基本信息
高丽茵  女  硕导  中国科学院深圳先进技术研究院
电子邮件: ly.gao@siat.ac.cn
通信地址: 广东省深圳市宝安区福永街道龙王庙工业区 深圳先进电子材料国际创新研究院
邮政编码: 518103

研究领域

微电子封装材料制备及其可靠性研究

招生信息

   
招生专业
085600-材料与化工
招生方向
先进电子封装材料
电子封装可靠性

教育背景

2011-09--2017-07   中国科学院金属研究所   博士学位
2007-09--2011-06   河北工业大学   学士学位

工作经历

   
工作简历
2019-07~现在, 中国科学院深圳先进技术研究院, 助理研究员(2019-2021),副研究员(2021-)
2017-07~2019-07,广东美的厨房电器制造有限公司, 材料失效分析负责人
社会兼职
2023-01-01-今,《失效分析与预防》, 青年编委
2022-12-31-2024-12-31,《电镀与涂饰》杂志, 青年编委
2022-06-10-今,VE机械工程专家委员会, 会员
2022-04-19-今,电子封装技术国际会议, 材料分会委员

专利与奖励

   
奖励信息
(1) 第23届中国国际高新技术成果交易会优秀产品奖, 其他, 2021
专利成果
( 1 ) 一种石墨烯-铜基复合材料及其制备方法和应用, 发明专利, 2022, 第 3 作者, 专利号: CN202210288917.0

( 2 ) 一种纳米孪晶铜微电感及其制备方法和应用, 发明专利, 2022, 第 1 作者, 专利号: CN202210132647.4

( 3 ) 一种混合键合结构及其制备方法, 发明专利, 2021, 第 4 作者, 专利号: CN202111574515.9

( 4 ) 一种孪晶铜材料及制备方法和用途, 发明专利, 2021, 第 4 作者, 专利号: CN202111574709.9

( 5 ) 一种用于填充高密度封装结构的纳米孪晶铜电镀液、镀层及其制备方法和应用, 发明专利, 2021, 第 2 作者, 专利号: CN202111535527.0

( 6 ) 一种Fe-Ni-P合金电镀液、Fe-Ni-P合金镀层的电沉积方法及合金镀层, 发明专利, 2021, 第 1 作者, 专利号: CN202110698679.6

( 7 ) 一种纳米孪晶铜薄膜材料及其制备方法和用途, 发明专利, 2020, 第 4 作者, 专利号: CN202011550541.3

( 8 ) 金属线的制备方法、金属线以及夹具, 发明专利, 2020, 第 2 作者, 专利号: CN111996560A

( 9 ) 一种全纳米孪晶组织结构的铜薄膜材料的制备方法, 发明专利, 2020, 第 2 作者, 专利号: CN110724981B

( 10 ) 一种锡铋系合金焊点微观组织的定量表征方法, 发明专利, 2020, 第 3 作者, 专利号: 202010452745.7

( 11 ) 一种铜薄膜材料及其电沉积制备方法, 发明专利, 2020, 第 2 作者, 专利号: CN110760903A

( 12 ) 一种铜柱凸点互连结构及其制备方法, 发明专利, 2020, 第 1 作者, 专利号: CN110707069A

( 13 ) Fe-Ni-P-RE multicomponent alloy plating layer, and electrodeposition preparation method and application thereof, 发明专利, 2019, 第 3 作者, 专利号: US10344391B2

( 14 ) 一种Fe‑Ni‑P或Fe‑Ni‑P‑RE非晶合金镀层及其电沉积用镀液和电沉积方法, 专利授权, 2017, 第 2 作者, 专利号: CN107142503A

