发表论文
[1] Ruowei Zheng, Haojie Zhou, Chenxi Li, Ji Li. Synergistic phase change and heat conduction of low melting-point alloy microparticle additives in expanded graphite shape-stabilized organic phase change materials. CHEMICAL ENGINEERING JOURNAL. 2024, 第 4 作者 通讯作者 482: http://dx.doi.org/10.1016/j.cej.2024.149009.[2] 李骥. Toward extremely low thermal resistance with extremely low pumping power consumption for ultra-high heat flux removal on chip size scale. Energy Conversion and Management[J]. 2024, 第 1 作者 通讯作者 306: 118293, [3] Zhou, Haojie, Li, Ji. Development and analysis of a simple structured and economic miniature vapor compression refrigerator for cooling electronics in harsh environment. APPLIED THERMAL ENGINEERING[J]. 2023, 第 2 作者 通讯作者 223: http://dx.doi.org/10.1016/j.applthermaleng.2023.120047.[4] Li, Chenxi, Li, Ji. A dumbbell-shaped 3D flat plate pulsating heat pipe module augmented by capillarity gradient for high-power server CPU onsite cooling. ENERGY CONVERSION AND MANAGEMENT[J]. 2023, 第 2 作者 通讯作者 292: http://dx.doi.org/10.1016/j.enconman.2023.117384.[5] Haojie Zhou, Tong Tian, Xinyue Wang, Ji Li. Combining looped heat pipe and thermoelectric generator module to pursue data center servers with possible power usage effectiveness less than 1. APPLIED ENERGY. 2023, 第 4 作者 通讯作者 332: http://dx.doi.org/10.1016/j.apenergy.2022.120539.[6] Tian, Tong, Wang, Xinyue, Liu, Yang, Yang, Xuan, Sun, Bo, Li, Ji. Nano-engineering enabled heat pipe battery: A powerful heat transfer infrastructure with capability of power generation. APPLIED ENERGY[J]. 2023, 第 6 作者 通讯作者 348: http://dx.doi.org/10.1016/j.apenergy.2023.121520.[7] Li, Chenxi, Li, Ji. Thermal characteristics of a flat plate pulsating heat pipe module for onsite cooling of high power server CPUs. THERMAL SCIENCE AND ENGINEERING PROGRESS[J]. 2023, 第 2 作者 通讯作者 37: http://dx.doi.org/10.1016/j.tsep.2022.101542.[8] 李骥. Forced boiling of nonazeotropic immiscible mixture in a supercapillary microchannel array for ultra-high heat flux removal with chip junction temperature below 85°C. Sci China Tech Sci[J]. 2023, 第 1 作者[9] Yang Liu, Ji Li. A protocol to further improve the thermal conductivity of silicone-matrix thermal interface material with nano-fillers. THERMOCHIMICA ACTA[J]. 2022, 第 2 作者708: [10] Liu, Yang, Zheng, Ruowei, Tian, Tong, Li, Ji. Characteristics of thermal storage heat pipe charged with graphene nanoplatelets enhanced organic phase change material. ENERGY CONVERSION AND MANAGEMENT[J]. 2022, 第 4 作者 通讯作者 267: http://dx.doi.org/10.1016/j.enconman.2022.115902.[11] Sun, Bo, Wang, Huiru, Shi, Zhongshan, Li, Ji. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux. HEAT AND MASS TRANSFER[J]. 2022, 第 4 作者 通讯作者 58(2): 195-208, http://dx.doi.org/10.1007/s00231-021-03104-y.[12] 李骥. High latent heat phase change materials with low melting temperature for thermal management and storage: Critical Review. Renewable and Sustainable Energy Reviews[J]. 2022, 第 1 作者168: 112783, [13] Wang, Xinyue, Liu, Yang, Tian, Tong, Li, Ji. Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness. APPLIED ENERGY[J]. 2022, 第 4 作者 通讯作者 319: http://dx.doi.org/10.1016/j.apenergy.2022.119279.