基本信息
许高博  男  硕导  中国科学院微电子研究所
电子邮件: xugaobo@ime.ac.cn
通信地址: 北京市朝阳区北土城西路3号
邮政编码: 100029

研究领域

新型半导体器件

集成电路先导工艺

氧化铪基铁电材料与器件

薄膜晶体管与三维集成

先进半导体探测器

招生信息

   
招生专业
080903-微电子学与固体电子学
085400-电子信息
招生方向
集成电路工程
集成电路先导工艺技术

教育背景

2016-11--2017-12   德克萨斯大学奥斯汀分校   访问学者
2003-09--2009-07   中国科学院微电子研究所   工学博士
1998-09--2002-07   山东大学   工学学士

工作经历

   
工作简历
2021-07~现在, 中国科学院微电子研究所, 研究员
2011-09~2021-07,中国科学院微电子研究所, 副研究员
2009-07~2011-09,中国科学院微电子研究所, 助理研究员

专利与奖励

   
奖励信息
(1) 中科院微电子所研究生喜爱的导师, 研究所(学校), 2021
(2) 中科院微电子所先导中心科研之星, 其他, 2020
(3) 中科院微电子所先导中心科研之星, 其他, 2019
(4) 中科院微电子所先导中心科研之星, 其他, 2018
(5) 中国科学院微电子研究所优秀共产党员, 研究所(学校), 2016
(6) 中国科学院微电子研究所先进工作者, , 研究所(学校), 2014
(7) 中国科学院微电子器件与集成技术重点实验室优秀员工, 研究所(学校), 2012
专利成果
( 1 ) 一种硅像素探测器及其制备方法, 发明专利, 2022, 第 3 作者, 专利号: CN114156292A

