基本信息
高丽茵  女    中国科学院深圳先进技术研究院
电子邮件: ly.gao@siat.ac.cn
通信地址: 广东省深圳市宝安区福永街道龙王庙工业区 深圳先进电子材料国际创新研究院
邮政编码:

研究领域

微电子封装材料制备及其可靠性研究

招生信息

   
招生专业
085600-材料与化工
招生方向
金属微电子封装材料
电子封装可靠性

教育背景

2011-09--2017-07   中国科学院金属研究所   博士学位
2007-09--2011-06   河北工业大学   学士学位

工作经历

   
工作简历
2019-07~现在, 中国科学院深圳先进技术研究院, 助理研究员(2019-2021),副研究员(2021-)
2017-07~2019-07,广东美的厨房电器制造有限公司, 可靠性工程师
社会兼职
2022-06-10-今,VE机械工程专家委员会, 会员
2022-04-20-今,电子封装技术国际会议材料分委会成员, 审稿人

专利与奖励

   
奖励信息
(1) 第23届高交会优秀产品奖, 其他, 2021
(2) 学术新星, 研究所(学校), 2021
(3) 电子封装技术国际会议优秀学生论文奖, 其他, 2021
(4) 优秀员工, 研究所(学校), 2020
专利成果
[1] 刘志权, 李哲, 黄静, 高丽茵. 一种纳米孪晶铜薄膜材料及其制备方法和用途. CN202011550541.3, 2020-12-24.
[2] 刘志权, 高丽茵, 孙蓉. 金属线的制备方法、金属线以及夹具. CN: CN111996560A, 2020-11-27.
[3] 刘志权, 王畅畅, 高丽茵, 孙蓉. 一种锡铋系合金焊点微观组织的定量表征方法. 202010452745.7, 2020-05-26.
[4] 刘志权, 高丽茵, 孙蓉. 一种铜薄膜材料及其电沉积制备方法. CN: CN110760903A, 2020-02-07.
[5] 刘志权, 高丽茵, 孙蓉. 一种全纳米孪晶组织结构的铜薄膜材料的制备方法. CN: CN110724981A, 2020-01-24.
[6] 高丽茵, 刘志权, 孙蓉. 一种铜柱凸点互连结构及其制备方法. CN: CN110707069A, 2020-01-17.
[7] 刘志权, 高丽茵. 一种Fe-Ni-P或Fe-Ni-P-RE非晶合金镀层及其电沉积用镀液和电沉积方法. CN: CN107142503B, 2019-10-11.
[8] 刘志权, 高丽茵, 李财富. 一种基于铁镍基非晶合金磁芯的PCB板上微电感结构. 中国: CN106163107B, 2018-10-26.
[9] 刘志权, 高丽茵. 一种基于铁镍多元合金磁芯的微型薄膜电感. 中国: CN105990321B, 2018-10-26.
[10] LIU Zhiquan, WU Di, GAO Liyin, GUO Jingdong. FE-NI-P-RE MULTICOMPONENT ALLOY PLATING LAYER, AND ELECTRODEPOSITION PREPARATION METHOD AND APPLICATION THEREOF. 美国: US2016053396(A1), 2016-02-25.
[11] 刘志权, 高丽茵. 一种基于铁镍多元合金磁芯的微型薄膜电感. 中国: CN204375745U, 2015.06.03.
[12] 刘志权, 高丽茵, 李财富. 一种基于铁镍基非晶合金磁芯的PCB板上微电感结构. 中国: CN204697393U, 2015-10-07.
[13] 刘志权, 吴迪, 高丽茵, 郭敬东. 一种Fe-Ni-P-RE多元合金镀层及其电沉积制备方法和应用. 中国: CN104561768A, 2015-04-29.