( 15 ) 一种基于铁镍基非晶合金磁芯的PCB板上微电感结构, 实用新型, 2016, 第 2 作者, 专利号: CN106163107A

( 16 ) 一种基于铁镍多元合金磁芯的微型薄膜电感, 实用新型, 2016, 第 2 作者, 专利号: CN105990321A

( 17 ) 一种基于铁镍基非晶合金磁芯的PCB板上微电感结构, 发明专利, 2015, 第 2 作者, 专利号: CN204697393U

( 18 ) 一种基于铁镍多元合金磁芯的微型薄膜电感, 发明专利, 2015, 第 2 作者, 专利号: CN204375745U

( 19 ) 一种Fe-Ni-P-RE多元合金镀层及其电沉积制备方法和应用, 发明专利, 2015, 第 3 作者, 专利号: CN104561768A

出版信息

   
发表论文
[1] Zhang, Minghui, Gao, LiYin, Li, JunJie, Sun, Rong, Liu, ZhiQuan. Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper. MATERIALS CHEMISTRY AND PHYSICS[J]. 2023, 306: http://dx.doi.org/10.1016/j.matchemphys.2023.128089.
[2] 王玉玺, 高丽茵, 万永强, 李哲, 刘志权. 应用于大马士革工艺的纳米孪晶铜脉冲电沉积研究. 电化学(中英文). 2023, 29(8): 21-30, http://lib.cqvip.com/Qikan/Article/Detail?id=7110528360.
[3] 谌可馨, 高丽茵, 许增光, 李哲, 刘志权. 先进封装中硅通孔(TSV)铜互连电镀研究进展. 科技导报[J]. 2023, 41(5): 15-26, http://lib.cqvip.com/Qikan/Article/Detail?id=7109345449.
[4] Huang, Jing, Gao, LiYin, Peng, ZhenJia, Li, Zhe, Liu, ZhiQuan, Sun, Rong. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL). NANOTECHNOLOGY[J]. 2023, 34(1): [5] 张明辉, 高丽茵, 刘志权, 董伟, 赵宁. 先进封装铜-铜直接键合技术的研究进展. 电子与封装[J]. 2023, 58-68, https://kns.cnki.net/kcms2/article/abstract?v=M9N_p6ifsvPwHQJCh9nZFzdsu1whRcikBXDHMrIv0KHl8mJVabCcAL6ZrViZpMNcLpNvmMGwHOB2dL9LWBNAeGKDJvoRw4y7cHDMPbZUc_FMRRJeU4vYiPb7r0E1OZK-&uniplatform=NZKPT&language=gb.
[6] Li, Xiao, Gao, LiYin, Tao, JunLei, Dai, ShuJun, Liu, ZhiQuan. Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2022, 33(22): 17877-17887, http://dx.doi.org/10.1007/s10854-022-08651-6.
[7] Li, ZhongGuo, Gao, LiYin, Li, Zhe, Sun, Rong, Liu, ZhiQuan. Regulating the orientation and distribution of nanotwins by trace of gelatin during direct current electroplating copper on titanium substrate. JOURNAL OF MATERIALS SCIENCE[J]. 2022, 57(37): 17797-17811, http://dx.doi.org/10.1007/s10853-022-07731-6.
[8] Li-Yin Gao, Liu, Zhi-Quan. Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor. IEEE Transactions on Magnetics[J]. 2022, [9] Zhou, Shiqi, Zhang, YuBo, Gao, LiYin, Li, Zhe, Liu, ZhiQuan. The self-healing of Kirkendall voids on the interface between Sn and (111) oriented nanotwinned Cu under thermal aging. APPLIED SURFACE SCIENCE[J]. 2022, 588: [10] 高丽茵, 李财富, 刘志权, 孙蓉. 先进电子封装中焊点可靠性的研究进展. 机械工程学报[J]. 2022, [11] Gao, LiYin, Luo, YiXiu, Wan, Peng, Liu, ZhiQuan. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints. MATERIALS CHARACTERIZATION[J]. 2021, 178: http://dx.doi.org/10.1016/j.matchar.2021.111195.
[12] 黄静, 李忠国, 高丽茵, 李晓, 李哲, 刘志权, 孙蓉. 亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响. 集成技术[J]. 2021, 10(1): 55-62, http://lib.cqvip.com/Qikan/Article/Detail?id=7103981244.
[13] Chen, Yinbo, Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints. JOURNALOFMATERIALSSCIENCEMATERIALSINELECTRONICS[J]. 2021, 32(2): 2172-2186, https://www.webofscience.com/wos/woscc/full-record/WOS:000604092100027.
[14] Huang, Jing, Gao, LiYin, Liu, ZhiQuan, IEEE. The electrochemical behavior of leveler JGB during electroplating of nanotwinned copper. 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2020, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000629072600068.
[15] Gao, LiYin, Wan, Peng, Liu, ZhiQuan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 498: http://dx.doi.org/10.1016/j.jmmm.2019.166131.
[16] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder. MATERIALS CHARACTERIZATION[J]. 2020, 163: http://dx.doi.org/10.1016/j.matchar.2020.110278.
[17] Gao, LiYin, Wen, Jian, Li, CaiFu, Chen, Chunhuan, Liu, ZhiQuan. The effect of finish layer on the interfacial cracking failure of Au-Si bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 115: https://www.webofscience.com/wos/woscc/full-record/WOS:000554882700004.
[18] 高丽茵, 李财富, 曹丽华, 刘志权. 热电耦合作用下功率器件引脚开裂的机理. 科学通报[J]. 2020, 65(20): 2169-2177, http://lib.cqvip.com/Qikan/Article/Detail?id=7102508376.
