基本信息
刘志权 男 博导 中国科学院深圳先进技术研究院
电子邮件： zqliu@siat.ac.cn
通信地址： 深圳市南山区西丽深圳大学城学苑大道1068号
邮政编码： 518055
电子邮件： zqliu@siat.ac.cn
通信地址： 深圳市南山区西丽深圳大学城学苑大道1068号
邮政编码： 518055
研究领域
长期从事与性能相关的材料结构及功能的显微组织表征和原位制备研究，目前研究重点为微电子材料和封装结构的制备、组织性能及服役可靠性。主要针对微电子材料及其互连界面和封装结构，进行材料微观结构与性能演化方面的应用基础研究。包括材料和界面结构的静态表征，以及在热，电，力作用下化合物转变和缺陷演化的动态过程，以从微观角度探讨材料和界面失效的相关机理，为提高微电子材料性能和互连界面可靠性提供理论依据和解决途径。具体包括：
1）新型微电子互连材料的开发与应用探索（电子电镀）；
2）锡基无铅互连界面的微观组织演变与失效机制研究；
3）高密度封装结构的多场服役可靠性评价；
4）材料表面与界面的原子结构表征及原位相变观察。
招生信息
欢迎材料学、材料加工工程、物理化学、材料化学、微电子等相关专业，具有进取精神且动手能力强的优秀学生加盟。
招生专业
085600-材料与化工
070304-物理化学
0703J1-纳米科学与技术
070304-物理化学
0703J1-纳米科学与技术
招生方向
金属电子封装材料；先进封装技术
失效机理与可靠性评价
先进封装技术
失效机理与可靠性评价
先进封装技术
教育经历
1996-09--2000-04 大连海事大学 研究生，工学博士
1993-09--1996-07 大连铁道学院 研究生，工学硕士
1989-09--1993-07 吉林工业大学 本科，工学学士
1993-09--1996-07 大连铁道学院 研究生，工学硕士
1989-09--1993-07 吉林工业大学 本科，工学学士
工作经历
2000年4月博士毕业后赴日本留学，2006年12月回国工作加盟中国科学院，任研究员、课题组长、博士生导师工作至今。
工作简历
2019-03~现在, 中国科学院深圳先进技术研究院, 研究员
2006-12~2019-03,中国科学院金属研究所, 研究员
2002-07~2006-12,日本国立材料科学研究所（NIMS, Japan）, 特别研究员
2000-09~2002-06,日本冈山理科大学（Okayama University of Science, Japan）, 博士后
1996-07~2000-09,大连铁道学院, 助教，讲师
2006-12~2019-03,中国科学院金属研究所, 研究员
2002-07~2006-12,日本国立材料科学研究所（NIMS, Japan）, 特别研究员
2000-09~2002-06,日本冈山理科大学（Okayama University of Science, Japan）, 博士后
1996-07~2000-09,大连铁道学院, 助教，讲师
社会兼职
2015-08-15-今,国家集成电路标准化总体工作组, 成员
2012-08-15-今,中国电子学会电子制造与封装技术分会, 理事
2012-08-15-今,中国电子学会电子制造与封装技术分会, 理事
教授课程
透射电子显微学及其在材料科学中的应用
出版信息
截至2021年6月在包括Nature，Science，ACS Catalyst，Phys. Rev. Lett.，Acta Mater.，Nanotechnology等国际杂志上发表期刊论文160余篇，SCI收录130余篇（JCR1区60余篇），第一作者/通讯作者80余篇，被他人引用4500余次。另发表EI收录国际会议论文40余篇，在国际会议上做邀请报告10余次。获授权中国发明专利25项、日本发明专利1项及美国发明专利1项，另申请受理中国发明专利13项。
发表论文
[1] Xiao Lu, Liang Zhang, ZhiQuan Liu, LiYin Gao, Chen Chen, ChuanJiang Wu, Xi Huang, Kai Deng. Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering. MATERIALS CHARACTERIZATION. 2024, 第 3 作者 通讯作者 208: http://dx.doi.org/10.1016/j.matchar.2024.113668.
[2] Minghui Zhang, LiYin Gao, YuXi Wang, Wei Dong, Ning Zhao, ZhiQuan Liu. Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding. APPLIED SURFACE SCIENCE. 2024, 第 6 作者 通讯作者 650: http://dx.doi.org/10.1016/j.apsusc.2023.159184.
