基本信息

张青科  男  中国科学院宁波材料技术与工程研究所,博士、副研究员、硕士生导师
电子邮件: zhangqingke@nimte.ac.cn
通信地址: 浙江省宁波市镇海区中官西路1219号
邮政编码: 315201

研究领域

基础研究:异种材料精密连接机理、金属力学性能与损伤机制

应用研究:高端合金材料、金属电子材料、表面(增材)改性

招生信息

   
招生专业
080502-材料学
080503-材料加工工程
招生方向
材料连接技术与工程
表界面化学与物理

教育背景

2007-09--2012-08   中国科学院金属研究所   博士
2003-09--2007-07   西安交通大学   学士

工作经历

2017-03~今, 中国科学院宁波材料技术与工程研究所, 副研究员(2017)
2012-08~2017-02, 郑州机械研究所, 工程师(2013)、高级工程师(2016)

出版信息

   
主要论文

(69) Jinyang Fang, Qingke Zhang*, Jing Li, Feng Liu, Chaofeng Li, Lijing Yang, Cheng Xu, Zhenlun Song. Influences of deformation defects on etching behaviors of high-strength and high-conductivity Cu alloy for lead frame. Microelectronics Reliability. 2024, 159: 115448.

(68) He Zhang, Qingke Zhang*, Zhenlun Song. Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder. Journal of Materials Science: Materials in Electronics. 2024, 35: 1185.

(67) Jinyang Fang, Qingke Zhang*, Xinli Zhang, Feng Liu*, Chaofeng Li, Lijing Yang, Cheng Xu, Zhenlun Song. Influence of Etchants on Etched Surfaces of High-Strength and High-Conductivity Cu Alloy of Different Processing States. Materials. 2024, 17(9): 1966.

(66) Q.K. Zhang*, C.W. An, Z.L. Song. Thermal cycling-electric current coupling damage mechanisms of SnAgCu/Cu solder joints under different temperature ranges. Journal of Electronic Materials. 2024, 53: 2544-2553.

(65) Qingke Zhang*, Chenwei An, Zhenlun Song. Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization. Journal of Materials Science: Materials in Electronics. 2024, 35: 306.

(64) Jinyang Fang, Chaofeng Li, Feng Liu, Huilin Hou, Xinli Zhang, Qingke Zhang*, Lijing Yang, Cheng Xu, Zhenlun Song. Effects of grain orientation and grain size on etching behaviors of high-strength and high-conductivity Cu alloy. Materials Today Communications. 2024, 38:108111.

(63) Jiazhen Huang, Jianyong Wang, Lijing Yang*, Wenwen Du, Minghua Wu, Qingke Zhang*, Zhenlun Song. Comparative study on microstructure and mechanical properties of a novel nano-composite strengthening heat-resistant steel and two typical heat-resistant steels. Materials Today Communications. 2023, 36: 106679.

(62) Shizhu Liao, Lijing Yang*, Qingke Zhang, Bizhang Zheng, Chi Yang, Jisi Zheng, Duohong Zou, Zhenlun Song. Effect of annealing on the mechanical properties and cytocompatibility of CoCrMo alloy with tantalum coating. Surface & Coatings Technology. 2023, 469: 129789.

(61) ShiZhu Liao, LiJing Yang, ZhenLun Song, ZhengYin Zhou, QingKe Zhang, Chi Yang, JiSi Zheng. Effect of nitrogen content on the mechanical and biological properties of tantalum nitride coatings. Surface & Coatings Technology. 2023, 464: 129544.

(60) Tao Chen, Qingke Zhang*, Feng Liu, Xiaolong Feng, Cheng Xu, Zhenlun SongInfluences of cold rolling and aging on microstructure and property of CuCrSn alloyMaterials2023, 16: 3780.

(59) C.W. An, Q.K. Zhang*, Z.L. Song. High temperature thermal-electrical coupling damage mechanisms of SnAgCu/Cu solder joints.  Journal of Electronic Materials2023, 52: 3807-3817.

