基本信息
王家畴  男  硕导  中国科学院上海微系统与信息技术研究所
电子邮件: jiatao-wang@mail.sim.ac.cn
通信地址: 上海市长宁路865号
邮政编码:

招生信息

   
招生专业
080903-微电子学与固体电子学
招生方向
微纳传感器及其制造技术

教育背景

2005-03--2008-10   哈尔滨工业大学   博士学位

工作经历

   
工作简历
2008-11~现在, 中科院上海微系统与信息技术研究所, 研究员
2005-03~2008-10,哈尔滨工业大学, 博士学位
社会兼职
2021-07-10-2026-07-10,中国微米纳米技术学会微纳机器人分会, 理事

专利与奖励

   
专利成果
( 1 ) 气液两用热式流量传感器及其制作方法, 2021, 第 1 作者, 专利号: CN113295224A

( 2 ) 热堆式气体质量流量传感器及其制备方法, 2021, 第 1 作者, 专利号: CN112484800A

( 3 ) 热堆式气体质量流量传感器及其制造方法, 2021, 第 1 作者, 专利号: CN112461312A

( 4 ) 高灵敏度加速度传感器结构的制作方法, 2019, 第 2 作者, 专利号: CN110182753A

( 5 ) 热堆式气体质量流量传感器及其制备方法, 2019, 第 1 作者, 专利号: CN110146136A

( 6 ) 高灵敏度加速度传感器结构的制备方法, 2019, 第 1 作者, 专利号: CN110040682A

( 7 ) 一种热式气体流量传感器及其制备方法, 2017, 第 1 作者, 专利号: CN107345826A

( 8 ) 一种热电堆式气体流量传感器及其制备方法, 2017, 第 1 作者, 专利号: CN107328449A

( 9 ) 力敏薄膜厚度精确可控的差压传感结构及其制备方法, 2017, 第 3 作者, 专利号: CN106969874A

( 10 ) 单晶硅压力敏感膜片结构及其制作方法, 2017, 第 2 作者, 专利号: CN106477513A

( 11 ) 单芯片硅集成三轴高频宽高冲击加速度计及其制作方法, 2016, 第 3 作者, 专利号: CN106053881A

( 12 ) 一种微悬臂谐振结构传感器及其制造方法, 2015, 第 4 作者, 专利号: CN105067471A

( 13 ) 加速度计内嵌压力传感器的单硅片复合传感器结构及方法, 2015, 第 1 作者, 专利号: CN104793015A

( 14 ) (111)单硅片集成的三轴微机械加速度传感器及制作方法, 2015, 第 2 作者, 专利号: CN104483511A

( 15 ) 偏离(111)硅片解理晶向的高强度悬臂梁结构及制作方法, 2015, 第 2 作者, 专利号: CN104445044A

( 16 ) 基于(111)单晶硅片的高谐振频率高冲击加速度计及制作方法, 2015, 第 3 作者, 专利号: CN104316725A

( 17 ) 封装应力与温漂自补偿的双悬浮式力敏传感器芯片及制备方法, 2014, 第 2 作者, 专利号: CN104236766A

( 18 ) 一种消除封装应力的悬浮式力敏传感器芯片及其制作方法, 2014, 第 2 作者, 专利号: CN103674355A

( 19 ) 适于表面贴装封装的单硅片微流量传感器及其制备方法, 2013, 第 1 作者, 专利号: CN103185612A

( 20 ) 适于表面贴装封装的单硅片微流量传感器及其制作方法, 2013, 第 2 作者, 专利号: CN103185613A

( 21 ) 加速度和压力传感器单硅片集成芯片及制作方法, 2012, 第 2 作者, 专利号: CN102476786A

( 22 ) 在单硅片上单面微加工制作的悬臂梁加速度传感器及方法, 2011, 第 2 作者, 专利号: CN101968495A

( 23 ) 嵌入式单晶硅腔体的六边形硅膜压阻式压力传感器及方法, 2010, 第 1 作者, 专利号: CN101881676A

出版信息

   
发表论文
(1) Tiny-size ultra-sensitive thermal gas flow sensor with n+Si-p+Si thermopile single-side micromachined in a single non-SOI silicon wafer, MEMS 2022, 2022, 通讯作者
(2) SINGLE (111)-WAFER FABRICATION OF 100-μM SCALE THERMOPILE/ABSORBER DOUBLEDECK STRUCTURE FOR HIGH-DETECTIVITY IR-DETECTION, Transducers2021, 2021, 通讯作者
(3) Silicon monolithic microflow sensors: a review, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2021, 第 1 作者
(4) Silicon-chip based electromagnetic vibration energy harvesters fabricated using wafer-level micro-casting technique, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2021, 第 3 作者
(5) AN ENERGY HARVESTING SCHEME WITH TEMPERATURE THRESHOLD TRIGGERED GENERATION FOR HEAT EVENT AUTONOMOUS MONITORING, Transducers2021, 2021, 第 4 作者
(6) 100-μm-Scale High-Detectivity Infrared Detection with Thermopile/Absorber Double-Deck Structure Formed in (111) Silicon, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 通讯作者
(7) “0.5MM_0.5MM HIGH-TEMPERATURE PRESSURE SENSORS FABRICATED WITH IC-FOUNDRY-COMPATIBLE PROCESS IN (100)/ (111) HYBRID SOI WAFERS, Transducers 2021, 2021, 通讯作者
(8) MONOTHIC INTEGRATION OF PRESSURE PLUS Z-AXIS ACCELERATION COMPOSITE TPMS SENSORS WITH 1.0MMx1.0MM CHIP-SIZE AND 0.09$/DIE FABRICATION-COST, 2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020), 2020, 通讯作者
(9) SENSITIVITY IMPROVEMENT OF PSI/AU THERMOPILE-BASED GAS FLOW SENSOR BY OPTIMIZING HEAT-SINK AND THERMAL-INSULATION CONFIGURATION, 2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020), 2020, 通讯作者
(10) Highly Sensitive p(+)Si/Al Thermopile-Based Gas Flow Sensors by Using Front-Sided Bulk Micromachining Technology, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 通讯作者
(11) Ultra-small pressure sensors fabricated using a scar-free microhole inter-etch and sealing (MIS) process, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2020, 第 3 作者
(12) A Front-Side Microfabricated Thermoresistive Gas Flow Sensors for High-Performance, Low-Cost and High-Yield Volume Production, Micromachines, 2020, 通讯作者
(13) Monothic integration of pressure plus Z-axis acceleration composite TPMS sensor with 1.0mm×1.0mm chip-size and 0.09$/die fabrication cost, IEEE MEMS 2020, 2020, 通讯作者
(14) High Fill Factor Array of Piezoelectric Micromachined Ultrasonic Transducers with Large Quality Factor, SENSORS AND MATERIALS, 2020, 第 3 作者
(15) p+Si/Au热电堆式气体流量传感器一维模型及其应用, Theoretical and Application of a 1-D Model of p+Si/Au Thermopile-Based Gas Flow Sensor, 传感技术学报, 2020, 通讯作者
(16) A novel thermopile-based gas flow sensor fabricated with a single-wafer-based front-sided bulk-micromachining technique, IEEE MEMS 2019, 2019, 通讯作者
(17) On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique, MICROMACHINES, 2019, 通讯作者
(18) A FRONT-SIDE MICRO-FABRICATED TINY-SIZE THERMORESISTIVE GAS FLOW SENSOR WITH LOW COST, HIGH SENSITIVITY, AND QUICK RESPONSE, 2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019, 通讯作者
(19) Single-Side Fabricated p(+)Si/Al Thermopile-Based Gas Flow Sensor for IC-Foundry-Compatible, High-Yield, and Low-Cost Volume Manufacturing, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 通讯作者
(20) A Front-Side Microfabricated Tiny-Size Thermopile Infrared Detector With High Sensitivity and Fast Response, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 第 3 作者
