发表论文
[1] Zheng, Ruowei, Zhou, Haojie, Li, Chenxi, Li, Ji. Synergistic phase change and heat conduction of low melting-point alloy microparticle additives in expanded graphite shape-stabilized organic phase change materials. CHEMICAL ENGINEERING JOURNAL[J]. 2024, 第 4 作者 通讯作者 482: http://dx.doi.org/10.1016/j.cej.2024.149009.[2] 李骥. Toward extremely low thermal resistance with extremely low pumping power consumption for ultra-high heat flux removal on chip size scale. Energy Conversion and Management[J]. 2024, 第 1 作者 通讯作者 306: 118293, [3] Zhou, Haojie, Li, Ji. Development and analysis of a simple structured and economic miniature vapor compression refrigerator for cooling electronics in harsh environment. APPLIED THERMAL ENGINEERING[J]. 2023, 第 2 作者 通讯作者 223: http://dx.doi.org/10.1016/j.applthermaleng.2023.120047.[4] Li, Chenxi, Li, Ji. A dumbbell-shaped 3D flat plate pulsating heat pipe module augmented by capillarity gradient for high-power server CPU onsite cooling. ENERGY CONVERSION AND MANAGEMENT[J]. 2023, 第 2 作者 通讯作者 292: http://dx.doi.org/10.1016/j.enconman.2023.117384.[5] Zhou, Haojie, Tian, Tong, Wang, Xinyue, Li, Ji. Combining looped heat pipe and thermoelectric generator module to pursue data center servers with possible power usage effectiveness less than 1. APPLIED ENERGY[J]. 2023, 第 4 作者 通讯作者 332: http://dx.doi.org/10.1016/j.apenergy.2022.120539.[6] Tian, Tong, Wang, Xinyue, Liu, Yang, Yang, Xuan, Sun, Bo, Li, Ji. Nano-engineering enabled heat pipe battery: A powerful heat transfer infrastructure with capability of power generation. APPLIED ENERGY[J]. 2023, 第 6 作者 通讯作者 348: http://dx.doi.org/10.1016/j.apenergy.2023.121520.[7] Li, Chenxi, Li, Ji. Thermal characteristics of a flat plate pulsating heat pipe module for onsite cooling of high power server CPUs. THERMAL SCIENCE AND ENGINEERING PROGRESS[J]. 2023, 第 2 作者 通讯作者 37: http://dx.doi.org/10.1016/j.tsep.2022.101542.[8] 李骥. Forced boiling of nonazeotropic immiscible mixture in a supercapillary microchannel array for ultra-high heat flux removal with chip junction temperature below 85°C. Sci China Tech Sci[J]. 2023, 第 1 作者[9] Yang Liu, Ji Li. A protocol to further improve the thermal conductivity of silicone-matrix thermal interface material with nano-fillers. THERMOCHIMICA ACTA[J]. 2022, 第 2 作者708: [10] Liu, Yang, Zheng, Ruowei, Tian, Tong, Li, Ji. Characteristics of thermal storage heat pipe charged with graphene nanoplatelets enhanced organic phase change material. ENERGY CONVERSION AND MANAGEMENT[J]. 2022, 第 4 作者 通讯作者 267: http://dx.doi.org/10.1016/j.enconman.2022.115902.[11] Sun, Bo, Wang, Huiru, Shi, Zhongshan, Li, Ji. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux. HEAT AND MASS TRANSFER[J]. 2022, 第 4 作者 通讯作者 58(2): 195-208, http://dx.doi.org/10.1007/s00231-021-03104-y.[12] 李骥. High latent heat phase change materials with low melting temperature for thermal management and storage: Critical Review. Renewable and Sustainable Energy Reviews[J]. 2022, 第 1 作者168: 112783, [13] Wang, Xinyue, Liu, Yang, Tian, Tong, Li, Ji. Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness. APPLIED ENERGY[J]. 2022, 第 4 作者 通讯作者 319: http://dx.doi.org/10.1016/j.apenergy.2022.119279.[14] Li, Xingping, Lv, Lucang, Wang, Xinyue, Li, Ji. Transient thermodynamic response and boiling heat transfer limit of dielectric liquids in a two-phase closed direct immersion cooling system. THERMAL SCIENCE AND ENGINEERING PROGRESS[J]. 