[19] Zhong-Guo Li, Li-Yin Gao, Liu, Zhi-Quan. The effect of transition layer on the strength of nanotwinned copper film by DC electrodeposition. 2020 International Conference on Electronic Packaging Technology (ICEPT2020)null. 2020, [20] Yang, LinLin, Chen, Chunhuan, Yuan, Jie, Gao, LiYin, Shang, Zhengang, Liu, ZhiQuan. Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 495: http://dx.doi.org/10.1016/j.jmmm.2019.165872.
[21] Du, Yahong, Gao, LiYin, Yu, Daquan, Liu, ZhiQuan. Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 31(4): 2967-2975, https://www.webofscience.com/wos/woscc/full-record/WOS:000514597300023.
[22] Gao, LiYin, Cui, XianWei, Tian, FeiFei, Liu, ZhiQuan. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 49(10): 6223-6231, https://www.webofscience.com/wos/woscc/full-record/WOS:000559506500003.
[23] LiYin Gao, Jian Wen, CaiFu Li, Chunhuan Chen, ZhiQuan Liu. The effect of finish layer on the interfacial cracking failure of AusbndSi bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 115: http://dx.doi.org/10.1016/j.engfailanal.2020.104682.
[24] Sun, FuLong, Gao, LiYin, Liu, ZhiQuan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2018, 34(10): 1885-1890, http://lib.cqvip.com/Qikan/Article/Detail?id=676492637.
[25] Yang LinLin, Gao LiYin, Chen Chunhuan, Liu ZhiQuan, IEEE. Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2018, 1241-1245, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000450155700273.
[26] Gao, LiYin, Li, CaiFu, Wan, Peng, Zhang, Hao, Liu, ZhiQuan. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2018, 739: 632-642, http://dx.doi.org/10.1016/j.jallcom.2017.12.328.
[27] Gao, LiYin, Zhang, Hao, Li, CaiFu, Guo, Jingdong, Liu, ZhiQuan. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2018, 34(8): 1305-1314, http://lib.cqvip.com/Qikan/Article/Detail?id=676143476.
[28] Gao LiYin, Liu ZhiQuan, Liu Li, Wang Jing, Zhou ZhaoXia, Liu ChangQing, IEEE. Diffusion barrier effect of Ni-W-P and Ni-Fe UBMs during high temperature storage. 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)null. 2017, 1566-1571, [29] Sun FuLong, Gao LiYin, Liu ZhiQuan, IEEE. Electrodeposition of nanotwinned copper film as under bump metallization. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2017, 456-459, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000431392000100.
[30] 高丽茵. 微电子封装用铁镍基合金薄膜的制备及应用研究. 2017, http://ir.imr.ac.cn/handle/321006/78423.
[31] Wan, Peng, Gao, Liyin, Wang, Jingyang. Approaching ultra-low thermal conductivity in beta-SiC nanoparticle packed beds through multiple heat blocking mechanisms. SCRIPTA MATERIALIA[J]. 2017, 128: 1-5, http://ir.imr.ac.cn/handle/321006/78327.
[32] Gao, LiYin, Liu, ZhiQuan, Li, CaiFu. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling. JOURNAL OF ELECTRONIC MATERIALS[J]. 2017, 46(8): 5338-5348, http://ir.imr.ac.cn/handle/321006/78030.
[33] []. Synthetical evaluation of the reliability for SnAgCu/FeNi solder joints. 70th IIW International Conferencenull. 2017, [34] 田飞飞, 高丽茵, 葛培虎, 陈以钢, 崔洪波, 周明. 无氧铜镀层对激光封焊裂纹的影响. 焊接学报[J]. 2017, 38(4): 115-118+134, http://ir.imr.ac.cn/handle/321006/77955.
[35] Gao, LiYin, Li, CaiFu, Wan, Peng, Liu, ZhiQuan. A superior interfacial reliability of Fe-Ni UBM during high temperature storage. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2017, 28(12): 8537-8545, http://ir.imr.ac.cn/handle/321006/78112.
[36] Liu, Zhi-Quan, 高丽茵, cai-fu li. Identification of IMCs at SAC/Fe-Ni interface during solid-state aging at 125°C. 2016 Electronics System-integration Technology Conference and Exhibition (ESTC2016)null. 2016, [37] Gao LiYin, Liu ZhiQuan, Zhang Li, Guo Hongyan, Lai ChiMing, IEEE. Superior Reliability of Fe-45Ni UBM in Electromigration. 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)null. 2016, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000392263500079.
[38] Wan, Peng, Wu, Zhen, Zhang, Hui, Gao, Liyin, Wang, Jingyang. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity. MATERIALS RESEARCH LETTERS[J]. 2016, 4(2): 104-111, http://ir.imr.ac.cn/handle/321006/75950.
[39] 高丽茵. Clarification of Cu rich phase in SAC/FeNi solder joint. 2015 International Conference on Electronic Packaging Technology(ICEPT2015)null. 2015, 