(21) A Single-Side Fabricated Triaxis (111)-Silicon Microaccelerometer With Electromechanical Sigma-Delta Modulation, IEEE SENSORS JOURNAL, 2018, 第 3 作者
(22) 单硅片单面硅微机械加工的热温差式流量传感器, The Single-Wafer Single-Side Silicon Bulk-Micromachined Thermal Flow Sensor, 传感技术学报, 2018, 通讯作者
(23) Sub-g weak-vibration-triggered high-efficiency energy harvesting for event identification, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2018, 第 4 作者
(24) MEMS MONOLITHIC TRI-AXIS HIGH-SHOCK ACCELEROMETERS WITH MHz-LEVEL ULTRA-HIGH RESONANT FREQUENCY, 30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017), 2017, 第 3 作者
(25) TINY-SIZED ULTRA-SENSITIVE INFRARED-THERMOPILE FABRICATED WITH A SINGLE-SIDED BULK-SILICON MICROMACHINING TECHNIQUE, 30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017), 2017, 第 4 作者
(26) High-Performance Low-Range Differential Pressure Sensors Formed With a Thin-Film Under Bulk Micromachining Technology, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2017, 第 2 作者
(27) Pressure +X/Z two-axis acceleration composite sensors monolithically integrated in non-SOI wafer for upgraded production of TPMS (Tire Pressure Monitoring System), IEEE MEMS 2017, 2017, 第 1 作者
(28) Monolithically integrated tri-axis shock accelerometers with MHz-level high resonant-frequency, Journal of micromechanics and microengineering: structures, devices and systems, 2017, 第 2 作者
(29) A Tri-Beam Dog-Bone Resonant Sensor With High-Q in Liquid for Disposable Test-Strip Detection of Analyte Droplet, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2016, 第 2 作者
(30) A novel TUB (thin-film under bulk) process for high-performance pressure sensors of sub-kPa measure-range, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, 第 1 作者
(31) Single-Side Fabrication of Multilevel 3-D Microstructures for Monolithic Dual Sensors, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2015, 第 1 作者
(32) A single-side microcavity–diaphragm–channel one-step formation method for low-cost and high-yield volume production of micro flow sensors, MICROELECTRONIC ENGINEERING, 2015, 通讯作者
(33) DOG-BONE RESONATOR WITH HIGH-Q IN LIQUID FOR LOW-COST QUICK 'TEST-PAPER' DETECTION OF ANALYTE DROPLET, 2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015), 2015, 第 3 作者
(34) A HIGH-PERFORMANCE P-IN-G SENSOR WITH MULTIPLE-LEVEL 3D MICRO-STRUCTURE FABRICATED FROM ONE SIDE OF SINGLE WAFER, 2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2015, 
(35) Length-extensional resonating gas sensors with IC-foundry compatible low-cost fabrication in non-SOI single-wafer, MICROELECTRONIC ENGINEERING, 2015, 第 3 作者
(36) A dual-unit pressure sensor for on-chip self-compensation of zero-point temperature drift, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2014, 第 1 作者
(37) On-chip integrated PS3 (Packaging-stress suppressed suspension) for thermal-stress free package of pressure sensors, IEEE MEMS2013, 2013, 第 1 作者
(38) 基于切割成型的侧壁表面压阻制作及其参数优化, Cutting and Shaping-Based Sidewall Surface Piezoresistor Fabrication and Its Parameters Optimization, 传感技术学报, 2013, 通讯作者
(39) Piezoresistive pressure Sensor with suspended dual-unit configuration for on-chip self-compensation and suppression of temperature drift, Transducers ’13 Conference, Barcelona, SPAIN, 2013, 第 1 作者
(40) Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2013, 第 1 作者
(41) 微创手术式硅微机械加工(MISSM)技术, The Minimally-Invasive-Surgery-Liked Silicon Micromachining(MISSM) Technology, 传感技术学报, 2012, 通讯作者
(42) Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 第 2 作者
(43) Monolithic Integration of Pressure Plus Acceleration Composite TPMS Sensors With a Single-Sided Micromachining Technology, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 第 1 作者
(44) 基于压电驱动的靶球筛选操作机理及实验研究, Research on the Filtrating Operation of Target Sphere based on the Control of Piezoelectric Actuator, 压电与声光, 2012, 第 5 作者
(45) MONOLITHIC-INTEGRATED SILICON BULK-MICROMACHINED ACCELEROMETER AND PRESSURE-SENSOR FOR TIRE-PRESSURE-MONITORING-SYSTEM (TPMS) APPLICATION, Transducers’11:The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, 2011, 第 1 作者
(46) A silicon-wafer-based single-sided bulk-micromachining technique for high-yield and low-cost volume production of pressure sensors, Transducers ’11 Conference, Beijing, CHINA, 2011, 第 1 作者
(47) Single-Side Fabricated Pressure Sensors for IC-Foundry-Compatible, High-Yield, and Low-Cost Volume Production, IEEE ELECTRON DEVICE LETTERS, 2011, 第 1 作者
(48) A single-wafer-based single-sided bulk-micromachining technique for high-yield and low-cost volume production of pressure sensors, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, 2011, 第 1 作者
(49) A High-Performance Dual-Cantilever High-Shock Accelerometer Single-Sided Micromachined in (111) Silicon Wafers, IEEE JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2010, 第 1 作者
(50) 侧壁压阻式力传感器的研制与标定, Design and Calibration of Sidewall Piezoresistive Force Sensor, 纳米技术与精密工程, 2010, 第 6 作者
(51) 硅基集成式微型平面纳米级定位平台控制, 第11届全国敏感元件与传感器学术会议论文集, 2009, 第 1 作者
(52) A silicon integrated micro nano-positioning XY-stage for nano-manipulation, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 通讯作者