[3] 李培峰, 张光杰, 康卓, 郑鑫, 谢勇, 梁春园, 张奕志, 方晓阳, 孙蓉, 刘志权, 卜叶强, 陆洋, 张跃. Natural Overlaying Behaviors Push the Limit of Planar Cyclic Deformation Performance in Few-Layer MoS2 Nanosheets. INFOMAT[J]. 2023, 第 10 作者https://onlinelibrary.wiley.com/doi/full/10.1002/inf2.12457.
[4] Zhang, Minghui, Gao, LiYin, Li, JunJie, Sun, Rong, Liu, ZhiQuan. Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper. MATERIALS CHEMISTRY AND PHYSICS[J]. 2023, 第 5 作者 通讯作者 306: http://dx.doi.org/10.1016/j.matchemphys.2023.128089.
[5] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Cu Nanowires by Template Electrodeposition and Their Application in Pressure Sensors. JOURNAL OF ELECTRONIC MATERIALS. 2023, 第 3 作者 通讯作者 http://dx.doi.org/10.1007/s11664-023-10317-w.
[6] 谌可馨, 高丽茵, 许增光, 李哲, 刘志权. 先进封装中硅通孔（TSV）铜互连电镀研究进展. 科技导报[J]. 2023, 第 5 作者41(5): 15-26, http://lib.cqvip.com/Qikan/Article/Detail?id=7109345449.
[7] Huang, Jing, Gao, LiYin, Peng, ZhenJia, Li, Zhe, Liu, ZhiQuan, Sun, Rong. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL). NANOTECHNOLOGY[J]. 2023, 第 5 作者 通讯作者 34(1):
[8] 张明辉, 高丽茵, 刘志权, 董伟, 赵宁. 先进封装铜-铜直接键合技术的研究进展. 电子与封装[J]. 2023, 第 3 作者 通讯作者 58-68, https://kns.cnki.net/kcms2/article/abstract?v=M9N_p6ifsvPwHQJCh9nZFzdsu1whRcikBXDHMrIv0KHl8mJVabCcAL6ZrViZpMNcLpNvmMGwHOB2dL9LWBNAeGKDJvoRw4y7cHDMPbZUc_FMRRJeU4vYiPb7r0E1OZK-&uniplatform=NZKPT&language=gb.
[9] Li, Qihai, Zhao, Wei, Zhang, Wei, Chen, Weiwei, Liu, Zhiquan. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution. INTERNATIONAL JOURNAL OF FATIGUE[J]. 2023, 第 5 作者167: http://dx.doi.org/10.1016/j.ijfatigue.2022.107356.
[10] 王玉玺, 高丽茵, 万永强, 李哲, 刘志权. 应用于大马士革工艺的纳米孪晶铜脉冲电沉积研究. 电化学(中英文). 2023, 第 5 作者29(8): 21-30, http://lib.cqvip.com/Qikan/Article/Detail?id=7110528360.
[11] Sun, Baorui, Zhang, Minghui, Li, Junjie, Li, Zhe, Wen, Mingli, Liu, ZhiQuan. Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?. JOURNAL OF ELECTRONIC MATERIALS[J]. 2023, 第 6 作者52(11): 7475-7483, http://dx.doi.org/10.1007/s11664-023-10677-3.
[12] KeXin Chen, LiYin Gao, Zhe Li, Rong Sun, ZhiQuan Liu. Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging. MATERIALS[J]. 2023, 第 5 作者16(13): https://doaj.org/article/e74986c560404d5988747b7a3af8312d.
[13] Liu, XingQuan, Li, Zhe, Peng, ZhenJia, Wang, RuiXun, Liu, ZhiQuan. Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium. METALS AND MATERIALS INTERNATIONAL. 2023, 第 5 作者 通讯作者 http://dx.doi.org/10.1007/s12540-023-01489-5.