科研活动

   
科研项目
( 1 ) 基于晶界与孪晶界调控的互连微凸点制备及电迁移研究, 负责人, 国家任务, 2022-01--2024-12
( 2 ) 深圳市技术攻关面上-高亮度高解析度柔性Micro-LED 关键技术研发, 负责人, 地方任务, 2022-01--2023-12
( 3 ) 广东省面上项目-基于微观组织调控的Cu-Cu键合技术及其可靠性研究, 负责人, 地方任务, 2022-01--2024-12
( 4 ) 深圳市出站留深博士后科研资助, 负责人, 其他任务, 2021-09--2024-08
( 5 ) 深港澳科技计划-芯片高效散热设计的纳米孪晶与多孔纤维铜叠层均热板开发, 参与, 地方任务, 2023-05--2025-04
( 6 ) 广东省区域联合基金项目-重点项目,晶圆级封装用孪晶铜再布线的电镀制备、组织性能调控、结构设计和服役可靠性研究, 参与, 地方任务, 2022-10--2025-09
( 7 ) 广东省重点领域研发计划--高端镀铜添加剂及应用技术的研发及产业化, 参与, 地方任务, 2023-01--2025-12
参与会议
(1)8-inch wafer-level electroplating of nanotwinned copper redistribution layer for advanced packaging   Xiao Li, Zhi-Gang Lei, Zhe Li, Li-Yin Gao, Zhao-Wei Jia, Zhi-Quan Liu* and Rong Sun   2022-08-11
(2)Electroplating nanotwinned copper for ultra-fine pitch redistribution layer(RDL) of advanced packaging technology   Yu-Bo Zhang, Li-Yin Gao, Xiao Li, Zhe Li, Xu-Liang Ma, Zhi-Quan Liu, Rong Sun   2021-09-15
(3)Superior Reliability of Fe-45Ni UBM in Electromigration   L.Y. Gao, Z.Q. Liu, L. Zhang, H.Y. Guo, C.M. Lai   2016-09-13
(4)Clarification of Cu rich phase in SAC/FeNi solder joint   L.Y.Gao, Z.Q. Liu   2015-08-13

指导学生

现指导学生

梁嘉龙  硕士研究生  085600-材料与化工