(58) Xin Li, Qingke Zhang*, Lijing Yang, Cheng Xu, Tinghui Wang, Bizhang Zheng, Wei Pan, Zhenlun Song*. Induction brazing of NdFeB magnet with PVD-deposited AgCu alloy.  Journal of Magnetism and Magnetic Materials2023, 569: 170432.

(57) Q.K. Zhang, B.Q. Li, W.X. Li, K.Q. Sun, C. Xu, L.J. Yang, P. Cui and Z.L. Song*. Severe Elastic Modulus Shift of Deformed CoNiCrMo (MP35N) Alloy Under Relative Low Temperature Exposure.  Physical Review B2023, 107: L020102.

(56) Q.K. Zhang*, J. Yang, W.S. Sun, Z.L. Song. Evolution in microstructure and mechanical properties of Cu alloy during wire and arc additive manufacture. Journal of Central South University. 2023, 30: 100-411.

(55) T.K. Zhu, Q.K. Zhang*, H.L. Bai, L.Y. Zhao, J.K. Yan. Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation. Microelectronics Reliability, 2022, 135: 114574.

(54) F.K. Shi, Q.K. Zhang*, C. Xu, F.Q. Hu*, L.J. Yang, B.Z. Zheng, Z.L. Song. In-situ synthesis of NiCoCrMnFe high entropy alloy coating by laser cladding. Optics and Laser Technology, 2022,151: 108020.

(53) Lipeng Deng, Tao Chen, Jie Yang, Feng Liu, Qingke Zhang*, Zheshuai Zheng, Cheng Xu, Zhenlun Song. Evolutions in precipitates, microstructure and properties of cold-worked CuNiCoSi alloy during short-time solid solution. Materials Today Communications, 2022, 30: 103150.

(52) Yixuan Shi, Lijing Yang*, Qingke Zhang, Xinglong Zhu, Zhenlun Song, Huinan Liu. A novel MAO-PLA coating on zinc alloy for potential orthopedic implant material. Materials Letters. 2022, 317: 132058.

(51) Yixuan Shi, Lijing Yang*, Lucai Wang*, Qingke Zhang, Xinglong Zhu, Wensheng Sun, Jianwei Shen, Ting Lu, Zhenlun Song, Huinan Liu. Corrosion and Biocompatibility of Pure Zn with a Micro-Arc-Oxidized Layer Coated with Calcium Phosphate. Coatings. 2021, 11, 1425. 

(50) Q.K. Zhang*, X.M. Wang, Z.L. Song. Effects of thin cladding layer and annealing treatments on mechanical properties of AISI4340 steel. Engineering Fracture Mechanics, 2021, 256: 107997.

(49) T.K. Zhu, Q.K. Zhang*, H.L. Bai, L.Y. Zhao, J.K. Yan*. Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying. Materials Today Communications, 2021, 29: 102768.

(48) J. Yang, Q.K. Zhang*, Z.L. Song. Influences of Ag and In alloying on microstructure and mechanical properties of Sn-58Bi solder. Journal of Electronic Materials, 2021, 50: 283-290.

(47)  Y.X. Zhu, J.J. Jiang, L.J. Yang, C. Xu, Q.K. Zhang, X.L. Zhu, X. Li , J. Jin*, Q. Zhou, Z.L. Song*. Study of Ag-Sb coatings prepared by non-cyanide electrodeposition. Surface & Coatings Technology, 2021, 421: 127415.

(46) P.S. Guo, X.L. Zhu, L.J. Yang, L. Deng, Q.K. Zhang, B.Q. Li, K. Cho, W.S. Sun, T.T. Ren, Z.L. Song. Ultrafine- and uniform-grained biodegradable Zn-0.5Mn alloy: Grain refinement mechanism, corrosion behavior, and biocompatibility in vivo. Materials Science & Engineering C, 2021, 118: 111391.