[14] Chen YinBo, Gao ZhaoQing, Liu ZhiQuan. Temperature gradient induced orientation change of Bi grains in Sn-Bi57-Ag0.7 solder joint. Acta Metall. Sin.-Eng. Lett.[J]. 2022, 第 3 作者 通讯作者
[15] Luo RD, Yu XL, Wu Z, Zhang H, Liu ZhiQuan, Katsuaki Suganuma, Li CaiFu. Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment. Materials Letters: X[J]. 2022, 第 5 作者13: 100124,
[16] Chen Yinbo, Wang Changchang, Gao Yue, Gao Zhaoqing, Liu ZhiQuan. Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling. J. Mater. Sci.: Mater. Electron.[J]. 2022, 第 5 作者 通讯作者 33(4): 1942-1952,
[17] Li-Yin Gao, Liu, Zhi-Quan. Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor. IEEE Transactions on Magnetics[J]. 2022, 第 2 作者 通讯作者
[18] Zhou, Shiqi, Zhang, YuBo, Gao, LiYin, Li, Zhe, Liu, ZhiQuan. The self-healing of Kirkendall voids on the interface between Sn and (111) oriented nanotwinned Cu under thermal aging. APPLIED SURFACE SCIENCE[J]. 2022, 第 5 作者 通讯作者 588:
[19] 高丽茵, 李财富, 刘志权, 孙蓉. 先进电子封装中焊点可靠性的研究进展. 机械工程学报[J]. 2022, 第 3 作者 通讯作者
[20] Guo Rumeng, Xiao Yubo, Gao Yue, Zhou Shiqi, Liu ZhiQuan. Interfacial enhancement of Ag and Cu particles sintering using <111>-oriented nanotwinned Cu as substrate for die-attachment. China Welding[J]. 2022, 第 5 作者 通讯作者 31(1): 22-28,
[21] Gao, Yue, Xiao, Yubo, Liu, ZhiQuan, Liu, Yang, Sun, Rong. Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors. JOURNALOFMATERIALSSCIENCEMATERIALSINELECTRONICS[J]. 2022, 第 3 作者 通讯作者 33(7): 3576-3585, http://dx.doi.org/10.1007/s10854-021-07551-5.
[22] Gao, Yue, Jiu, Jinting, Chen, Chuantong, Suganuma, Katsuaki, Sun, Rong, Liu, ZhiQuan. Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test. Journal of Materials Sciences and Technology[J]. 2022, 第 6 作者 通讯作者 115: 251-255, https://www.jmst.org/EN/10.1016/j.jmst.2021.10.047.
[23] Gao, LiYin, Luo, YiXiu, Wan, Peng, Liu, ZhiQuan. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints. MATERIALS CHARACTERIZATION[J]. 2021, 第 4 作者 通讯作者 178: http://dx.doi.org/10.1016/j.matchar.2021.111195.
[24] 黄静, 李忠国, 高丽茵, 李晓, 李哲, 刘志权, 孙蓉. 亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响. 集成技术[J]. 2021, 第 6 作者 通讯作者 10(1): 55-62, http://lib.cqvip.com/Qikan/Article/Detail?id=7103981244.
[25] Chen, Yinbo, Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints. JOURNALOFMATERIALSSCIENCEMATERIALSINELECTRONICS[J]. 2021, 第 4 作者 通讯作者 32(2): 2172-2186, https://www.webofscience.com/wos/woscc/full-record/WOS:000604092100027.
[26] Gao, LiYin, Wan, Peng, Liu, ZhiQuan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 第 3 作者 通讯作者 498: http://dx.doi.org/10.1016/j.jmmm.2019.166131.
[27] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder. MATERIALS CHARACTERIZATION[J]. 2020, 第 3 作者 通讯作者 163: http://dx.doi.org/10.1016/j.matchar.2020.110278.
[28] Gao, LiYin, Wen, Jian, Li, CaiFu, Chen, Chunhuan, Liu, ZhiQuan. The effect of finish layer on the interfacial cracking failure of Au-Si bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 第 5 作者 通讯作者 115: https://www.webofscience.com/wos/woscc/full-record/WOS:000554882700004.
[29] 高丽茵, 李财富, 曹丽华, 刘志权. 热电耦合作用下功率器件引脚开裂的机理. 科学通报[J]. 2020, 第 4 作者 通讯作者 65(20): 2169-2177, http://lib.cqvip.com/Qikan/Article/Detail?id=7102508376.