2021, 第 4 作者 通讯作者 25: http://dx.doi.org/10.1016/j.tsep.2021.100986.[15] Li, Chenxi, Li, Ji. Passive Cooling Solutions for High Power Server CPUs with Pulsating Heat Pipe Technology: Review. FRONTIERS IN ENERGY RESEARCH. 2021, 第 2 作者 通讯作者 9: http://dx.doi.org/10.3389/fenrg.2021.755019.[16] Li, Ji, Zhou, Guohui, Tian, Tong, Li, Xingping. A new cooling strategy for edge computing servers using compact looped heat pipe. APPLIED THERMAL ENGINEERING[J]. 2021, 第 1 作者 通讯作者 187: http://dx.doi.org/10.1016/j.applthermaleng.2021.116599.[17] Xu, Zhengxuan, Li, Jian, Yao, Zhaohui, Li, Ji. Effects of superheat degree and wettability on droplet evaporation time near Leidenfrost point through Lattice Boltzmann simulation. INTERNATIONAL JOURNAL OF THERMAL SCIENCES[J]. 2021, 第 4 作者 通讯作者 167: http://dx.doi.org/10.1016/j.ijthermalsci.2021.107017.[18] Ji Li, Xingping Li, Guohui Zhou, Yang Liu. Development and evaluation of a supersized aluminum flat plate heat pipe for natural cooling of high power telecommunication equipment. APPLIED THERMAL ENGINEERING[J]. 2021, 第 1 作者184: [19] Sun, Bo, Wang, Huiru, Shi, Zhongshan, Li, Ji. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux. HEAT AND MASS TRANSFER. 2021, 第 4 作者 通讯作者 [20] Li, Xingping, Li, Ji, Zhou, Guohui, Lv, Lucang. Quantitative analysis of passive seasonal cold storage with a two-phase closed thermosyphon. APPLIED ENERGY[J]. 2020, 第 2 作者 通讯作者 260: http://dx.doi.org/10.1016/j.apenergy.2019.114250.[21] Zhou, Guohui, Li, Ji, Jia, Zizhou. Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module. APPLIED ENERGY[J]. 2019, 第 2 作者 通讯作者 239: 859-875, http://dx.doi.org/10.1016/j.apenergy.2019.01.258.[22] Li, Ji, Lv, Lucang, Zhou, Guohui, Li, Xingping. Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips. ENERGY CONVERSION AND MANAGEMENT[J]. 2019, 第 1 作者 通讯作者 201: http://dx.doi.org/10.1016/j.enconman.2019.112202.[23] Zhou, Guohui, Li, Ji. Two-phase flow characteristics of a high performance loop heat pipe with flat evaporator under gravity. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2018, 第 2 作者 通讯作者 117: 1063-1074, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2017.10.074.[24] Zhou, Guohui, Li, Ji, Lv, Lucang, ASME. EXPERIMENTAL STUDY ON HEAT TRANSFER CAPABILITY OF A MINIATURE LOOP HEAT PIPE. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 8. 2017, 第 2 作者 通讯作者 http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000400877900047.[25] Zhou, Guohui, Li, Ji, Lv, Lucang, Peterson, G P. Comparative Study on Thermal Performance of Ultrathin Miniature Loop Heat Pipes With Different Internal Wicks. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME[J]. 2017, 第 2 作者 通讯作者 139(12): https://www.webofscience.com/wos/woscc/full-record/WOS:000424541300008.[26] Lv, Lucang, Li, Ji. Managing high heat flux up to 500 W/cm(2) through an ultra-thin flat heat pipe with superhydrophilic wick. APPLIED THERMAL ENGINEERING[J]. 2017, 第 2 作者 通讯作者 122: 593-600, http://dx.doi.org/10.1016/j.applthermaleng.2017.05.050.[27] Li, Zhiwei, Li, Ji, Li, Xingping, Ni, MingJiu. Free surface flow and heat transfer characteristics of liquid metal Galinstan at low flow velocity. EXPERIMENTAL THERMAL AND FLUID SCIENCE[J]. 2017, 第 2 作者 通讯作者 82: 240-248, http://dx.doi.org/10.1016/j.expthermflusci.2016.11.021.