(45) Q.K. Zhang*, F.Q. Hu, Z.L. Song. Transient soldering reaction mechanisms of SnCu solder on CuNi nano conducting layer and fracture behavior of the joint interfaces. Journal of Electronic Materials, 2020, 49: 3383-3390.

(44) J. Yang, S. Xiao, Q.K. Zhang*, C. Xu, W.D. Li, B.Z. Zheng, F.Q. Hu, J. Yin, Z.L. Song. In-situ synthesis of Ti-Al intermetallic compounds coating on Ti alloy by magnetron sputtering deposition followed by vacuum annealing, Vacuum, 2020, 172: 109060.

(43) W.D. Li, L.J. Yang, Q.K. Zhang, C. Xu, Q.H. Zhu, *Z.L. Song, B.Z. Zheng, F.Q. Hu, J.J. Jiang. Effect of the grain boundary Tb/Dy diffused microstructure on the magnetic properties of sintered Nd-Fe-B magnets. Journal of Magnetism and Magnetic Materials, 2020, 502:166491.

(42) 胡方勤, 曹振亚, 张青科, 杨丽景, 宋振纶*. 负偏压和本底真空度对Al 膜表面形貌和耐蚀性能的影响. 中国表面工程, 2020, 33(4): 128-135 

(41) Q.K. Zhang*, Z. Wang, F.Q. Hu, Z.L. Song. Preparation of thin NiCrBSi laser cladding layers with no microcracking and low dilution. Journal of Laser Applications, 2019, 31, 032015.

(40) Z. Wang, Q.K. Zhang*, R. Bagheri, P.S. Guo, Y.R. Yao, L.J. Yang, *Z.L. Song. Influence of laser surface remelting on microstructure and degradation mechanism in simulated body fluid of Zn-0.5Zr alloy. Journal of Materials Science & Technology, 2019, 35(11): 2705-2713.

(39) J.J. Jiang, Q.K. Zhang*, F.Q. Hu, Z.L. Song. Solderability of AZ31B magnesium alloy coated by copper and strength of the solder joints. Journal of Materials Engineering and Performance, 2019, 28(9): 5450-5457.

(38) Z. Wang, Q. K. Zhang*, Y. X. Chen, Z. L. Song. Inluences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints, Journal of Materials Science: Materials in Electronics, 2019, 30(20): 18524-18538.

(37) W.D. Li, Q.K. Zhang, Q.H. Zhu, S. Xiao, C. Xu, L.J. Yang, B.Z. Zheng, S.D. Mao, Z.L. Song*. Formation of anti-shell/core structure of heavy rare earth elements (Tb, Dy) in sintered Nd-Fe-B magnet after grain boundary diffusion. Scripta Materialia, 2019, 163: 40-43.

(36) P.S. Guo, F.X. Li, L.J. Yang*, R. Bagheri, Q.K. Zhang, B.Q. Li, Kailynn Cho, Z.L. Song, W.S. Sun, H.N Li. Ultra-fine-grained Zn-0.5Mn alloy processed by multi-pass hot extrusion: Grain refinement mechanism and room-temperature superplasticity. Materials Science and Engineering A, 2019, 748, 262-266

(35) 肖松, 杨杰, 张青科, 杨丽景, 宋振纶*, 李谋成. 真空热处理提高烧结钕铁硼镀Cu层结合力研究. 表面技术. 2019, 48(10): 276-284.

(34) F.Q. Hu, Q.K. Zhang*, J.J.Jiang, Z.L. Song*, Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction, Materials Letters, 2018, 214, 142-145.

(33) B.H. Wu, X.F. Ding, Q.K. Zhang, L.J. Yang, B.Z. Zheng, F.Q. Hu, Z.L. Song*. The dual trend of diffusion of heavy rare earth elements during the grain boundary diffusion process for sintered Nd-Fe-B magnets. Scripta Materialia, 2018, 148: 29-32.

(32) Z. Wang, Q.K. Zhang*, P.S. Guo, X. Gao, L.J. Yang, Z.L. Song*, Effects of laser surface remelting on microstructure and properties of biodegradable Zn-Zr alloy, Materials Letters, 2018, 226, 52-54.