[30] Robertson, Stuart, Doak, Scott, Sun, FuLong, Liu, ZhiQuan, Liu, Changqing, Zhou, Zhaoxia. Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters. JOURNAL OF MICROSCOPY[J]. 2020, 第 4 作者 通讯作者 279(3): 212-216, https://www.webofscience.com/wos/woscc/full-record/WOS:000560435100011.
[31] Tian, Feifei, Pang, Xueyong, Xu, Bo, Liu, ZhiQuan. Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 第 4 作者 通讯作者 49(4): 2651-2659, https://www.webofscience.com/wos/woscc/full-record/WOS:000505344800016.
[32] Yang, LinLin, Chen, Chunhuan, Yuan, Jie, Gao, LiYin, Shang, Zhengang, Liu, ZhiQuan. Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 第 6 作者 通讯作者 495: http://dx.doi.org/10.1016/j.jmmm.2019.165872.
[33] 姜霖, 张亮, 刘志权. Al中间层和Ni（V）过渡层对Co/Al/Cu三明治结构靶材背板组件焊接残余应力的影响. 金属学报[J]. 2020, 第 3 作者 通讯作者 56(10): 1433-1440, http://lib.cqvip.com/Qikan/Article/Detail?id=7103074124.
[34] Jiang Lin, Zhang Liang, Liu Zhiquan. Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly. ACTA METALLURGICA SINICA[J]. 2020, 第 3 作者 通讯作者 56(10): 1433-1440, https://www.webofscience.com/wos/woscc/full-record/WOS:000571986900013.
[35] ChangchangWang, YinboChen, ZhiQuanLiu. Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging. Acta Metallurgica Sinica (English Letters)[J]. 2020, 第 3 作者 通讯作者 33(10): 1388-1396, https://www.amse.org.cn/EN/10.1007/s40195-020-01059-3.
[36] Du, Yahong, Gao, LiYin, Yu, Daquan, Liu, ZhiQuan. Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 第 4 作者 通讯作者 31(4): 2967-2975, https://www.webofscience.com/wos/woscc/full-record/WOS:000514597300023.
[37] Gao, LiYin, Cui, XianWei, Tian, FeiFei, Liu, ZhiQuan. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 第 4 作者 通讯作者 49(10): 6223-6231, https://www.webofscience.com/wos/woscc/full-record/WOS:000559506500003.
[38] Chen, Chuantong, Gao, Yue, Liu, ZhiQuan, Suganuma, Katsuaki. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste. SCRIPTA MATERIALIA[J]. 2020, 第 3 作者179: 36-39, http://dx.doi.org/10.1016/j.scriptamat.2019.12.040.
[39] LiYin Gao, Jian Wen, CaiFu Li, Chunhuan Chen, ZhiQuan Liu. The effect of finish layer on the interfacial cracking failure of AusbndSi bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 第 5 作者 通讯作者 115: http://dx.doi.org/10.1016/j.engfailanal.2020.104682.
[40] Meng, Zhichao, Wen, Ming, Liu, ZhiQuan, IEEE. Interfacial microstructure of NiPt/SnIn/Cu sputtering target assembly after soldering. 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)[J]. 2020, 第 3 作者 通讯作者 http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000629072600020.
[41] Liu, ZhiQuan, Meng, ZhiChao, Wu, Di, Shang, Zhengang, He, Xin, Xiong, Xiaodong. The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering. MICROELECTRONICS RELIABILITY[J]. 2020, 第 1 作者 通讯作者 113: http://dx.doi.org/10.1016/j.microrel.2020.113906.
[42] Zhang, Liang, Liu, Zhiquan. Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 mu m). JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 第 2 作者31(3): 2466-2480, https://www.webofscience.com/wos/woscc/full-record/WOS:000505378900009.
[43] Yuan, Jie, Qian, Xitang, Meng, Zhichao, Yang, Bo, Liu, ZhiQuan. Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation. ACS APPLIED MATERIALS & INTERFACES[J]. 2019, 第 5 作者 通讯作者 11(19): 17915-17924, https://www.webofscience.com/wos/woscc/full-record/WOS:000468364500087.
[44] Jiang, Nan, Zhang, Liang, Liu, ZhiQuan, Sun, Lei, Long, WeiMin, He, Peng, Xiong, MingYue, Zhao, Meng. Reliability issues of lead-free solder joints in electronic devices. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS[J]. 2019, 第 3 作者20(1): 876-901, https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd.