( 2 ) 垂直纳米线晶体管与其制作方法, 专利授权, 2022, 第 4 作者, 专利号: CN108428634B

( 3 ) 一种半导体器件及制备方法, 发明专利, 2021, 第 1 作者, 专利号: CN113793806A

( 4 ) 一种铁电场效应管及其制备方法以及铁电存算器件, 发明专利, 2021, 第 3 作者, 专利号: CN113782607A

( 5 ) 冷源MOS晶体管及制作方法, 发明专利, 2021, 第 3 作者, 专利号: CN113745314A

( 6 ) 硅基探测器的制造方法及用于其的热处理装置, 发明专利, 2021, 第 2 作者, 专利号: CN113675296A

( 7 ) 半导体器件的制造方法, 发明专利, 2021, 第 2 作者, 专利号: CN107293492B

( 8 ) 一种氧化物半导体器件及其制备方法, 发明专利, 2021, 第 2 作者, 专利号: CN113471295A

( 9 ) 硅基探测器及其制作方法, 发明专利, 2021, 第 1 作者, 专利号: CN113299785A

( 10 ) 一种半导体器件及制备方法, 专利授权, 2021, 第 1 作者, 专利号: CN113192891A

( 11 ) 一种铁电薄膜及其沉积方法、应用, 发明专利, 2021, 第 2 作者, 专利号: CN113178478A

( 12 ) 一种HfO 2 基铁电薄膜及其沉积方法, 发明专利, 2021, 第 2 作者, 专利号: CN113178477A

( 13 ) 一种存储器及其制造方法, 发明专利, 2021, 第 1 作者, 专利号: CN113013235A

( 14 ) 一种漂移探测器的双面制备方法及漂移探测器, 专利授权, 2021, 第 1 作者, 专利号: CN110854222B

( 15 ) 一种漂移探测器的制备方法及漂移探测器, 专利授权, 2021, 第 1 作者, 专利号: CN110854223B

( 16 ) 一种绝缘体上半导体结构及其抗总剂量辐照加固方法, 发明专利, 2020, 第 2 作者, 专利号: CN112086516A

( 17 ) X射线阵列传感器、探测器及其制作方法, 发明专利, 2020, 第 2 作者, 专利号: CN111799351A

( 18 ) 隧穿场效应晶体管及其制造方法, 专利授权, 2020, 第 1 作者, 专利号: CN106558609B

( 19 ) 隧穿场效应晶体管及其制造方法, 发明专利, 2020, 第 1 作者, 专利号: CN106504989B

( 20 ) 半导体器件与其制作方法, 发明专利, 2018, 第 4 作者, 专利号: CN108493246A

( 21 ) 垂直纳米线晶体管与其制作方法, 发明专利, 2018, 第 4 作者, 专利号: CN108428634A

( 22 ) 量子点器件及其制作方法, 专利授权, 2018, 第 4 作者, 专利号: CN108417635A

( 23 ) 纳米线阵列围栅MOSFET结构及其制作方法, 专利授权, 2018, 第 5 作者, 专利号: CN108364910A

( 24 ) 隧穿场效应晶体管及其制造方法, 专利授权, 2018, 第 1 作者, 专利号: CN108369960A

( 25 ) 一种遂穿场效应晶体管及其制造方法, 发明专利, 2018, 第 2 作者, 专利号: CN108321197A

( 26 ) 隧穿场效应晶体管及其制造方法, 发明专利, 2018, 第 1 作者, 专利号: CN108140673A

( 27 ) N型MOSFET的制作方法, 发明专利, 2018, 第 2 作者, 专利号: CN108039368A

( 28 ) 一种半导体器件的制造方法, 发明专利, 2018, 第 1 作者, 专利号: CN108010966A

( 29 ) 半导体CMOS器件的制作方法, 发明专利, 2018, 第 2 作者, 专利号: CN107910298A

( 30 ) 半导体器件的制造方法, 发明专利, 2018, 第 3 作者, 专利号: CN107845605A

( 31 ) P型MOSFET的制作方法, 发明专利, 2018, 第 2 作者, 专利号: CN107749398A

( 32 ) 半导体器件制造方法, 发明专利, 2017, 第 1 作者, 专利号: CN106558481A

( 33 ) 半导体器件制造方法, 发明专利, 2017, 第 1 作者, 专利号: CN106558481A

( 34 ) 一种半导体器件的制造方法, 发明专利, 2016, 第 1 作者, 专利号: CN103594370B

( 35 ) CMOS器件及其制造方法, 发明专利, 2016, 专利号: CN105428361A

( 36 ) n型半导体器件及其制造方法, 发明专利, 2015, 第 1 作者, 专利号: CN102856377B

( 37 ) 一种半导体器件的制造方法, 发明专利, 2015, 第 1 作者, 专利号: CN104979186A

( 38 ) 一种半导体器件的制造方法, 专利授权, 2015, 第 1 作者, 专利号: CN104752202A

( 39 ) 一种栅堆叠及其制造方法, 发明专利, 2015, 第 1 作者, 专利号: CN104377236A

( 40 ) 半导体器件制造方法, 发明专利, 2014, 第 1 作者, 专利号: CN104078363A

( 41 ) 等平面场氧化隔离结构及其形成方法, 发明专利, 2014, 第 1 作者, 专利号: CN103855072A

( 42 ) 半导体器件的制造方法, 发明专利, 2014, 第 2 作者, 专利号: CN103855016A

( 43 ) 半导体器件的制造方法, 发明专利, 2014, 专利号: CN103854982A

( 44 ) P型MOSFET的制造方法, 发明专利, 2014, 第 2 作者, 专利号: CN103855007A

( 45 ) N型MOSFET的制造方法, 发明专利, 2014, 第 3 作者, 专利号: CN103855013A

( 46 ) N型MOSFET的制造方法, 发明专利, 2014, 第 2 作者, 专利号: CN103855012A

( 47 ) P型MOSFET的制造方法, 发明专利, 2014, 第 4 作者, 专利号: CN103854983A

( 48 ) 半导体器件的制造方法, 发明专利, 2014, 第 3 作者, 专利号: CN103855006A

( 49 ) 形成半导体器件替代栅的方法以及制造半导体器件的方法, 发明专利, 2014, 第 1 作者, 专利号: CN103854980A

( 50 ) 一种提高电子束曝光效率的方法, 发明专利, 2014, 第 2 作者, 专利号: CN102466966B

( 51 ) 超陡倒掺杂沟道的形成方法、半导体器件及其制造方法, 发明专利, 2013, 第 4 作者, 专利号: CN103367128A

( 52 ) CMOS器件及其制造方法, 发明专利, 2013, 第 3 作者, 专利号: CN103325787A

( 53 ) 一种分子尺度界面SiO 2 的形成和控制方法, 发明专利, 2013, 第 2 作者, 专利号: CN103137460A

( 54 ) 一种分子尺度界面SiO 2 的形成和控制方法, 发明专利, 2013, 第 2 作者, 专利号: CN103137460A

( 55 ) 一种半导体结构及其制造方法, 发明专利, 2013, 第 3 作者, 专利号: CN103107091A

( 56 ) 一种互补型金属氧化物半导体场效应晶体管的制备方法, 发明专利, 2013, 第 3 作者, 专利号: CN102915917A

( 57 ) 一种半导体器件的替代栅集成方法, 发明专利, 2013, 第 1 作者, 专利号: CN102856180A

( 58 ) n型半导体器件及其制造方法, 发明专利, 2013, 第 1 作者, 专利号: CN102856377A

( 59 ) 半导体器件的制造方法, 发明专利, 2012, 第 3 作者, 专利号: CN101958278B

( 60 ) 一种高k栅介质界面优化方法, 发明专利, 2012, 第 1 作者, 专利号: CN102810468A

( 61 ) 一种隧穿场效应晶体管及其制造方法, 发明专利, 2012, 第 1 作者, 专利号: CN102751325A

( 62 ) 锗衬底上制备金属-氧化物-半导体场效应晶体管方法, 发明专利, 2012, 第 2 作者, 专利号: CN102737999A

( 63 ) 半导体器件的制造方法, 发明专利, 2012, 第 3 作者, 专利号: CN102543838A

( 64 ) 一种栅极刻蚀的方法, 发明专利, 2012, 第 1 作者, 专利号: CN102456569A

( 65 ) p型半导体器件及其制造方法, 发明专利, 2012, 第 1 作者, 专利号: CN102339858A

( 66 ) p型半导体器件及其制造方法, 发明专利, 2012, 第 1 作者, 专利号: CN102339858A

( 67 ) 一种用于CMOS器件的双金属栅双高介质的集成方法, 发明专利, 2011, 第 2 作者, 专利号: CN102280376A

( 68 ) 一种适用于NMOS器件的金属栅功函数的调节方法, 发明专利, 2011, 第 2 作者, 专利号: CN102254805A

( 69 ) 一种用于PMOS器件的金属栅功函数的调节方法, 发明专利, 2011, 第 2 作者, 专利号: CN102074469A

( 70 ) 半导体器件的制造方法, 发明专利, 2011, 第 3 作者, 专利号: CN102044494A

( 71 ) 一种钼铝氮金属栅的制备方法, 发明专利, 2010, 第 1 作者, 专利号: CN101930915A

( 72 ) 一种双金属栅功函数的调节方法, 发明专利, 2010, 第 2 作者, 专利号: CN101800196A

( 73 ) 一种铪硅铝氧氮高介电常数栅介质的制备方法, 发明专利, 2010, 第 1 作者, 专利号: CN101800178A

( 74 ) 一种钽铝氮金属栅的制备方法, 发明专利, 2010, 第 1 作者, 专利号: CN101800173A

( 75 ) 一种隧穿场效应晶体管及其制造方法, 发明专利, 2010, 第 1 作者, 专利号: CN101777580A

( 76 ) 一种栅介质/金属栅集成结构的制备方法, 发明专利, 2010, 第 2 作者, 专利号: CN101728257A

( 77 ) 一种制备高介电常数栅介质薄膜铪硅氧氮的方法, 发明专利, 2009, 第 1 作者, 专利号: CN101447420A

出版信息

   
发表论文
[1] Huo, Jiali, Zhang, Zhaohao, Zhang, Yadong, Zhang, Fan, Yan, Gangping, Tian, Guoliang, Xu, Haoqing, Zhan, Guohui, Xu, Gaobo, Zhang, Qingzhu, Yin, Huaxiang, Wu, Zhenhua. Stacked HZO/α-In 2 Se 3 Ferroelectric Dielectric/Semiconductor FET With Ultrahigh Speed and Large Memory Window. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2023, 第 9 作者http://dx.doi.org/10.1109/TED.2023.3269403.
[2] 张兆浩, 田国良, 霍嘉丽, 章帆, 张青竹, 许高博, 吴振华, 成岩, 刘艳, 殷华湘. Recent progress of hafnium oxide-based ferroelectric devices for advanced circuit applications. 中国科学 信息科学(英文版)[J]. 2023, 第 6 作者66(9): 200405, 