(31) Q.K. Zhang*, F.Q. Hu, Z.L.Song, Z.F. Zhang, Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain, Materials Science and Engineering A, 2017, 701, 187-195.

(30)  张青科*, 钟素娟, 张雷, 龙伟民, 王德智. 奥氏体不锈钢-铜钎料钎焊界面反应行为. 焊接学报. 2017, 38(3): 75-78.

(29) 龙伟民, 董博文, 张青科*, 何鹏, 薛鹏. 基于银合金先导润湿的铜磷钎料钎焊钢. 焊接学报. 2017, 38(1): 1-4.

(28) P. Xue, K.H. Wang, Q. Zhou*, J. Huang, W.M. Long, Q.K. Zhang. Effect of Nd on tin whisker growth in Sn-Zn soldered joint. Journal of Materials Science: Materials in Electronics. 2016, 27(4), 3742-3747.

(27) J.L. Yang, S.B. Xue*, P. Xue, Z.P. Lv, W.M. Long, G.X. Zhang, Q.K. Zhang, P. He. Development of Zn-15Al-xZr filler metals for Brazing 6061 aluminum alloy to stainless steel. Materials Science and Engineering A, 2016, 651: 425-434.

(26) Y.L. Han, S.B. Xue*, J.L. Yang, W.M. Long, Q.K. Zhang. Effects of trace amount praseodymium and neodymium on microstructure and mechanical properties of Sn-0.3Ag-0.7Cu-0.5Ga solder, Journal of Materials Science: Materials in Electronics, 2016, 27(1): 351-358.

(25) J.C. Xu, S.B. Xue*, P. Xue, W.M. Long, Q.K. Zhang. Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd. Journal of Materials Science: Materials in Electronics, 2016, 27(8): 8771-8777.

(24)  W.M. Long, G.X. Zhang, Q.K. Zhang*. In situ synthesis of high strength Ag brazing filler metals during induction brazing process. Scripta Materialia, 2016, 110: 41-43.

(23)  Q.K. Zhang*, W.M. Long, X.Q. Yu, Y.Y. Pei, P. X. Qiao. Effects of Ga addition on microstructure and properties of Sn-Ag-Cu/Cu solder joints, Journal of Alloys and Compounds, 2015, 622: 973-978.

(22)  Q.K. Zhang*, W.M. Long, Z.F. Zhang*, Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging, Journal of Alloys and Compounds, 2015, 646: 405-411.

(21) 龙伟民, 张冠星, 张青科*, 何鹏, 薛鹏. 钎焊过程中原位合成高强度银钎料. 焊接学报. 2015, 36(11): 1-4.

(20)  Q.K. Zhang, Z.F. Zhang*, Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude, Materials Science and Engineering A, 2013, 580: 374-384.

(19)  张青科*, 裴夤崟, 龙伟民. 奥氏体不锈钢钎焊界面裂纹形成机制研究. 金属学报. 2013, 49(10): 1177-1184.

(18)  Q.K. Zhang, Z.F. Zhang*, In-situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron back-scatter diffraction. Scripta Materialia, 2012, 67: 289-292.

(17)  Q.K. Zhang, Z.F. Zhang*, Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints. Journal of Applied Physics, 2012, 112: 064508.

(16)  L.M. Yang, Q.K. Zhang, Z.F. Zhang*, Effects of solder dimension on interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints. Scripta Materialia, 2012, 67: 637-640.

(15)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate. Materials Science and Engineering A, 2012, 532: 167-177.

(14) 张青科, 邹鹤飞, 张哲峰*. SnBi/Cu界面Bi偏聚机制与时效脆性抑制(邀请综述). 中国科学E辑-技术科学. 2012, 42(1): 13-21.

(13)  Q.K. Zhang, Z.F. Zhang*, In-situ observations on creep-fatigue fracture behaviors of Sn-4Ag/Cu solder joints, Acta Materialia, 2011, 59: 6017-6028.

