080903-微电子学与固体电子学
080902-电路与系统
0805Z2-半导体材料与器件

先进封装，系统集成

   

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[5] 苏梅英, 万里兮, 曹立强, 陆原, 王启东, 周云燕. 一种TSV孔内介质层的电学性能检测方法. 中国: CN104459420A, 2015-03-25.
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[1] Chen, Chuan, Su, Meiying, Ma, Rui, Zhou, Yunyan, Li, Jun, Cao, Liqiang. Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process. MATERIALS[J]. 2022, 15(5): http://dx.doi.org/10.3390/ma15051683.
[2] Rongwei Gao; Rui Ma; Jun Li; Meiying Su; Fengze Hou; Liqiang Cao. selection and characteriazation of photosensitive polyimide for fan-out wafer-level packaging. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2022, 12(2): 368-374, [3] Chen, Chuan, Hou, Fengze, Ma, Rui, Su, Meiying, Li, Jun, Cao, Liqiang. Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip. APPLIEDTHERMALENGINEERING[J]. 2021, 198: http://dx.doi.org/10.1016/j.applthermaleng.2021.117457.
[4] Hou, Fengze, Wang, Wenbo, Ma, Rui, Li, Yonghao, Han, Zhonglin, Su, Meiying, Li, Jun, Yu, Zhongyao, Song, Yang, Wang, Qidong, Chen, Min, Cao, Liqiang, Zhang, Guoqi, Ferreira, Braham. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS[J]. 2020, 8(1): 367-380, [5] Hou, Fengze, Wang, Wenbo, Cao, Liqiang, Li, Jun, Su, Meiying, Lin, Tingyu, Zhang, Guoqi, Ferreira, Braham. Review of Packaging Schemes for Power Module. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICSnull. 2020, 8(1): 223-238, http://dx.doi.org/10.1109/JESTPE.2019.2947645.
[6] Chen, Chuan, Su, Meiying, Ma, Rui, Hou, Fengze, Cao, Liqiang, Li, Jun. Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2020, 10(6): 1000-1009, http://dx.doi.org/10.1109/TCPMT.2020.2982012.
[7] Chen, Chuan, Hou, Fengze, Su, Meiying, Ma, Rui, Li, Jun, Cao, Liqiang. Pressure Drop and Thermal Characteristic Prediction for Staggered Strip Fin Microchannel. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2020, 10(3): 435-443, https://www.webofscience.com/wos/woscc/full-record/WOS:000520493900010.
[8] 宗小雪, 苏梅英, 周云燕, 马瑞, 曹立强. 基于扇出型封装塑封材料性能的表征研究. 电子元件与材料[J]. 2020, 39(5): 90-96, http://lib.cqvip.com/Qikan/Article/Detail?id=7101789962.
[9] 马瑞, 苏梅英, 刘晓芳, 王旭刚, 曹立强. TSV电迁移影响因素的有限元分析. 电子元件与材料[J]. 2019, 38(2): 93-97, http://lib.cqvip.com/Qikan/Article/Detail?id=7001367907.
[10] 苏梅英, 高溶唯, 李君, 曹立强. 基于系统级扇出封装热管理仿真分析. 电力电子技术[J]. 2018, 52(8): 52-55, http://lib.cqvip.com/Qikan/Article/Detail?id=676038596.
[11] Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian. Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. MICROELECTRONICS RELIABILITY. 2018, 83: 29-38, http://dx.doi.org/10.1016/j.microrel.2018.02.010.
[12] Su, Meiying, Cao, Liqiang, Lin, Tingyu, Chen, Feng, Li, Jun, Chen, Cheng, Tian, Gengxin. Warpage simulation and experimental verification for 320 mm x 320 mm panel level fan-out packaging based on die-first process. MICROELECTRONICS RELIABILITY[J]. 2018, 83: 29-38, https://www.webofscience.com/wos/woscc/full-record/WOS:000430782200004.