[14] Li, Xingping, Lv, Lucang, Wang, Xinyue, Li, Ji. Transient thermodynamic response and boiling heat transfer limit of dielectric liquids in a two-phase closed direct immersion cooling system. THERMAL SCIENCE AND ENGINEERING PROGRESS[J]. 2021, 第 4 作者 通讯作者 25: http://dx.doi.org/10.1016/j.tsep.2021.100986.[15] Li, Chenxi, Li, Ji. Passive Cooling Solutions for High Power Server CPUs with Pulsating Heat Pipe Technology: Review. FRONTIERS IN ENERGY RESEARCH. 2021, 第 2 作者 通讯作者 9: http://dx.doi.org/10.3389/fenrg.2021.755019.[16] Li, Ji, Zhou, Guohui, Tian, Tong, Li, Xingping. A new cooling strategy for edge computing servers using compact looped heat pipe. APPLIED THERMAL ENGINEERING[J]. 2021, 第 1 作者 通讯作者 187: http://dx.doi.org/10.1016/j.applthermaleng.2021.116599.[17] Xu, Zhengxuan, Li, Jian, Yao, Zhaohui, Li, Ji. Effects of superheat degree and wettability on droplet evaporation time near Leidenfrost point through Lattice Boltzmann simulation. INTERNATIONAL JOURNAL OF THERMAL SCIENCES[J]. 2021, 第 4 作者 通讯作者 167: http://dx.doi.org/10.1016/j.ijthermalsci.2021.107017.[18] Ji Li, Xingping Li, Guohui Zhou, Yang Liu. Development and evaluation of a supersized aluminum flat plate heat pipe for natural cooling of high power telecommunication equipment. APPLIED THERMAL ENGINEERING[J]. 2021, 第 1 作者184: [19] Sun, Bo, Wang, Huiru, Shi, Zhongshan, Li, Ji. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux. HEAT AND MASS TRANSFER. 2021, 第 4 作者 通讯作者 [20] Li, Xingping, Li, Ji, Zhou, Guohui, Lv, Lucang. Quantitative analysis of passive seasonal cold storage with a two-phase closed thermosyphon. APPLIED ENERGY[J]. 2020, 第 2 作者 通讯作者 260: http://dx.doi.org/10.1016/j.apenergy.2019.114250.[21] Zhou, Guohui, Li, Ji, Jia, Zizhou. Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module. APPLIED ENERGY[J]. 2019, 第 2 作者 通讯作者 239: 859-875, http://dx.doi.org/10.1016/j.apenergy.2019.01.258.[22] Li, Ji, Lv, Lucang, Zhou, Guohui, Li, Xingping. Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips. ENERGY CONVERSION AND MANAGEMENT[J]. 2019, 第 1 作者 通讯作者 201: http://dx.doi.org/10.1016/j.enconman.2019.112202.[23] Zhou, Guohui, Li, Ji. Two-phase flow characteristics of a high performance loop heat pipe with flat evaporator under gravity. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2018, 第 2 作者 通讯作者 117: 1063-1074, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2017.10.074.[24] Zhou, Guohui, Li, Ji, Lv, Lucang, ASME. EXPERIMENTAL STUDY ON HEAT TRANSFER CAPABILITY OF A MINIATURE LOOP HEAT PIPE. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 8. 2017, 第 11 作者http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000400877900047.[25] Zhou, Guohui, Li, Ji, Lv, Lucang, Peterson, G P. Comparative Study on Thermal Performance of Ultrathin Miniature Loop Heat Pipes With Different Internal Wicks. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME[J]. 2017, 第 2 作者 通讯作者 139(12): https://www.webofscience.com/wos/woscc/full-record/WOS:000424541300008.[26] Lv, Lucang, Li, Ji. Managing high heat flux up to 500 W/cm(2) through an ultra-thin flat heat pipe with superhydrophilic wick. APPLIED THERMAL ENGINEERING[J]. 