[3] Zhang, Yongkui, Li, Yangyang, Zhu, Huilong, Wang, Qi, Du, Yong, Lu, Shunshun, Li, Junjie, Kong, Zhenzhen, He, Xiaobin, Liu, Jinbiao, Li, Chen, Huang, Weixing, Xie, Lu, Xiao, Zhongrui, Xu, Gaobo, Wang, Guilei, Zhao, Chao, Luo, Jun. First Demonstration of Vertical Sandwich GAA TFETs with Self-Aligned High-k Metal Gates and Abrupt Doping Tunneling Junctions. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY[J]. 2023, 第 15 作者12(7): http://dx.doi.org/10.1149/2162-8777/ace8bb.
[4] Wu, Kewei, Jia, Xuewei, Yang, Tao, Li, Mengzhao, Wang, Wei, Zhao, Mei, Liang, Zhijun, da Costa, Joao Guimaraes, Fan, Yunyun, Cui, Han, Howard, Alissa, Kramberger, Gregor, Shi, Xin, Heng, Yuekun, Tan, Yuhang, Liu, Bo, Feng, Yuan, Li, Shuqi, Li, Mengran, Yu, Chengjun, Yang, Xuan, Zhai, Mingjie, Xu, Gaobo, Yan, Gangping, Zhai, Qionghua, Ding, Mingzheng, Luo, Jun, Yin, Huaxiang, Li, Junfeng. Design and testing of LGAD sensor with shallow carbon implantation. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT[J]. 2023, 第 23 作者1046: http://dx.doi.org/10.1016/j.nima.2022.167697.
[5] Huo, Jiali, Zhang, Zhaohao, Zhang, Yadong, Zhang, Fan, Yan, Gangping, Tian, Guoliang, Xu, Haoqing, Zhan, Guohui, Xu, Gaobo, Zhang, Qingzhu, Yin, Huaxiang, Wu, Zhenhua. Stacked HZO/alpha-In2Se3 Ferroelectric Dielectric/Semiconductor FET With Ultrahigh Speed and Large Memory Window. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2023, 第 9 作者http://dx.doi.org/10.1109/TED.2023.3269403.
[6] Tian, Guoliang, Chen, Jia, Yan, Gangping, Li, Lianlian, Song, Zhiyu, Yang, Shangbo, Zhang, Zhaohao, Xu, Gaobo, Yin, Huaxiang, Yang, Shuai, Luo, Yanna, Bi, Jinshun, Wu, Zhenhua, Wang, Guilei, Zhao, Chao, Luo, Jun, Wang, Wenwu. Highly Reliable Logic-in-Memory by Bidirectional Built-in Electric- Field-Modulated Multistate IGZO/AFE Nonvolatile Memory. ACS APPLIED ELECTRONIC MATERIALS. 2023, 第 8 作者  通讯作者  http://dx.doi.org/10.1021/acsaelm.2c01542.
[7] Zhang, Zhaohao, Mao, Shujuan, Xu, Gaobo, Zhang, Qingzhu, Wu, Zhenhua, Yin, Huaxiang, Ye, Tianchun. An Ultra-Dense One-Transistor Ternary-Content-Addressable Memory Array Based on Non-Volatile and Ambipolar Fin Field-Effect Transistors. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2023, 第 3 作者70(3): 1029-1033, http://dx.doi.org/10.1109/TED.2023.3239330.
[8] Zhang, Zhaohao, Zhang, Fan, Zhang, Yadong, Xu, Gaobo, Wu, Zhenhua, Zhang, Qingzhu, Li, Yongliang, Yin, Huaxiang, Luo, Jun, Wang, Wenwu, Ye, Tianchun. Ultradense One-Memristor Ternary-Content-Addressable Memory Based on Ferroelectric Diodes. IEEE ELECTRON DEVICE LETTERS[J]. 2023, 第 4 作者44(1): 64-67, http://dx.doi.org/10.1109/LED.2022.3223335.
[9] Huo, Jiali, Zhang, Zhaohao, Zhang, Yadong, Zhang, Fan, Yan, Gangping, Tian, Guoliang, Xu, Haoqing, Zhan, Guohui, Xu, Gaobo, Zhang, Qingzhu, Yin, Huaxiang, Wu, Zhenhua. Stacked HZO/α-In 2 Se 3 Ferroelectric Dielectric/Semiconductor FET With Ultrahigh Speed and Large Memory Window. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2023, 第 9 作者http://dx.doi.org/10.1109/TED.2023.3269403.
[10] Tao Yang, Kewei Wu, Mei Zhao, Xuewei Jia, Yuhang Tan, Suyu Xiao, Kai Liu, Xiyuan Zhang, Congcong Wang, Mengzhao Li, Yunyun Fan, Shuqi Li, Chengjun Yu, Han Cui, Hao Zeng, Mingjie Zhai, Shuiting Xin, Maoqiang Jing, Gangping Yan, Qionghua Zhai, Mingzheng Ding, Gaobo Xu, Huaxiang Yin, Gregor Kramberger, Zhijun Liang, Joo Guimares da Costa, Xin Shi. Leakage current simulations of Low Gain Avalanche Diode with improved Radiation Damage Modeling. NUCLEAR INST. AND METHODS IN PHYSICS RESEARCH, A. 2022, 第 22 作者1040: http://dx.doi.org/10.1016/j.nima.2022.167111.
[11] Zhao, Mei, Jia, Xuewei, Wu, Kewei, Yang, Tao, Li, Mengzhao, Fan, Yunyun, Yan, Gangping, Wang, Wei, Li, Mengran, Xu, Gaobo, Ding, Mingzheng, Yin, Huaxiang, Luo, Jun, Li, Junfeng, Shi, Xin, Liang, Zhijun, da Costa, Joao Guimaraes. Low Gain Avalanche Detectors with good time resolution developed by IHEP and IME for ATLAS HGTD project. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT[J]. 2022, 第 10 作者1033: http://dx.doi.org/10.1016/j.nima.2022.166604.
[12] Gu, Jie, Zhang, Qingzhu, Wu, Zhenhua, Luo, Yanna, Cao, Lei, Cai, Yuwei, Yao, Jiaxin, Zhang, Zhaohao, Xu, Gaobo, Yin, Huaxiang, Luo, Jun, Wang, Wenwu. Narrow Sub-Fin Technique for Suppressing Parasitic-Channel Effect in Stacked Nanosheet Transistors. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY[J]. 2022, 第 9 作者10: 35-39, http://dx.doi.org/10.1109/JEDS.2021.3130123.
[13] Tian, Guoliang, Xu, Gaobo, Yin, Huaxiang, Yan, Gangping, Zhang, Zhaohao, Li, Lianlian, Sun, Xiaoting, Chen, Jia, Zhang, Yadong, Bi, Jinshun, Xiang, Jinjuan, Liu, Jinbiao, Wu, Zhenhua, Luo, Jun, Wang, Wenwu. Improved Ferroelectricity and Endurance of Hf0.5Zr0.5O2 Thin Films in Low Thermal Budget with Novel Bottom Electrode Doping Technology. ADVANCED MATERIALS INTERFACES[J]. 2022, 第 2 作者  通讯作者  9(24): 
[14] Xu, Renren, Yao, Jiaxin, Xu, Gaobo, Wei, Yanzhao, Yin, Huaxiang, Zhang, Qingzhu, Tian, Guoliang, Wang, Yanrong, Yan, Gangping, Xiang, Jinjuan, Bu, Weihai, Wu, Yongqin, Wu, Zhenhua, Luo, Jun, Wang, Wenwu. Experimental Investigation of Ultrathin Al2O3 Ex-Situ Interfacial Doping Strategy on Laminated HKMG Stacks via ALD. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2022, 第 3 作者69(4): 1964-1971, http://dx.doi.org/10.1109/TED.2022.3152976.