(12)  Q.K. Zhang, J. Tan, Z.F. Zhang*, Fracture behaviors and strength of Cu6Sn5 intermetallic compounds by indentation testing, Journal of Applied Physics, 2011, 110: 014502.

(11)  Q.K. Zhang, Z.F. Zhang*, In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints, Materials Science and Engineering A, 2011, 528: 2686-2693.

(10)  Q.K. Zhang, Z.F. Zhang*, In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates, Materials Science and Engineering A, 2011, 530: 452-461.

(9)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Influences of substrate alloying and reflow temperature on Bi segregation behaviors at SnBi/Cu interface, Journal of Electronic Materials, 2011, 40: 2320-2328.

(8)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Transition of Bi embrittlement of SnBi/Cu joint couples with the reflow temperature, Journal of Materials Research, 2011, 26: 449-454.

(7)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4wt%Ag/Cu-X (X=Zn, Ag, Sn) Couples, Journal of Electronic Materials, 2011, 40: 1542-1548.

(6)  Q.K. Zhang, Q.S. Zhu, H.F. Zou, Z.F. Zhang*, Fatigue fracture mechanisms of Cu/lead-free solders interfaces, Materials Science and Engineering A, 2010, 527: 1367-1376.

(5)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate, Journal of Materials Research, 2010, 25: 303-314.

(4)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Tensile and fatigue behaviors of aged Cu/Sn-4Ag solder joints, Journal of Electronic Materials, 2009, 28: 852-859.

(3)  Q.K. Zhang, Z.F. Zhang*, Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times, Journal of Alloys and Compounds, 2009, 485: 853-861.

(2)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu couple by alloying Cu substrate, Scripta Materialia, 2009, 61: 308-311.

(1) 张哲峰*, 张鹏, 田艳中, 张青科, 屈伸, 邹鹤飞, 段启强, 李守新, 王中光. 金属材料疲劳损伤的界面效应(邀请论文). 金属学报. 2009, 45(7): 788-800.

专著书籍

(4) Qingke Zhang,独著,《Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces》,Springer出版社,2016年,ISBN: 978-3-662-48821-8.

(3) 张青科,参编. 《钎焊手册》第3版(第13章 半导体材料硅、砷化镓的钎焊),机械工业出版社,2017年,ISBN:978-7-111-57708-9.

(2) 张青科,参编. 《焊接材料手册》, 机械工业出版社, 2014年,ISBN:978-7-111-46777-9.

(1) 张青科,参编. 《超硬工具钎焊技术》, 河南省科技出版社, 2016年,ISBN:9787534974298.

专利与奖励

   
主要专利

(1)  一种制备金刚石-铜复合材料的钎焊方法, 发明, 2016, 第1发明人, 专利号: ZL2015100613293
(2)  适用于铜铝异种金属钎焊的复合钎剂, 发明, 2017, 第1发明人, 专利号: ZL201310443951.1
(3)  驻波约束的大面积硬质合金钎焊方法, 发明, 2015, 第2发明人, 专利号: ZL201310443951.1
(4)  软钎料焊丝的车削成型方法, 发明, 2015, 第2发明人, 专利号: ZL201210523494.2
(5)  一种火焰预热钨极氩弧钎焊方法, 发明, 2017, 第1发明人, 专利号: ZL201510941980.X
(6)  用于制备粉状钎料的专用车刀, 实用新型, 2013, 第1发明人, 专利号: ZL201220671731.5
(7)  用于软钎料焊丝的成型切刀, 实用新型, 2013, 第1发明人, 专利号: ZL201220671734.9
(8)  制备金刚石-铜复合材料的活性钎焊装置, 实用新型, 2015, 第1发明人, 专利号: ZL201520083186.1
(9)  驻波约束的大面积硬质合金钎焊设备, 实用新型, 2014, 第1发明人, 专利号: ZL201320596501.1
(10) 一种铝靶材组件的摩擦扩散焊方法, 发明, 2019, 第1发明人, 专利号: ZL201711148895.3
(11) 一种钕铁硼永磁体用铜基钎焊材料及其制备方法, 发明, 2019, 第2发明人, 专利号: ZL201710995258.3
(12) 一种单晶焊点及其制备方法、电子组件, 发明, 2019, 第1发明人, 专利号: ZL201910219240.3
(13) 一种化学蚀刻减薄FeNi合金箔带的方法, 发明, 2021, 第1发明人, 专利号: ZL202110847470.
(14) 复合柱状软焊材料及其制备方法与应用, 发明, 2022, 第1发明人, 专利号: 2022106506435
(15) 铜合金薄板及其表面处理方法, 发明, 2022, 第1发明人, 专利号: ZL202210720682.8
(16) CuCrSn合金及其变形热处理方法, 发明, 2022, 第1发明人, 专利号: ZL202210721110.1