[45] Li, CaiFu, Li, Wanli, Zhang, Hao, Liu, Jinting, Yang, Yang, Li, Lingying, Gao, Yue, Liu, ZhiQuan, Suganuma, Katsuaki. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics. ACS APPLIED MATERIALS & INTERFACES[J]. 2019, 第 8 作者11(3): 3231-3240, http://dx.doi.org/10.1021/acsami.8b19069.
[46] Zhao, Meng, Zhang, Liang, Liu, Zhiquan, Xiong, Mingyue, Sun, Lei, Jiang, Nan, Xu, Kaikai. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 第 3 作者30(16): 15054-15063, http://dx.doi.org/10.1007/s10854-019-01878-w.
[47] 曹丽华, 陈胤伯, 史起源, 远杰, 刘志权. 合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响. 金属学报[J]. 2019, 第 5 作者 通讯作者 55(12): 1606-1614, http://lib.cqvip.com/Qikan/Article/Detail?id=7100512058.
[48] Du, Yahong, Wen, Ming, Ji, Hongjun, Li, Mingyu, Liu, ZhiQuan. Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 第 5 作者 通讯作者 30(14): 12840-12850, https://www.webofscience.com/wos/woscc/full-record/WOS:000476518000002.
[49] Zhao, Meng, Zhang, Liang, Liu, ZhiQuan, Xiong, MingYue, Sun, Lei. Structure and properties of Sn-Cu lead-free solders in electronics packaging. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS[J]. 2019, 第 3 作者20(1): 421-444, https://doaj.org/article/49b2e7c58c3244c0983f1912552d4cf3.
[50] Cao Lihua, Chen Yinbo, Shi Qiyuan, Yuan Jie, Liu Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder. ACTAMETALLURGICASINICA[J]. 2019, 第 5 作者 通讯作者 55(12): 1606-1614,
[51] Li, Qihai, Li, CaiFu, Zhang, Wei, Chen, Weiwei, Liu, ZhiQua. Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling. MICROELECTRONICS RELIABILITY[J]. 2019, 99: 12-18, http://dx.doi.org/10.1016/j.microrel.2019.05.015.
[52] Jiang, Nan, Zhang, Liang, Liu, Zhiquan, Sun, Lei, Xiong, Mingyue, Zhao, Meng, Xu, Kaikai. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 第 3 作者30(19): 17583-17590, https://www.webofscience.com/wos/woscc/full-record/WOS:000490120000006.
[53] LintJiang, LiangtZhang, ZhiQuantLiu. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method. Acta Metallurgica Sinica (English Letters)[J]. 2019, 32(11): 1407-1414, https://www.amse.org.cn/EN/10.1007/s40195-019-00875-6.
[54] Yuan, Jie, Li, CaiFu, Yang, Bo, Liu, ZhiQuan. The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles. MATERIALS CHARACTERIZATION[J]. 2018, 第 4 作者 通讯作者 136: 94-99, http://dx.doi.org/10.1016/j.matchar.2017.12.008.
[55] Du, Yahong, Liu, ZhiQuan, Ji, Hongjun, Li, Mingyu, Wen, Ming. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2018, 第 2 作者 通讯作者 29(16): 13774-13781, https://www.webofscience.com/wos/woscc/full-record/WOS:000439338500038.
[56] Shi, QiYuan, Liu, ZhiQuan, Wu, Di, Zhang, Hao, Ni, DingRui, Suganuma, Katsuaki. Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2018, 第 2 作者 通讯作者 29(10): 8371-8379, https://www.webofscience.com/wos/woscc/full-record/WOS:000430496800048.
[57] Wang, Jing, Chen, Guang, Sun, Fulong, Zhou, Zhaoxia, Liu, ZhiQuan, Liu, Changqing. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing. CORROSION SCIENCE[J]. 2018, 第 5 作者139: 383-394, http://dx.doi.org/10.1016/j.corsci.2018.05.020.
[58] Sun, FuLong, Gao, LiYin, Liu, ZhiQuan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Journal of Materials Sciences and Technology[J]. 2018, 第 3 作者 通讯作者 34(10): 1885-1890, https://www.jmst.org/EN/10.1016/j.jmst.2018.01.016.