[15] Li, Hongbo, Zhang, Chenchen, Xu, Gaobo, Ding, Xuefeng, Ni, Yue, Chen, Guidong, Chen, Dapeng, Zhou, Na, Mao, Haiyang. A Thermopile Infrared Sensor Array Pixel Monolithically Integrated with an NMOS Switch. MICROMACHINES[J]. 2022, 第 3 作者13(2): http://dx.doi.org/10.3390/mi13020258.
[16] Yan, Gangping, Yang, Hong, Liu, Weibing, Zhou, Na, Hu, Yanpeng, Shi, Yunfei, 高建峰, Tian, Guoliang, Zhang, Yadong, Fan, Linjie, Wang, Guilei, Xu, Gaobo, Bi, Jinshun, Yin, Huaxiang, Zhao, Chao, Luo, Jun. Mechanism Analysis of Ultralow Leakage and Abnormal Instability in InGaZnO Thin-Film Transistor Toward DRAM. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2022, 第 12 作者  通讯作者  69(5): 2417-2422, http://dx.doi.org/10.1109/TED.2022.3159266.
[17] Xu, Qiuxia, Chen, Kai, Xu, Gaobo, Xiang, Jinjuan, 高建峰, Wang, Xiaolei, Li, Junjie, He, Xiaobin, Li, Junfeng, Wang, Wenwu, Chen, Dapeng. Physical Thickness 1.5-nm HfZrO Negative Capacitance NMOSFETs. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2021, 第 3 作者68(7): 3696-3701, 
[18] Gu, Jie, Wu, Zhenhua, Zhang, Qinzhu, Yao, Jiaxin, Zhang, Zhaohao, Li, Junjie, Cai, Yuwei, Xu, Renren, Xu, Gaobo, Yin, Huaxiang, Li, Junfeng, Wang, Wenwu, Ye, Tianchun. Quantum Dot With a Diamond-Shaped Channel MOSFET on a Bulk Si Substrate. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2021, 第 9 作者68(1): 405-410, https://www.webofscience.com/wos/woscc/full-record/WOS:000602689000026.
[19] Zhang, Qingzhu, Gu, Jie, Xu, Renren, Cao, Lei, Li, Junjie, Wu, Zhenhua, Wang, Guilei, Yao, Jiaxin, Zhang, Zhaohao, Xiang, Jinjuan, He, Xiaobin, Kong, Zhenzhen, Yang, Hong, Tian, Jiajia, Xu, Gaobo, Mao, Shujuan, Radamson, Henry H, Yin, Huaxiang, Luo, Jun. Optimization of Structure and Electrical Characteristics for Four-Layer Vertically-Stacked Horizontal Gate-All-Around Si Nanosheets Devices. NANOMATERIALS[J]. 2021, 第 15 作者11(3): https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7998492/.
[20] Cai, Yuwei, Zhang, Qinzhu, Zhang, Zhaohao, Xu, Gaobo, Luo, Yanna, Gu, Jie, Gan, Weizhuo, Lin, Xiang, Xu, Renren, Wu, Zhenhua, Yin, Huaxiang, Wang, Wenwu, Xu, Qiuxia, Ye, Tianchun. Endurance Characteristics of Negative Capacitance FinFETs With Negligible Hysteresis. IEEE ELECTRON DEVICE LETTERS[J]. 2021, 第 4 作者42(2): 260-263, https://www.webofscience.com/wos/woscc/full-record/WOS:000613404400032.
[21] Zhang, Qingzhu, Tu, Hailing, Zhang, Zhaohao, Li, Junjie, Wei, Feng, Wang, Guilei, Han, Jiaohao, Zhao, Hongbin, Zhang, Yongkui, Li, Yongliang, Wu, Zhenhua, Gu, Jie, Xu, Renren, Bai, Guibin, Xu, Gaobo, Wei, Qianhui, Fan, Yanyan, Yan, Jiang, Li, Bo, Xu, Qiuxia, Yin, Huaxiang, Wang, Wenwu. Optimization of zero-level interlayer dielectric materials for gate-all-around silicon nanowire channel fabrication in a replacement metal gate process. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING[J]. 2021, 第 15 作者121: http://dx.doi.org/10.1016/j.mssp.2020.105434.
[22] Huang, Weixing, Zhu, Huilong, Zhang, Yongkui, Li, Junjie, Ai, Xuezheng, Yin, Xiaogen, Li, Chen, Li, Yangyang, Li, Xinhao, Jia, Kunpeng, Xiang, Jinjuan, Xu, Gaobo. Investigation of ferroelectric field-effect transistors using a replacement metal gate process. SEMICONDUCTOR SCIENCE AND TECHNOLOGY[J]. 2021, 第 12 作者36(3): http://dx.doi.org/10.1088/1361-6641/abcee3.
[23] Cai, Yuwei, Zhang, Qingzhu, Zhang, Zhaohao, Xu, Gaobo, Wu, Zhenhua, Gu, Jie, Li, Junjie, Xiang, Jinjuan, Yin, Huaxiang. Influence of Applied Stress on the Ferroelectricity of Thin Zr-Doped HfO2 Films. APPLIED SCIENCES-BASEL[J]. 2021, 第 4 作者11(9): http://dx.doi.org/10.3390/app11094295.
[24] Cai, Yuwei, Zhang, Zhaohao, Zhang, Qingzhu, Xiang, Jinjuan, Xu, Gaobo, Wu, Zhenhua, Gu, Jie, Yin, Huaxiang. Investigation of time domain characteristics of negative capacitance FinFET by pulse-train approaches. JOURNALOFSEMICONDUCTORS[J]. 2021, 第 5 作者42(11): 
[25] Gu, Jie, Zhang, Qingzhu, Wu, Zhenhua, Yao, Jiaxin, Zhang, Zhaohao, Zhu, Xiaohui, Wang, Guilei, Li, Junjie, Zhang, Yongkui, Cai, Yuwei, Xu, Renren, Xu, Gaobo, Xu, Qiuxia, Yin, Huaxiang, Luo, Jun, Wang, Wenwu, Ye, Tianchun. Cryogenic Transport Characteristics of P-Type Gate-All-Around Silicon Nanowire MOSFETs. NANOMATERIALS[J]. 2021, 第 12 作者11(2): https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7911106/.
[26] Yan, Gangping, Xi, Kai, Xu, Gaobo, Bi, Jinshun, Yin, Huaxiang. Analysis of Single Event Effects in Capacitor-Less 1T-DRAM Based on an InGaAs Transistor. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2021, 第 3 作者  通讯作者  68(4): 1604-1609, http://dx.doi.org/10.1109/TED.2021.3057791.
[27] Li, Hongbo, Xu, Gaobo, Zhang, Chenchen, Mao, Haiyang, Zhou, Na, Chen, Dapeng. A Sensitivity Controllable Thermopile Infrared Sensor by Monolithic Integration of a N-channel Metal Oxide Semiconductor. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY[J]. 2021, 第 2 作者10(9): http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000701305300001.
[28] Zhang, Yongkui, Ai, Xuezheng, Yin, Xiaogen, Zhu, Huilong, Yang, H, Wang, G L, Li, J J, Du, A Y, Li, C, Huang, W X, Xie, L, Li, Y Y, Liu, Y B, Zhang, Y B, Jia, K P, Wu, Z H, Ma, X L, Zhang, Q Z, Mao, S J, Xu, G B, Xiang, J J, Gao, J F, He, X B, Lu, Y H, Bai, G B, Zhao, J, Li, Y L, Yang, T, Li, J F, Yin, H X, Radamson, H, Luo, J, Zhao, C, Wang, W W, Ye, T C. Vertical Sandwich GAA FETs With Self-Aligned High-k Metal Gate Made by Quasi Atomic Layer Etching Process. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2021, 68(6): 2604-2610, http://dx.doi.org/10.1109/TED.2021.3072879.