荣誉与获奖

(16) 浙江省科学技术进步奖,二等奖,2023.
(15) 甬江育才工程领军拔尖人才项目第1层次, 2022.
(14) 宁波市“领军人才”, 2021.
(13) 宁波市“拔尖人才”, 2019.
(12)  中国专利优秀奖, 第2,部委级, 2017.
(11) 中国科学院宁波材料技术与工程研究所“春蕾人才”, 2017.
(10)  中国有色金属工业科技进步奖, 二等奖, 第4,部委级, 2016.
(9)  河南省科学技术进步奖, 二等奖, 第3,省级, 2016. 
(8)  中国机械工业科学技术奖, 一等奖, 第5,部委级, 2015.
(7)  中国机械工业科学技术奖, 二等奖, 第2,部委级, 2014. 
(6)  河南省科学技术进步奖, 二等奖, 第3,省级, 2014. 
(5)  CAS-Springer优秀博士论文奖, 院级, 2015.
(4)  中国科学院优秀博士学位论文, 院级, 2014. 
(3)  郑州市自然科学优秀论文奖, 特等奖,第1, 市地级, 2014. 
(2)  中国科学院院长优秀奖, 院级, 2013. 
(1)  中国科学院金属研究所“师昌绪奖学金”, 一等奖, 研究所(学校), 2013.

科研活动

   
在研项目
( 1 ) 冲压用高性能宽带轴承钢关键技术研发及产业化, 负责人, 地方任务, 2022-05--2025-04
( 2 ) ***等领域用超高纯不锈钢材料及管件研发与产业化, 负责人, 地方任务, 2022-07--2025-06
( 3 ) 超薄**合金制造技术研发, 负责人, 境内委托项目, 2022-12--2025-11
( 4 ) **异种材料连接技术研发, 负责人, 境内委托项目, 2023-01--2023-12
( 5 ) 高性能微型处理器高精密LQFP框架关键技术研发, 负责人, 地方任务, 2023-03--2025-08
( 6 ) **用高强度、耐腐蚀特种不锈钢关键技术研发与产业化, 负责人, 地方任务, 2024-01--2026-12
( 7 ) 颞下颌关节盘原位仿生重建及性能评估, 负责人, 国家任务, 2024-01--2026-12
已完成项目