[13] 苏梅英, 陆原, 万里兮, 侯峰泽, 张霞, 郭学平. 基于三维多芯片柔性封装的热应力分析. 现代电子技术[J]. 2015, 38(3): 141-143, http://lib.cqvip.com/Qikan/Article/Detail?id=663650279.
[14] Meiying Su, Daquan Yu, Yijun Liu, Lixi Wan, Chongshen Song, Fengwei Dai, Kai Xue, Xiangmeng Jing, Daniel Guidotti. Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400 °C for through silicon via application. THIN SOLID FILMS. 2014, 550: 259-263, http://dx.doi.org/10.1016/j.tsf.2013.11.002.
[15] Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel. Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400 degrees C for through silicon via application. THIN SOLID FILMS[J]. 2014, 550: 259-263, https://www.webofscience.com/wos/woscc/full-record/WOS:000328499700040.
[16] Su MeiYing, Wang Jing, Yao PengJun, Du HaiYing. High Performance Humidity Sensor Based on Electrospun Zr0.9Mg0.1O2-delta Nanofibers. CHINESE PHYSICS LETTERS[J]. 2012, 29(11): [17] Du, Haiying, Wang, Jing, Su, Meiying, Yao, Pengjun, Zheng, Yangong, Yu, Naisen. Formaldehyde gas sensor based on SnO2/In2O3 hetero-nanofibers by a modified double jets electrospinning process. SENSORS AND ACTUATORS B-CHEMICAL[J]. 2012, 166: 746-752, http://dx.doi.org/10.1016/j.snb.2012.03.055.
[18] 姚朋军, 王兢, 赵林, 戚金清, 苏梅英. 水热合成法制备La_（0.7）Sr_（0.3）FeO_3纳米线的合成机理研究. 功能材料[J]. 2012, 43(8): 969-972, http://lib.cqvip.com/Qikan/Article/Detail?id=41694522.
[19] 苏梅英, 王兢, 姚朋军, 杜海英. High Performance Humidity Sensor Based on Electrospun Zr_(0.9)Mg_(0.1)O_(2−δ) Nanofibers. 中国物理快报:英文版[J]. 2012, 29(11): 110701-1, http://lib.cqvip.com/Qikan/Article/Detail?id=7105359518.
[20] Su, Meiying, Wang, Jing, Du, Haiying, Yao, Pengjun, Zheng, Yangong, Li, Xiaogan. Characterization and humidity sensitivity of electrospun ZrO2:TiO2 hetero-nanofibers with double jets. SENSORS AND ACTUATORS B-CHEMICAL[J]. 2012, 161(1): 1038-1045, http://dx.doi.org/10.1016/j.snb.2011.12.005.
[21] Su, Meiying, Wang, Jing. Preparation and Humidity Sensitivity of Multi-Layered Zirconia Thin Films by Sol-Gel Method. SENSOR LETTERS[J]. 2011, 9(2): 670-674, https://www.webofscience.com/wos/woscc/full-record/WOS:000294372500041.
[22] 苏梅英, 王兢, 姚朋军, 李晓干, 郝育闻. ZrO2：TiO2复合纳米纤维湿度传感器的直、交流特性研究. 传感技术学报[J]. 2011, 24(12): 1681-1686, http://lib.cqvip.com/Qikan/Article/Detail?id=40451370.
[23] Wang, Jing, Su, MeiYing, Qi, JinQing, Chang, LingQian. Sensitivity and complex impedance of nanometer zirconia thick film humidity sensors. SENSORS AND ACTUATORS B-CHEMICAL[J]. 2009, 139(2): 418-424, http://dx.doi.org/10.1016/j.snb.2009.03.070.

   

（ 1 ） 先进封装材料(MUFCUFLMC)性能分析及DOE仿真分析, 主持, 院级, 2021-02--2022-02
（ 2 ） 多芯片处理ZH集成, 参与, 国家级, 2020-12--2022-12