[29] Tian, Guoliang, Bi, Jinshun, Xu, Gaobo, Xi, Kai, Yang, Xueqin, Yin, Huaxiang, Xu, Qiuxia, Wang, Wenwu. Heavy ion induced single-event-transient effects in nanoscale ferroelectric vertical tunneling transistors by TCAD simulation. SEMICONDUCTOR SCIENCE AND TECHNOLOGY[J]. 2020, 第 3 作者  通讯作者  35(10): https://www.webofscience.com/wos/woscc/full-record/WOS:000568340700001.
[30] Tian, Guoliang, Bi, Jinshun, Xu, Gaobo, Xi, Kai, Yang, Xueqin, Sandip, Majumdar, Yin, Huaxiang, Xu, Qiuxia, Wang, Wenwu. Single-event-transient effects in silicon-on-insulator ferroelectric double-gate vertical tunneling field effect transistors. SCIENCE CHINA-INFORMATION SCIENCES[J]. 2020, 第 3 作者  通讯作者  63(12): 274-276, http://lib.cqvip.com/Qikan/Article/Detail?id=7103486735.
[31] Cheng, Weijun, Liang, Renrong, Xu, Gaobo, Yu, Guofang, Zhang, Shuqin, Yin, Huaxiang, Zhao, Chao, Ren, TianLing, Xu, Jun. Fabrication and Characterization of a Novel Si Line Tunneling TFET With High Drive Current. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY[J]. 2020, 第 3 作者  通讯作者  8(1): 336-340, https://doaj.org/article/bf9362598c5f483782496368669f36c4.
[32] Yan, Gangping, Xu, Gaobo, Bi, Jinshun, Tian, Guoliang, Xu, Qiuxia, Yin, Huaxiang, Li, Yongliang. Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET). MICROELECTRONICS RELIABILITY[J]. 2020, 第 2 作者  通讯作者  114: http://dx.doi.org/10.1016/j.microrel.2020.113855.
[33] Xi, Kai, Bi, Jinshun, Chu, Jiamin, Xu, Gaobo, Li, Bo, Wang, Haibin, Liu, Ming, Sandip, Majumdar. Total ionization dose effects of N-type tunnel field effect transistor (TFET) with ultra-shallow pocket junction. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING[J]. 2020, 第 4 作者  通讯作者  126(6): https://www.webofscience.com/wos/woscc/full-record/WOS:000537110800004.
[34] 刘瑶光, 殷华湘, 吴次南, 许高博, 翟琼华. 一种硅漂移探测器的优化设计与特性研究. 传感技术学报[J]. 2020, 第 4 作者33(1): 7-11, https://kns.cnki.net/KCMS/detail/detail.aspx?dbcode=CJFQ&dbname=CJFDLAST2020&filename=CGJS202001002&v=MTk1Mjg3RGgxVDNxVHJXTTFGckNVUjdxZVorUnZGaW5tVmJ6SkppckJmYkc0SE5ITXJvOUZab1I4ZVgxTHV4WVM=.
[35] Yan, Gangping, Bi, Jinshun, Xu, Gaobo, Xi, Kai, Li, Bo, Fan, Linjie, Yin, Huaxiang. Simulation of Total Ionizing Dose (TID) Effects Mitigation Technique for 22 nm Fully-Depleted Silicon-on-Insulator (FDSOI) Transistor. IEEE ACCESS[J]. 2020, 第 3 作者  通讯作者  8: 154898-154905, https://doaj.org/article/f266e2bf5666490ca2a2e5862545176e.
[36] 李治昊, 夏志良, 许高博, 周文犀, 霍宗亮. 3D NAND中基于SEG高度失效模型的DPPM预测算法. 电子产品可靠性与环境试验[J]. 2020, 第 3 作者38(6): 58-61, http://lib.cqvip.com/Qikan/Article/Detail?id=7103670406.
[37] Tian, GuoLiang, Bi, JinShun, Xu, GaoBo, Xi, Kai, Xu, YanNan, Yang, XueQin, Yin, HuaXiang, Xu, QiuXia, Li, YongLiang. Hf0.5Zr0.5O2-based ferroelectric bionic electronic synapse device with highly symmetrical and linearity weight modification. ELECTRONICSLETTERS[J]. 2020, 第 3 作者56(16): 840-842, https://www.webofscience.com/wos/woscc/full-record/WOS:000560412900019.
[38] Cheng, Xiaohong, Li, Yongliang, Wang, Guilei, Liu, Haoyan, Zan, Ying, Lin, Hongxiao, Kong, Zhenzhen, Zhong, Zhaoyang, Li, Yan, Wang, Hanxiang, Xu, Gaobo, Ma, Xueli, Wang, Xiaolei, Yang, Hong, Luo, Jun, Wang, Wenwu. Investigation on thermal stability of Si0.7Ge0.3/Si stacked multilayer for gate-all-around MOSFETS. SEMICONDUCTOR SCIENCE AND TECHNOLOGY[J]. 2020, 第 11 作者35(11): https://www.webofscience.com/wos/woscc/full-record/WOS:000575362500001.
[39] Zhao, Zhiqian, Cheng, Xiaohong, Li, Yongliang, Zan, Ying, Liu, Haoyan, Wang, Guilei, Du, Anyan, Li, Junjie, Zhang, Qingzhu, Xu, Gaobo, Ma, Xueli, Wang, Xiaolei, Yang, Hong, Xu, Jing, Luo, Jun, Li, JunFeng, Yin, Huaxiang, Wang, Wenwu. Investigation on the formation technique of SiGe Fin for the high mobility channel FinFET device. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 第 10 作者31(8): 5854-5860, https://www.webofscience.com/wos/woscc/full-record/WOS:000499978000002.
[40] Zhao, Zhiqian, Li, Yongliang, Wang, Guilei, Du, Anyan, Gu, Shihai, Li, Yan, Zhang, Qingzhu, Xu, Gaobo, Ma, Xueli, Wang, Xiaolei, Yang, Hong, Luo, Jun, Li, JunFeng, Yin, Huaxiang, Wang, Wenwu. A novel three-layer graded SiGe strain relaxed buffer for the high crystal quality and strained Si0.5Ge0.5 layer epitaxial grown. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 第 8 作者30(15): 14130-14135, https://www.webofscience.com/wos/woscc/full-record/WOS:000478863500030.
[41] Xu Gaobo, Yin Huaxiang, Xu Qiuxia, Tao Guilong, Wu Zhenhua, Bo Jianhui, Bi Jinshun, Li Yongliang, Zhou Huajie, Shang Haiping, Liu Jinbiao, Li Junjie, Xiong Wenjuan, Li Junfeng, Zhu Huilong, Zhao Chao, Wang Wenwu, Claeys C, Huang R, Wu H, Lin Q, Liang S, Song P, Guo Z, Lai K, Zhang Y, Qu X, Lung HL, Yu W. A High-Performance Source-Pocket Tunnel Field-Effect Transistor. 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC). 2019, 第 1 作者http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000490874500022.
[42] Zhao, Zhiqian, Li, Yongliang, Gu, Shihai, Zhang, Qingzhu, Wang, Guilei, Li, Junjie, Li, Yan, Xu, Gaobo, Ma, Xueli, Wang, Xiaolei, Yang, Hong, Lu, Jun, Li, JunFeng, Yin, Huaxiang, Wang, Wenwu. High crystal quality strained Si0.5Ge0.5 layer with a thickness of up to 50 nm grown on the three-layer SiGe strain relaxed buffer. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING[J]. 2019, 第 8 作者99: 159-164, http://dx.doi.org/10.1016/j.mssp.2019.04.033.