[59] Gao, LiYin, Li, CaiFu, Wan, Peng, Zhang, Hao, Liu, ZhiQuan. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2018, 第 5 作者 通讯作者 739: 632-642, http://dx.doi.org/10.1016/j.jallcom.2017.12.328.
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[75] Gong, Lijun, Chen, Yuxi, Yu, Hongjiang, Liu, Hongbo, Li, Caifu, Liu, ZhiQuan. Carbon-coated Li4Ti5O12 Anode Materials Synthesized Using H2TiO3as Ti Source. Journal of Materials Sciences and Technology[J]. 2014, 第 6 作者30(11): 1092-1095, https://www.jmst.org/EN/10.1016/j.jmst.2014.02.002.
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发表著作
（1） 无铅软钎焊技术基础, Introduction to Lead-Free Soldering, 科学出版社, 2017-06, 第 1 作者
科研活动
承担及参加包括中国科学院人才项目、国家科技重大专项02集成电路封测项目、国家重大基础研究计划973项目、国家重点研发计划重点专项等10余项，开展产业合作与多家半导体或集成电路领域龙头企业开展项目合作十多年，培养研究生输送企业担任产业骨干十余名。与国际同行合作开发的三维透射电镜表征技术(3D-OMiTEM)入选2011年度美国材料学会焦点新闻，并荣获2012年度美国显微学会创新奖。
科研项目
（ 1 ） 重布线/嵌入式圆片级封装技术及高密度凸点技术研发及产业化—封装结构的力电热多场服役行为, 主持, 国家级, 2011-01--2013-12
（ 2 ） 透射电镜内电子材料多场耦合行为的动态观察研究, 主持, 部委级, 2008-01--2011-12
（ 3 ） 三维集成互连材料的服役损伤行为与多场失效特性, 主持, 国家级, 2010-01--2014-12
（ 4 ） 含稀贵金属高温合金的设计与应用的基础研究, 参与, 国家级, 2011-01--2014-12
（ 5 ） 大规格稀有/稀贵金属靶材制造技术, 主持, 国家级, 2017-07--2020-12
（ 6 ） 稀贵金属焊接/装联导电材料制备技术, 主持, 国家级, 2017-07--2020-12
（ 7 ） 共晶Sn-Bi基焊点的组织形貌及典型失效模式研究, 主持, 院级, 2018-05--2019-04
（ 8 ） 车载模块应用高可靠性合金风险评估技术合作项目, 主持, 院级, 2016-05--2017-04
（ 9 ） 高频软磁薄膜功率电感的制备与性能研究项目, 主持, 院级, 2015-05--2016-04
（ 10 ） 高质量NiFe磁性厚膜制备, 主持, 院级, 2018-10--2019-09
（ 11 ） 纳米孪晶Cu力学及RDL力学特性研究, 主持, 院级, 2019-12--2021-09
（ 12 ） SnBi低温锡膏微观组织研究, 主持, 院级, 2020-08--2021-07
（ 2 ） 透射电镜内电子材料多场耦合行为的动态观察研究, 主持, 部委级, 2008-01--2011-12
（ 3 ） 三维集成互连材料的服役损伤行为与多场失效特性, 主持, 国家级, 2010-01--2014-12
（ 4 ） 含稀贵金属高温合金的设计与应用的基础研究, 参与, 国家级, 2011-01--2014-12
（ 5 ） 大规格稀有/稀贵金属靶材制造技术, 主持, 国家级, 2017-07--2020-12
（ 6 ） 稀贵金属焊接/装联导电材料制备技术, 主持, 国家级, 2017-07--2020-12
（ 7 ） 共晶Sn-Bi基焊点的组织形貌及典型失效模式研究, 主持, 院级, 2018-05--2019-04
（ 8 ） 车载模块应用高可靠性合金风险评估技术合作项目, 主持, 院级, 2016-05--2017-04
（ 9 ） 高频软磁薄膜功率电感的制备与性能研究项目, 主持, 院级, 2015-05--2016-04
（ 10 ） 高质量NiFe磁性厚膜制备, 主持, 院级, 2018-10--2019-09
（ 11 ） 纳米孪晶Cu力学及RDL力学特性研究, 主持, 院级, 2019-12--2021-09
（ 12 ） SnBi低温锡膏微观组织研究, 主持, 院级, 2020-08--2021-07