出版信息

   
发表论文
[1] Li-Yin Gao, Liu, Zhi-Quan. Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor. IEEE Transactions on Magnetics[J]. 2022, [2] Zhou, Shiqi, Zhang, YuBo, Gao, LiYin, Li, Zhe, Liu, ZhiQuan. The self-healing of Kirkendall voids on the interface between Sn and (111) oriented nanotwinned Cu under thermal aging. APPLIED SURFACE SCIENCE[J]. 2022, 588: [3] 高丽茵, 李财富, 刘志权, 孙蓉. 先进电子封装中焊点可靠性的研究进展. 机械工程学报[J]. 2022, [4] Yu-Bo Zhang, Li-Yin Gao, Xiao Li, Zhe Li, 马旭梁, Liu, Zhi-Quan, Rong Sun. Electroplating nanotwinned copper for ultra-fine pitch redistribution layer(RDL) of advanced packaging technology. 2021 International Conference on Electronic Packaging Technology (ICEPT2021)null. 2021, [5] Gao, LiYin, Luo, YiXiu, Wan, Peng, Liu, ZhiQuan. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints. MATERIALS CHARACTERIZATION[J]. 2021, 178: http://dx.doi.org/10.1016/j.matchar.2021.111195.
[6] 黄静, 李忠国, 高丽茵, 李晓, 李哲, 刘志权, 孙蓉. 亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响. 集成技术[J]. 2021, 10(1): 55-62, http://lib.cqvip.com/Qikan/Article/Detail?id=7103981244.
[7] Chen, Yinbo, Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2021, 32(2): 2172-2186, https://www.webofscience.com/wos/woscc/full-record/WOS:000604092100027.
[8] Gao, LiYin, Wan, Peng, Liu, ZhiQuan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 498: http://dx.doi.org/10.1016/j.jmmm.2019.166131.
[9] Huang, Jing, Gao, LiYin, Liu, ZhiQuan, IEEE. The electrochemical behavior of leveler JGB during electroplating of nanotwinned copper. 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2020, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000629072600068.
[10] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder. MATERIALS CHARACTERIZATION[J]. 2020, 163: http://dx.doi.org/10.1016/j.matchar.2020.110278.
[11] Gao, LiYin, Wen, Jian, Li, CaiFu, Chen, Chunhuan, Liu, ZhiQuan. The effect of finish layer on the interfacial cracking failure of Au-Si bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 115: https://www.webofscience.com/wos/woscc/full-record/WOS:000554882700004.
[12] 高丽茵, 李财富, 曹丽华, 刘志权. 热电耦合作用下功率器件引脚开裂的机理. 科学通报[J]. 2020, 65(20): 2169-2177, http://lib.cqvip.com/Qikan/Article/Detail?id=7102508376.
[13] Zhong-Guo Li, Li-Yin Gao, Liu, Zhi-Quan. The effect of transition layer on the strength of nanotwinned copper film by DC electrodeposition. 2020 International Conference on Electronic Packaging Technology (ICEPT2020)null. 2020, [14] Yang, LinLin, Chen, Chunhuan, Yuan, Jie, Gao, LiYin, Shang, Zhengang, Liu, ZhiQuan. Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 495: http://dx.doi.org/10.1016/j.jmmm.2019.165872.
[15] Du, Yahong, Gao, LiYin, Yu, Daquan, Liu, ZhiQuan. Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 31(4): 2967-2975, https://www.webofscience.com/wos/woscc/full-record/WOS:000514597300023.
[16] Gao, LiYin, Cui, XianWei, Tian, FeiFei, Liu, ZhiQuan. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 49(10): 6223-6231, https://www.webofscience.com/wos/woscc/full-record/WOS:000559506500003.
[17] Yang LinLin, Gao LiYin, Chen Chunhuan, Liu ZhiQuan, IEEE. Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2018, 1241-1245, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000450155700273.
[18] Li-Yin Gao, Hao Zhang, Cai-Fu Li, Jingdong GUO, Zhi-Quan Liu. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package. 材料科学技术学报:英文版. 2018, 34(8): 1305-1314, http://lib.cqvip.com/Qikan/Article/Detail?id=676143476.
[19] Gao, LiYin, Li, CaiFu, Wan, Peng, Zhang, Hao, Liu, ZhiQuan. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2018, 739: 632-642, http://dx.doi.org/10.1016/j.jallcom.2017.12.328.
[20] Gao, LiYin, Zhang, Hao, Li, CaiFu, Guo, Jingdong, Liu, ZhiQuan. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2018, 34(8): 1305-1314, http://lib.cqvip.com/Qikan/Article/Detail?id=676143476.
[21] Fu-Long Sun, Li-Yin Gao, Zhi-Quan Liu, Hao Zhang, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. 材料科学技术学报:英文版. 2018, 34(10): 1885-1890, http://lib.cqvip.com/Qikan/Article/Detail?id=676492637.
[22] 高丽茵. 微电子封装用电沉积铁镍基合金薄膜的制备及应用研究. 2017, [23] Gao LiYin, Liu ZhiQuan, Liu Li, Wang Jing, Zhou ZhaoXia, Liu ChangQing, IEEE. Diffusion barrier effect of Ni-W-P and Ni-Fe UBMs during high temperature storage. 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)null. 2017, 1566-1571, [24] Sun FuLong, Gao LiYin, Liu ZhiQuan, IEEE. Electrodeposition of nanotwinned copper film as under bump metallization. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2017, 456-459, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000431392000100.
[25] Wan, Peng, Gao, Liyin, Wang, Jingyang. Approaching ultra-low thermal conductivity in beta-SiC nanoparticle packed beds through multiple heat blocking mechanisms. SCRIPTA MATERIALIA[J]. 2017, 128: 1-5, http://ir.imr.ac.cn/handle/321006/78327.
[26] Gao, LiYin, Liu, ZhiQuan, Li, CaiFu. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling. JOURNAL OF ELECTRONIC MATERIALS[J]. 2017, 46(8): 5338-5348, http://ir.imr.ac.cn/handle/321006/78030.
[27] []. Synthetical evaluation of the reliability for SnAgCu/FeNi solder joints. 70th IIW International Conferencenull. 2017, [28] 田飞飞, 高丽茵, 葛培虎, 陈以钢, 崔洪波, 周明. 无氧铜镀层对激光封焊裂纹的影响. 焊接学报[J]. 2017, 38(4): 115-118+134, http://ir.imr.ac.cn/handle/321006/77955.
[29] Gao, LiYin, Li, CaiFu, Wan, Peng, Liu, ZhiQuan. A superior interfacial reliability of Fe-Ni UBM during high temperature storage. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2017, 28(12): 8537-8545, http://ir.imr.ac.cn/handle/321006/78112.
[30] Liu, Zhi-Quan, 高丽茵, cai-fu li. Identification of IMCs at SAC/Fe-Ni interface during solid-state aging at 125°C. 2016 Electronics System-integration Technology Conference and Exhibition (ESTC2016)null. 2016, [31] Gao LiYin, Liu ZhiQuan, Zhang Li, Guo Hongyan, Lai ChiMing, IEEE. Superior Reliability of Fe-45Ni UBM in Electromigration. 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)null. 2016, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000392263500079.
[32] Wan, Peng, Wu, Zhen, Zhang, Hui, Gao, Liyin, Wang, Jingyang. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity. MATERIALS RESEARCH LETTERS[J]. 2016, 4(2): 104-111, http://ir.imr.ac.cn/handle/321006/75950.
[33] 高丽茵. Clarification of Cu rich phase in SAC/FeNi solder joint. 2015 International Conference on Electronic Packaging Technology(ICEPT2015)null. 2015, 