[28] Lv, Lucang, Li, Ji, Zhou, Guohui. A robust pulsating heat pipe cooler for integrated high power LED chips. HEAT AND MASS TRANSFER[J]. 2017, 第 2 作者 通讯作者 53(11): 3305-3313, https://www.webofscience.com/wos/woscc/full-record/WOS:000415998900011.[29] Lv, Lucang, Li, Ji. Effect of charging ratio on thermal performance of a miniaturized two-phase super-heat-spreader. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2017, 第 2 作者 通讯作者 104: 489-492, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.08.087.[30] Zhou, Guohui, Li, Ji, Lv, Lucang. An ultra-thin miniature loop heat pipe cooler for mobile electronics. APPLIED THERMAL ENGINEERING[J]. 2016, 第 2 作者 通讯作者 109: 514-523, http://dx.doi.org/10.1016/j.applthermaleng.2016.08.138.[31] Li, ZhiWei, Lv, Lucang, Li, Ji. Combination of heat storage and thermal spreading for high power portable electronics cooling. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2016, 第 3 作者 通讯作者 98: 550-557, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.03.068.[32] Li, Ji, Tian, Wenkai, Lv, Lucang. A thermosyphon heat pipe cooler for high power LEDs cooling. HEAT AND MASS TRANSFER[J]. 2016, 第 1 作者 通讯作者 52(8): 1541-1548, http://www.corc.org.cn/handle/1471x/2374503.[33] Li, Ji, Lv, Lucang. Experimental studies on a novel thin flat heat pipe heat spreader. APPLIED THERMAL ENGINEERING[J]. 2016, 第 1 作者 通讯作者 93: 139-146, http://dx.doi.org/10.1016/j.applthermaleng.2015.09.038.[34] Niu, Gengwen, Li, Ji. Comparative studies of pool boiling heat transfer with nano-fluids on porous surface. HEAT AND MASS TRANSFER[J]. 2015, 第 2 作者 通讯作者 51(12): 1769-1777, https://www.webofscience.com/wos/woscc/full-record/WOS:000362888700010.[35] 吕鲁仓, 李骥, 周国辉. 一种冷却集成LED芯片的脉动热管散热器. 2015年中国工程热物理学会传热传质学学术年会. 2015, 第 2 作者http://ir.etp.ac.cn/handle/311046/107481.[36] 李志伟, 吕鲁仓, 李骥. 基于热储存及热扩展耦合模式的电子冷却方式. 2015年中国工程热物理学会传热传质学学术年会. 2015, 第 3 作者http://ir.etp.ac.cn/handle/311046/107800.[37] Li Ji. A comparative study of pool boiling heat transfer with nano-fluids on porous surface. Heat and Mass Transfer. 2015, 第 1 作者 通讯作者 [38] Li, Ji, Lv, Lucang. Performance investigation of a compact loop heat pipe with parallel condensers. EXPERIMENTAL THERMAL AND FLUID SCIENCE[J]. 2015, 第 1 作者 通讯作者 62: 40-51, http://dx.doi.org/10.1016/j.expthermflusci.2014.12.001.[39] 李帆, 倪明玖, 李骥. 微尺度瞬态气泡生长及湮灭的数值模拟. 中国科学院大学学报[J]. 2015, 第 3 作者32(1): 31-37, http://journal.ucas.ac.cn/CN/10.7523/j.issn.2095-6134.2015.01.006.[40] Li Ji. A Novel Two-phase Closed Loop Thermosyphon for Split-type Solar water Collectors. Applied Thermal Engineering. 2014, 第 1 作者[41] Li, Ji, Lin, Feng, Niu, Gengwen. An insert-type two-phase closed loop thermosyphon for split-type solar water heaters. APPLIED THERMAL ENGINEERING[J]. 2014, 第 1 作者 通讯作者 70(1): 441-450, http://dx.doi.org/10.1016/j.applthermaleng.2014.05.019.[42] Niu Gengwen, Li Ji, ASME. Visualization study of pool boiling on polished and porous coated surfaces for deionized water and Al2O3-water nano-fluids. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 8C. 2014, 第 2 作者http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000360032800043.[43] Li Ji. Micro Flat Heat Pipes for Microelectronics Cooling: Review. Recent Patents on Mechanical Engineering. 2013, 第 1 作者[44] 史忠山, 李骥. 自然对流板肋热沉的三维数值结构优化. 制冷学报[J]. 2013, 第 2 作者45-51, http://lib.cqvip.com/Qikan/Article/Detail?id=44826233.