yang, Y., ... & Suganuma, K. (2018) Highly Stable Transparent Conductive Electrode Based on Silver–Platinum Alloy-walled Hollow Nanowires for Emerging Optoelectronic Devices. ACS Applied Materials & Interfaces. 10(42), 36128-36135. (IF: 8.097)

Zhang, B., Li, W., Jiu, J., Yang, Y., Jing, J., Li, C., Suganuma, K. (2019) Large-scale and galvanic replacement free synthesis of Cu@Ag core-shell nanowires for flexible electronics. ACS Inorganic Chemistry. 58(5), 3374-3381. (IF: 4.7)

Han, Y., Sinnwell, M., Surbella, R., Xu, W., Sushko, M., Zheng, J., Engelhard, M., Liu, L., Yang, Y., Ma, S., Thallapally, P. (2020) Coordination site modification in a heterometallic Zr-MOF through post-synthetic oxidation. Chemistry of Materials. Just Accepted. (IF: 10.159)

Zhang, B., Li, W., Nogi, M., Chen, C., Yang, Y., Sugahara, T., Koga, H., Suganuma, K. (2019) Alloying and embedding of Cu-core/Ag-shell nanowire for ultra-stable stretchable and transparent electrodes. ACS Applied Materials & Interfaces. 11(20), 18540-18547. (IF: 8.097)

Yang, Y., Martinez, J., Lu, J., Hou, H., Deng, Z.D. 2019. Design and implementation of a real-time underwater acoustic telemetry system for fish behavior study and environmental sensing. In Oceans 2019 MTS/IEEE SEATTLE. IEEE.

Yang, Y., Plovie, B., Vervust, T., Vanfleteren, J. 2016. Capacitive sensor network for composites production monitoring. In IEEE Sensors 2016.

Yang, Y., Chiesura, G., Vervust, T., Bossuyt, F., Luyckx, G., Kaufmann, M., ... & Vanfleteren, J. (2015). Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic). In MRS Proceedings (Vol. 1798, pp. mrss15-2136585). Cambridge University Press.

Yang, Y., Chiesura, G., Vervust, T., Bossuyt, F., Luyckx, G., Kaufmann, M., Degrieck, J. and Vanfleteren, J., 2015. Cure degree monitoring of an infusion process by deformable electronic circuit with integrated capacitive sensors. In 20th International conference on Composite Materials (ICCM-20).

Yang, Y., Vervust, T., Bossuyt, F., Vanfleteren, J., Chiesura, G., Luyckx, G., Degrieck, J., Kaufmann, M., 2015. Non-destructive evaluation of an infusion process using capacitive sensing technique. In Emerging Technologies in Non-Destructive Testing VI. Dec 2015, 293 -297.

Yang, Y., Chiesura, G., Luyckx, G., Vervust, T., Bossuyt, F., Vanfleteren, J., & Degrieck, J. (2014). In situ on-line cure monitoring of composites by embedded interdigital sensor. In 16th European conference on Composite Materials (ECCM-16). Universidad de Sevilla. School of Engineering.

Yang, Y., Chiesura, G., Luyckx, G., Vervust, T., Bossuyt, F., Kaufmann, M., ... & Vanfleteren, J. (2014). Development of a dielectric sensor system for the on-line cure monitoring of composites. Procedia Technology, 15, 631-637.

Plovie, B., Yang, Y., Guillaume, J., Dunphy, S., Dhaenens, K., Van Put, S., Vervust, T., Bossuyt, F. and Vanfleteren, J., 2016, October. One-time deformable thermoplastic devices based on flexible circuit board technology. Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International (pp. 125-128). IEEE.

Vanfleteren, J., Plovie, B., Yang, Y., De Smet, J., Verplancke, R., Bossuyt, F. and De Smet, H., 2015. Free-form 2.5 D thermoplastic circuits using one-time stretchable interconnections. MRS Online Proceedings Library Archive, 1798.

Vanfleteren, J., Chtioui, I., Plovie, B., Yang, Y., Bossuyt, F., Vervust, T., Dunphy, S. and Vandecasteele, B., 2014. Arbitrarily shaped 2.5 D circuits using stretchable interconnections and embedding in thermoplastic polymers. Procedia Technology, 15, pp.208-215.

JSPS Science Dialogue Program “Introduction to stretchable electronics”. Koyo High School, Japan. 2018

Lab assistant for master’s course: “Sensors and actuators”. Ghent University, 2016-2017

Lab assistant for master’s course: “Technology of integrated circuits and microsystems” Ghent University, 2016-2017

Supervision of master student: “Development of a one-time deformable microsystem with integrated sensor network”, Ke Xu, Ghent University, Belgium. 2015-2016.

Supervision of master student: “Impedance measurement system”, Shizhen Wang, KU Leuven, Belgium. 2014-2015