科研活动

   
科研项目
( 1 ) 微腔-膜-沟道腐蚀自终止一次成型方法与单芯片单面加工的微流量传感器研究, 负责人, 国家任务, 2013-01--2015-12
( 2 ) 胎压监测系统(TPMS)用单片复合传感器芯片结构设计及工艺开发, 负责人, 地方任务, 2011-11--2013-09
( 3 ) TPMS技术开发, 参与, 国家任务, 2012-01--2014-12
( 4 ) 基于主动动态粘着控制的微尺度对象操作机理及方法研究, 参与, 国家任务, 2012-01--2014-12
( 5 ) 中美ASBIT”自主捕捉和检测有害细菌的谐振式微纳传感器技术, 参与, 国家任务, 2012-01--2014-12
( 6 ) XXX高冲击加速度计研究, 参与, 国家任务, 2011-01--2014-12
( 7 ) XXX模块微系统技术研究, 参与, 中国科学院计划, 2011-01--2015-12
( 8 ) 面向重大工程的安防工业传感网节点微能源研发与示范应用, 负责人, 国家任务, 2015-01--2017-12
( 9 ) MEMS单片集成器件规模制造技术基础研究, 参与, 国家任务, 2013-01--2015-08
( 10 ) 体硅下薄膜(TUB, Thinfilm Under Bulk)复合结构成型机理及其高性能器件研究, 负责人, 国家任务, 2017-01--2020-12
( 11 ) 硅基内三维体硅微结构成型机理及其单片集成多轴传感器研究, 负责人, 国家任务, 2021-04--2024-12
( 12 ) 中药智能检测传感器研究, 负责人, 国家任务, 2021-01--2023-12