[45] Li, Ji, Lin, Feng, Wang, Daming, Tian, Wenkai. A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips. APPLIED THERMAL ENGINEERING[J]. 2013, 第 1 作者 通讯作者 56(1-2): 18-26, http://dx.doi.org/10.1016/j.applthermaleng.2013.03.016.[46] Jiang Yong, Carbajal Gerardo, Sobhan C B, Li Ji, Chang S W, Dineva P, Ismail K, Juncu G, Reis P. 3D Heat Transfer Analysis of a Miniature Copper-Water Vapor Chamber with Wicked Pillars Array. ISRN MECHANICAL ENGINEERING[J]. 2013, 第 4 作者[47] Li, Ji. A compound thermodynamic model for transient bubble growth in microscale. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2013, 第 1 作者 通讯作者 65: 739-749, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2013.07.004.[48] Li, Ji, Shi, Zhongshan. 3D numerical optimization of a heat sink base for electronics cooling. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER[J]. 2012, 第 1 作者 通讯作者 39(2): 204-208, http://dx.doi.org/10.1016/j.icheatmasstransfer.2011.12.001.[49] 李骥, 史忠山. 铜铝微通道热沉的三维数值结构优化. 机械工程学报[J]. 2012, 第 1 作者48(16): 102-109, http://lib.cqvip.com/Qikan/Article/Detail?id=43337580.[50] 姜勇, 李骥. 均热板散热器的数值分析与结构优化. 中国科学院研究生院学报[J]. 2012, 第 2 作者29(2): 169-174, http://lib.cqvip.com/Qikan/Article/Detail?id=41045433.[51] 李骥. 均热板散热器的数值研究和结构优化. 中国科学院研究生院学报. 2012, 第 1 作者 通讯作者 [52] Li, Ji, Wang, Daming, Peterson, G P Bud. A Compact Loop Heat Pipe with Flat Square Evaporator for High Power Chip Cooling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2011, 第 1 作者 通讯作者 1(4): 519-527, https://www.webofscience.com/wos/woscc/full-record/WOS:000292827500007.[53] 李骥, 史忠山. 电子冷却热沉基板的三维数值优化. 电力电子技术[J]. 2011, 第 1 作者45(12): 109-111, http://lib.cqvip.com/Qikan/Article/Detail?id=40369250.[54] Li, Ji, Peterson, G P. 3D heat transfer analysis in a loop heat pipe evaporator with a fully saturated wick (vol 54, pg 564, 2011). INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. 2011, 第 1 作者 通讯作者 54(17-18): 4152-4152, https://www.webofscience.com/wos/woscc/full-record/WOS:000292360500037.[55] Li, Ji, Peterson, G P. 3D heat transfer analysis in a loop heat pipe evaporator with a fully saturated wick. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2011, 第 1 作者 通讯作者 54(1-3): 564-574, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.09.014.[56] 李骥. 环路热管蒸发器三维数值传热分析. International Journal of Heat and Mass Transfer. 2011, 第 1 作者[57] 姜勇, 李骥. 均热板散热器的实验研究与数值分析. 制冷学报[J]. 2011, 第 2 作者32(5): 20-24, http://lib.cqvip.com/Qikan/Article/Detail?id=39638785.[58] Li, Ji, Wang, Daming, Peterson, G P, ASME. DEVELOPMENT OF A ROBUST MINIATURE LOOP HEAT PIPE FOR HIGH POWER CHIP COOLING. PROCEEDINGS OF THE ASME MICRO/NANOSCALE HEAT AND MASS TRANSFER INTERNATIONAL CONFERENCE, VOL 3. 2010, 第 1 作者 通讯作者 347-354, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000290920600049.[59] Li, Ji, Wang, Daming, Peterson, G P. Experimental studies on a high performance compact loop heat pipe with a square flat evaporator. APPLIED THERMAL ENGINEERING[J]. 2010, 第 1 作者 通讯作者 30(6-7): 741-752, http://www.corc.org.cn/handle/1471x/2413582.[60] High Power Electronic Component: Review. Recent Patents on Engineering. 2008, [61] Li, J, Peterson, G P, Cheng, P. Dynamic characteristics of transient boiling on a square platinum microheater under millisecond pulsed heating. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2008, 51(1-2): 273-282, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2007.03.045.