[43] 王健健, 白华, 许高博, 李梅, 毕津顺. Hf0.5Zr0.5O2基铁电电容器的特性研究. 微电子学[J]. 2019, 第 3 作者418-421,426, http://lib.cqvip.com/Qikan/Article/Detail?id=77737873504849574851485051.
[44] Zhao, Zhiqian, Li, Yongliang, Wang, Guilei, Du, Anyan, Li, Yan, Zhang, Qingzhu, Xu, Gaobo, Zhang, Yongkui, Luo, Jun, Li, JunFeng, Wang, Wenwu. Process optimization of the Si0.7Ge0.3 Fin Formation for the STI first scheme. SEMICONDUCTOR SCIENCE AND TECHNOLOGY[J]. 2019, 第 7 作者34(12): https://www.webofscience.com/wos/woscc/full-record/WOS:000494668200001.
[45] Cao, Shurui, Ke, Xiaoyu, Ming, Siting, Wang, Duowei, Li, Tong, Liu, Bingyan, Ma, Yao, Li, Yun, Yang, Zhimei, Gong, Min, Huang, Mingmin, Bi, Jinshun, Xu, Yannan, Xi, Kai, Xu, Gaobo, Majumdar, Sandip. Study of -ray radiation influence on SiO2/HfO2/Al2O3/HfO2/Al2O3 memory capacitor by C-V and DLTS. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 第 15 作者30(12): 11079-11085, https://www.webofscience.com/wos/woscc/full-record/WOS:000472079200014.
[46] Zhang, Zhaohao, Xu, Gaobo, Zhang, Qingzhu, Hou, Zhaozhao, Li, Junjie, Kong, Zhenzhen, Zhang, Yongkui, Xiang, Jinjuan, Xu, Qiuxia, Wu, Zhenhua, Zhu, Huilong, Yin, Huaxiang, Wang, Wenwu, Ye, Tianchun. FinFET With Improved Subthreshold Swing and Drain Current Using 3-nm Ferroelectric Hf0.5Zr0.5O2. IEEE ELECTRON DEVICE LETTERS[J]. 2019, 第 2 作者40(3): 367-370, 
[47] 卜建辉, 许高博, 李多力, 蔡小五, 王林飞, 韩郑生, 罗家俊. 一种新型隧穿场效应晶体管. 半导体技术[J]. 2019, 第 2 作者44(3): 185-188, http://lib.cqvip.com/Qikan/Article/Detail?id=7001643479.
[48] Chang, YaoFeng, Fowler, Burt, Chen, YingChen, Lin, ChihYang, Xu, Gaobo, Huang, HuiChun, Chen, Jia, Kim, Sungjun, Li, Yi, Lee, Jack C. Beyond SiOx: an active electronics resurgence and biomimetic reactive oxygen species production and regulation from mitochondria. JOURNAL OF MATERIALS CHEMISTRY C[J]. 2018, 第 5 作者6(47): 12788-12799, https://www.webofscience.com/wos/woscc/full-record/WOS:000452777500003.
[49] Yun Li, Yao Ma, Wei Lin, Peng Dong, Zhimei Yang, Min Gong, Jinshun Bi, Bo Li, Kai Xi, Gaobo Xu. Study of γ-ray irradiation influence on TiN/HfO2/Si MOS capacitor by C-V and DLTS. SUPERLATTICES AND MICROSTRUCTURES. 2018, 第 10 作者120: 313-318, http://dx.doi.org/10.1016/j.spmi.2018.05.046.
[50] Li, Yun, Ma, Yao, Lin, Wei, Dong, Peng, Yang, Zhimei, Gong, Min, Bi, Jinshun, Li, Bo, Xi, Kai, Xu, Gaobo. Study of gamma-ray irradiation influence on TiN/HfO2/Si MOS capacitor by C-V and DLTS. SUPERLATTICES AND MICROSTRUCTURES[J]. 2018, 第 10 作者120: 313-318, 
[51] YanNanXu, JinShunBi, GaoBoXu, BoLi, KaiXi, MingLiu, HaiBinWang, LiLuo. Total Ionization Dose Effects on Charge Storage Capability of Al$_{2}$O$_{3}$/HfO$_{2}$/Al$_{2}$O$_{3}$-Based Charge Trapping Memory Cell. Chinese Physics Letters[J]. 2018, 第 3 作者35(11): 118501-89, https://cpl.iphy.ac.cn/10.1088/0256-307X/35/11/118501.
[52] Xu, Qiuxia, Zou, Wei, Xu, Gaobo, Tang, Shan, Tao, Guilong, Salimian, Siamak, Liu, Jinbiao, Liang, Qingqing, Wang, Yao, Xiang, Jinjuan, Wang, Xiaolei, Zhu, Huilong, Li, Junfeng, Zhao, Chao, Raj, Deven, Maynard, Helen, Chen, Dapeng, Ye, Tianchun. Band-Edge Work Function Obtained by Plasma Doping TiN Metal Gate for nMOS Device Application. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2018, 第 3 作者65(6): 2400-2405, https://www.webofscience.com/wos/woscc/full-record/WOS:000432462200052.
[53] Chen, YingChen, Lin, ChihYang, Huang, HuiChun, Kim, Sungjun, Fowler, Burt, Chang, YaoFeng, Wu, Xiaohan, Xu, Gaobo, Chang, TingChang, Lee, Jack C. Internal filament modulation in low-dielectric gap design for built-in selector-less resistive switching memory application. JOURNAL OF PHYSICS D-APPLIED PHYSICS[J]. 2018, 第 8 作者51(5): https://www.webofscience.com/wos/woscc/full-record/WOS:000422866400001.
[54] 陶桂龙, 许高博, 殷华湘, 徐秋霞. 隧穿场效应晶体管的研究进展. 微纳电子技术[J]. 2018, 第 2 作者55(10): 707-718, http://lib.cqvip.com/Qikan/Article/Detail?id=676336906.
[55] Yannan XU, Jinshun BI, Gaobo XU, Kai XI, Bo LI, Ming LIU. Total ionizing dose effects and annealing behaviors of HfO_2-based MOS capacitor. 中国科学:信息科学(英文版)[J]. 2017, 第 3 作者60(12): 120401-1, http://lib.cqvip.com/Qikan/Article/Detail?id=673840354.
[56] 陶桂龙, 许高博, 徐秋霞. Silicon-Based Ⅲ-Ⅴ Nanowires and Several Semiconductor Devices. 半导体技术[J]. 2017, 第 2 作者42(6): 411-420, 
[57] Xu, Yannan, Bi, Jinshun, Xu, Gaobo, Xi, Kai, Li, Bo, Liu, Ming. Total ionizing dose effects and annealing behaviors of HfO2-based MOS capacitor. SCIENCE CHINA-INFORMATION SCIENCES. 2017, 第 3 作者60(12): http://lib.cqvip.com/Qikan/Article/Detail?id=673840354.
[58] Xu, Qiuxia, Xu, G, Zhou, H, Zhu, H, Liu, J, Wang, Y, Li, J, Xiang, J, Liang, Q, Wu, H, Zhong, J, Xu, M, Xu, W, Ma, X, Wang, X, Tong, X, Chen, D, Yan, J, Zhao, C, Ye, T. Attainment of dual-band edge work function by using a single metal gate and single high-k dielectric via ion implantation for HP CMOS device. SOLID-STATE ELECTRONICS[J]. 2016, 115: 26-32, http://dx.doi.org/10.1016/j.sse.2015.09.019.
[59] Zhang Qingzhu, Yin Huaxiang, Luo Jun, Yang Hong, Meng Lingkuan, Li Yudong, Wu Zhenhua, Zhang Yanbo, Zhang Yongkui, Qin Zhangliang, Li Junjie, Gao Jianfeng, Wang Guilei, Xiong Wenjuan, Xiang Jinjuan, Zhou Zhangyu, Mao Shujuan, Xu Gaobo, Liu Jinbiao, Yang Tao. FOI FinFET with Ultra-low Parasitic Resistance Enabled by Fully Metallic Source and Drain Formation on Isolated Bulk-Fin. 2016 IEEE International Electron Devices Meeting: IEDM 2016, San Francisco, California, USA, 3-7 December 2016, pages 452-929, v.2. 2016, 第 18 作者452-455, http://159.226.55.106/handle/172511/16336.