科研活动

   
科研项目
( 1 ) 基于晶界与孪晶界调控的互连微凸点制备及电迁移研究, 负责人, 国家任务, 2022-01--2024-12
( 2 ) 深圳市技术攻关面上-高亮度高解析度柔性Micro-LED 关键技术研发, 负责人, 地方任务, 2022-01--2023-12
( 3 ) 广东省面上项目-基于微观组织调控的Cu-Cu键合技术及其可靠性研究, 负责人, 地方任务, 2022-01--2024-12
( 4 ) 广东省粤深联合青年基金-电沉积高性能铁镍基合金薄膜电感磁芯的研究, 负责人, 地方任务, 2020-01--2022-12
( 5 ) 深圳市出站留深博士后科研资助, 负责人, 其他任务, 2021-09--2024-08
( 6 ) 中科院深圳先进院优秀青年培育基金-纳米孪晶铜UBM的抗电迁移特性研究, 负责人, 研究所自选, 2021-01--2022-12
( 7 ) 纳米孪晶铜力学强度研究项目, 参与, 企业委托, 2020-01--2021-08
( 8 ) 工信部电子信息产业集群促进项目,电子材料与器件服役可靠性检测与仿真平台, 参与, 研究所自选, 2019-08--2021-07
( 9 ) 晶圆级封装再布线铜互连电镀液开发, 参与, 研究所自选, 2022-01--2022-12
参与会议
(1)Electroplating nanotwinned copper for ultra-fine pitch redistribution layer(RDL) of advanced packaging technology   Yu-Bo Zhang, Li-Yin Gao, Xiao Li, Zhe Li, Xu-Liang Ma, Zhi-Quan Liu, Rong Sun   2021-09-15
(2)Superior Reliability of Fe-45Ni UBM in Electromigration   L.Y. Gao, Z.Q. Liu, L. Zhang, H.Y. Guo, C.M. Lai   2016-09-13
(3)Clarification of Cu rich phase in SAC/FeNi solder joint   L.Y.Gao, Z.Q. Liu   2015-08-13