(1) 973计划课题,三维集成互连材料的服役损伤行为与多场失效特性,2010/01-2014/12,参与
(2) 973计划前期研究专项课题,钎缝缺欠表征方法及形成机制的基础研究,2013/01-2014/12,负责执行
(3) 国家国际科技合作计划项目,****特种环境下钎焊接头行为及特性的合作研究,2014/04-2016/03,参与,负责执行
(4) 国家国际科技合作计划项目,热能储存材料承载体的高温钎焊研究,2015/04-2018/03,参与,课题负责人
(5) 机械科学研究总院技术发展基金专项,铜铝钎焊接头组织及性能研究,2013/04-2014/12,项目负责人
(6) 东北***公司技术开发项目,板翅式换热器用铝合金箔材抗高温塌陷性能研究,2013/10-2014/05,项目负责人
(7) 宁波市自然基金项目,SnBi(AgIn)/Cu低温光伏焊带焊接界面反应与时效可靠性研究, 2018/03--2020/03,项目负责人
(8) 中科院宁波材料所春蕾人才项目,激光制备金属材料表面防护层研究, 2017/03--2021/02,项目负责人
(9) 宁波市科技创新2025重大专项子课题,高强高导铜合金带材关键技术开发及产业化技术研究, 2019-07-2022-06,课题负责人
(10) 浙江省自然基金,微互连焊点热疲劳-电迁移耦合损伤机制及晶粒取向的影响研究, 2020-01-2022-12,项目负责人
(11) 国家自然基金, 初始晶粒取向对互连焊点热-电耦合损伤与组织演变的影响研究, 2021-01-2023-12, 项目负责人
(12) 宁波市科技创新2025重大专项子课题,高精密蚀刻引线框架用铜合金板带研发与产业化, 2020-08-2023-07, 课题负责人
(13) 宁波市科技创新2025重大专项,极大规模集成电路先进封装用引线框架及关键装备研发, , 2021-07-2023-11, 项目负责人

会议报告

(14) “第八届全国有色金属结构材料制备加工及应用技术交流会”,题目:“固溶条件对CuNiCoSi合金组织性能的影响研究”, 邀请报告, 2022, 南京, 中国. 
(13) “第四届全国青年疲劳学术研讨会”,题目:“薄层熔覆及热处理对AISI4340钢强度与疲劳性能的影响”, 分会报告, 2021, 上海, 中国.
(12) “第七届全国有色金属结构材料制备加工及应用技术交流会”,题目:“AgIn元素对SnBi及SnBiCu焊点组织与力学性能的影响研究”, 邀请报告, 2021, 镇江, 中国. 
(11) “第二届异质材料焊接与连接先进技术研究应用发展论坛”,题目:“SnCu-CuNi纳米导电层界面反应与焊点断裂机制研究”, 分会报告, 2021, 南昌, 中国. 
(10) “第6届全国有色金属结构材料制备加工及应用技术交流会”,题目:“原位合成TiAl金属间化合物表面层研究”, 邀请报告, 2020, 长沙, 中国. 
(9) “第五届海峡两岸绿色电子制造学术交流会”,题目:“光伏及集成电路无铅焊接研究”, 分会报告, 2019, 上海, 中国. 
(8) “第18届全国疲劳与断裂学术会议”,题目:“异种材料连接界面疲劳损伤行为”, 分会报告, 2016, 郑州, 中国. 
(7) “LÖT 2016--11th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding”, Title: ”In-situ synthesis of difficult-to-form brazing filler metals”, Plenary Lectures, 2016, Aachen, Germany. 
(6) ”2015 International Symposium on Green Manufacturing and Applications (ISGMA 2015)”, Titl: “Recent Development of Eco friendly Brazing and Soldering Materials”, Oral Presentation, 2015, Qingdao, China. 
(5) ” 2014 International Conference on Brazing, Soldering and Special Joining Technologies”, Title: ”Growth behaviors of intermetallic compounds at Sn-Ag/Cu interface”, Oral Presentation, 2014, Beijing, China. 
(4) ”The 6th Korean-Sino Seminar on the Advanced Manufacturing Technology”, Title: ”Interfacial growth behaviors of intermetallic compounds at SnAg-Cu solder joint”, Plenary Lectures, 2014, Busan, South Korea.
(3) “Sino-German Symposium on Green Joining Material and Remanufacturing”, Title: ”Research and Application of Green Brazing and Soldering Materials”, Invited Talk, 2013, Beijing, China. 
(2) ”2011 International Symposium on Advanced Packaging Materials”, Title: ”Low cycle creep-fatigue behaviors of Sn-4Ag/Cu solder joints”, Oral Presentation, 2011, Xiamen, China. 
(1) ”2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)”, Title: ”Fatigue fracture mechanisms of Cu/lead-free solders interfaces”, Oral Presentation, 2010, Xi’an, China.