[60] Xu, Qiuxia, Xu, Gaobo, Zhou, Huajie, Zhu, Huilong, Liang, Qingqing, Liu, Jinbiao, Li, Junfeng, Xiang, Jinjuan, Xu, Miao, Zhong, Jian, Xu, Weijia, Zhao, Chao, Chen, Dapeng, Ye, Tianchun. Ion-Implanted TiN Metal Gate With Dual Band-Edge Work Function and Excellent Reliability for Advanced CMOS Device Applications. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2015, 第 2 作者62(12): 4193-4199, http://www.irgrid.ac.cn/handle/1471x/1091082.
[61] Xu Gaobo, Xu Qiuxia, Yin Huaxiang, Wang Dahai, Li Junfeng, Zhao Chao, Zhou Huajie, Wang Guilei, Li Chunlong, Liu Jinbiao, Li Junjie, Xiong Wenjuan. Study of Si Green Transistor with an Ultra-shallow Pocket Junction. 2014, 第 1 作者85/5, http://www.irgrid.ac.cn/handle/1471x/1091121.
[62] Xu, Qiuxia, Xu, Gaobo, Li, Yongliang, Zhou, Huajie, Li, Junfeng, Niu, Jiebin, Ding, Mingzheng, Chen, Dapeng, Ye, Tianchun. Investigation of Key Technologies for Poly-Si/TaN/HfLaON/IL SiO2 Gate-Stacks in Advanced Device Applications. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2014, 第 2 作者61(4): 991-997, http://www.irgrid.ac.cn/handle/1471x/1091024.
[63] XuGaoBo, XuQiuXia, YinHuaXiang, ZhouHuaJie, YangTao, NiuJieBin, YuJiaHan, LiJunFeng, ZhaoChao. A high performance HfSiON/TaN NMOSFET fabricated using a gate-last process. Chinese Physics B[J]. 2013, 第 1 作者  通讯作者  22(11): 117309-117309, https://cpb.iphy.ac.cn/EN/10.1088/1674-1056/22/11/117309.
[64] Wang Guilei, Xu Qiang, Yang Tao, Luo Jun, Xiang Jinjuan, Xu Jing, Xu Gaobo, Li Chunlong, Li Junfeng, Yan Jiang, Zhao Chao, Chen Dapeng, Ye Tianchun, Roozeboom F, Delabie A, Londergan A, DeGendt S, Elam JW, VanDerStraten O. Application of Atomic Layer Deposition Tungsten (ALD W) as Gate Filling Metal for 22 nm and Beyond Nodes CMOS Technology. ATOMIC LAYER DEPOSITION APPLICATIONS 9. 2013, 第 7 作者58(10): 317-324, 
[65] Xu Gaobo, Xu Qiuxia, Yin Huaxiang. Characterization of HfSiAlON/MoAlN PMOSFET Fabricated by Using a Novel Gate-Last Process. CHINESE PHYSCS LETTERS[J]. 2013, 第 1 作者http://www.irgrid.ac.cn/handle/1471x/1091001.
[66] Xu Gaobo, Xu Qiuxia, Zhou Huajie. Characteristics of HfLaON/SiO2 Gate Stack prepared using Reactive Sputtering. ECS TRANSACTIONS[J]. 2013, 第 1 作者http://www.irgrid.ac.cn/handle/1471x/1090999.
[67] Yin, Huaxiang, Meng, Lingkuan, Yang, Tao, Xu, Gaobo, Xu, Qiuxia, Zhao, Chao, Chen, Dapeng. CMP-Less Planarization Technology with SOG/LTO Etchback for Low-Cost High-k/Metal Gate-Last Integration. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY[J]. 2013, 第 4 作者2(6): P268-P270, http://www.irgrid.ac.cn/handle/1471x/1091022.
[68] XUGaoBo, XUQiuXia, YINHuaXiang, ZHOUHuaJie, YANGTao, NIUJieBin, HEXiaoBin, MENGLingKuan, YUJiaHan, LIJunFeng, YANJiang, ZHAOChao, CHENDaPeng. Characterization of HfSiAlON/MoAlN PMOSFETs Fabricated by Using a Novel Gate-Last Process. Chinese Physics Letters[J]. 2013, 第 1 作者  通讯作者  30(8): 87303-087303, https://cpl.iphy.ac.cn/10.1088/0256-307X/30/8/087303.
[69] Yang, T, Zhao, C, Xu, G B, Xu, Q X, Li, J F, Wang, W W, Yan, J, Zhu, H L, Chen, D P. HfSiON High-k Layer Compatibility Study with TetraMethyl Ammonium Hydroxide (TMAH) Solution. ELECTROCHEMICALANDSOLIDSTATELETTERS[J]. 2012, 15(5): H141-H144, https://www.webofscience.com/wos/woscc/full-record/WOS:000301656700018.
[70] Xu Gaobo. Characteristics of HfSiAlON Gate Dielectric Prepared by Physical Vapor Deposition. ECS TRANSACTIONS[J]. 2011, 第 1 作者http://10.10.10.126/handle/311049/9377.
[71] Yin Huaxiang, Men Lingkuan, Yang Tao, Xu Gaobo, Xu Qiuxia, Zhao Chao, Chen Dapeng, Wu H, Claeys C, Kuo Y, Lai K, Philipossian A, Jiang T, Xiaoping S, Lin Q, Huang D, Huang R, Zhang Y, Liu R, Song P. CMP-less Planarization Technology with SOG/LTO Etchback for Low Cost 70nm Gate-Last Process. CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011). 2011, 第 4 作者34(1): 749-754, 
[72] Xu, Qiuxia, Xu, Gaobo, Liang, Qingqing, Yao, Yuan, Duan, Xiaofeng, Li, Junfeng. Gallium-Incorporated TiN Metal Gate With Band-Edge Work Function and Excellent Thermal Stability for PMOS Device Applications. IEEE ELECTRON DEVICE LETTERS[J]. 2011, 第 2 作者32(9): 1197-1199, http://ir.iphy.ac.cn/handle/311004/38555.
[73] 许高博, 徐秋霞. Thermal stability of HfTaON films prepared by physical vapor deposition. JOURNAL OF SEMICONDUCTORS[J]. 2009, 第 1 作者  通讯作者  21-25, http://lib.cqvip.com/Qikan/Article/Detail?id=29543256.
[74] XuGaoBoXuQiuXia. Characteristics of high-quality HfSiON gate dielectric prepared by physical vapour deposition. Chinese Physics B[J]. 2009, 18(2): 768-772, https://cpb.iphy.ac.cn/EN/10.1088/1674-1056/18/2/059.
[75] Xu, Qiuxia, Xu, Gaobo, Wang, Wenwu, Chen, Dapeng, Shi, Shali, Han, Zhengsheng, Ye, Tianchun. Study on characteristics of thermally stable HfLaON gate dielectric with TaN metal gate. APPLIED PHYSICS LETTERS[J]. 2008, 第 2 作者93(25): https://www.webofscience.com/wos/woscc/full-record/WOS:000262008700039.
[76] 宋文斌, 许高博, 曾传滨, 韩郑生. 源漏硅化物扩散层分离技术对SOINMOS抗ESD的影响. 功能材料与器件学报[J]. 2008, 第 2 作者14(6): 1007-1012, http://lib.cqvip.com/Qikan/Article/Detail?id=29023096.
[77] 许高博, 徐秋霞. 先进的Hf基高k栅介质研究进展. 电子器件[J]. 2007, 第 1 作者30(4): 1194-1199, http://lib.cqvip.com/Qikan/Article/Detail?id=25100288.
[78] 宋文斌, 许高博, 郭天雷, 韩郑生. 采用LOCOS隔离的部分耗尽SOI器件的窄沟道效应. 电子器件[J]. 2007, 第 2 作者53-53, http://lib.cqvip.com/Qikan/Article/Detail?id=1000048265.

科研活动

   
科研项目

( 1 ) 低功耗隧穿场效应晶体管研究及制备, 主持, 研究所自选, 2013-01--2013-12
( 2 ) 双金属栅CMOS器件的可靠性退化机制及其抑制方法研究, 参与, 国家任务, 2014-01--2016-12
( 3 ) 离子掺杂高k栅介质/金属栅技术研究及理论分析, 主持, 研究所自选, 2015-09--2016-08
( 4 ) 碳基纳米电子器件与集成, 参与, 国家任务, 2016-07--2021-06
( 5 ) 二维小像素探测器, 子课题负责人, 国家任务, 2016-07--2021-06
( 6 ) 高迁移率二维料铟硒及其异质结构的物性、量子输运性质调控和器件应用研究, 参与, 国家任务, 2018-01--2021-12
( 7 ) FINFET器件研究及制备, 主持, 企业合作, 2018-03--2018-11
( 8 ) 超陡亚阈值摆幅低功耗新原理器件, 参与, 地方任务, 2018-08--2021-08 
( 9 ) 新型铁电材料与器件研究及制备, 主持, 企业合作, 2018-12--2019-07
( 10 ) 新型铁电存储器技术, 子课题负责人, 国家任务, 2018-01--2020-12
( 11 ) 像素探测器芯片研制, 主持, 企业合作, 2019-06--2020-05
( 12 ) 超高时间分辨探测器研制, 主持, 企业合作, 2019-11--2021-12
( 13 ) 面向自由电子激光的大阵列硅基探测器关键技术研制, 参与, 中国科学院计划, 2020-01--2022-12
( 14 ) 高密度三维IGZO DRAM存储器PVD, 主持地方任务, 2022-01--2024-12
( 15 ) 超高帧频大动态范围X射线探测系统, 参与, 国家任务, 2022-01--2026-12

( 16 ) 抗辐照硅超快传感器大规模制造关键技术概念验证, 负责人, 地方任务, 2022-12--2023-11