2017, 第 2 作者 通讯作者 122: 593-600, http://dx.doi.org/10.1016/j.applthermaleng.2017.05.050.[27] Li, Zhiwei, Li, Ji, Li, Xingping, Ni, MingJiu. Free surface flow and heat transfer characteristics of liquid metal Galinstan at low flow velocity. EXPERIMENTAL THERMAL AND FLUID SCIENCE[J]. 2017, 第 2 作者 通讯作者 82: 240-248, http://dx.doi.org/10.1016/j.expthermflusci.2016.11.021.[28] Lv, Lucang, Li, Ji, Zhou, Guohui. A robust pulsating heat pipe cooler for integrated high power LED chips. HEAT AND MASS TRANSFER[J]. 2017, 第 2 作者 通讯作者 53(11): 3305-3313, https://www.webofscience.com/wos/woscc/full-record/WOS:000415998900011.[29] Lv, Lucang, Li, Ji. Effect of charging ratio on thermal performance of a miniaturized two-phase super-heat-spreader. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2017, 第 2 作者 通讯作者 104: 489-492, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.08.087.[30] Zhou, Guohui, Li, Ji, Lv, Lucang. An ultra-thin miniature loop heat pipe cooler for mobile electronics. APPLIED THERMAL ENGINEERING[J]. 2016, 第 2 作者 通讯作者 109: 514-523, http://dx.doi.org/10.1016/j.applthermaleng.2016.08.138.[31] Li, ZhiWei, Lv, Lucang, Li, Ji. Combination of heat storage and thermal spreading for high power portable electronics cooling. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2016, 第 3 作者 通讯作者 98: 550-557, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.03.068.[32] Li, Ji, Tian, Wenkai, Lv, Lucang. A thermosyphon heat pipe cooler for high power LEDs cooling. HEAT AND MASS TRANSFER[J]. 2016, 第 1 作者 通讯作者 52(8): 1541-1548, http://www.corc.org.cn/handle/1471x/2374503.[33] Li, Ji, Lv, Lucang. Experimental studies on a novel thin flat heat pipe heat spreader. APPLIED THERMAL ENGINEERING[J]. 2016, 第 1 作者 通讯作者 93: 139-146, http://dx.doi.org/10.1016/j.applthermaleng.2015.09.038.[34] Niu, Gengwen, Li, Ji. Comparative studies of pool boiling heat transfer with nano-fluids on porous surface. HEAT AND MASS TRANSFER[J]. 2015, 第 2 作者 通讯作者 51(12): 1769-1777, https://www.webofscience.com/wos/woscc/full-record/WOS:000362888700010.[35] 吕鲁仓, 李骥, 周国辉. 一种冷却集成LED芯片的脉动热管散热器. 2015年中国工程热物理学会传热传质学学术年会. 2015, 第 2 作者http://ir.etp.ac.cn/handle/311046/107481.[36] 李志伟, 吕鲁仓, 李骥. 基于热储存及热扩展耦合模式的电子冷却方式. 2015年中国工程热物理学会传热传质学学术年会. 2015, 第 3 作者http://ir.etp.ac.cn/handle/311046/107800.[37] Li Ji. A comparative study of pool boiling heat transfer with nano-fluids on porous surface. Heat and Mass Transfer. 2015, 第 1 作者 通讯作者 [38] Li, Ji, Lv, Lucang. Performance investigation of a compact loop heat pipe with parallel condensers. EXPERIMENTAL THERMAL AND FLUID SCIENCE[J]. 2015, 第 1 作者 通讯作者 62: 40-51, http://dx.doi.org/10.1016/j.expthermflusci.2014.12.001.[39] 李帆, 倪明玖, 李骥. 微尺度瞬态气泡生长及湮灭的数值模拟. 中国科学院大学学报[J]. 2015, 第 3 作者32(1): 31-37, http://journal.ucas.ac.cn/CN/10.7523/j.issn.2095-6134.2015.01.006.[40] Li Ji. A Novel Two-phase Closed Loop Thermosyphon for Split-type Solar water Collectors. Applied Thermal Engineering. 2014, 第 1 作者[41] Li, Ji, Lin, Feng, Niu, Gengwen. An insert-type two-phase closed loop thermosyphon for split-type solar water heaters. APPLIED THERMAL ENGINEERING[J]. 2014, 第 1 作者 通讯作者 70(1): 441-450, http://dx.doi.org/10.1016/j.applthermaleng.2014.05.019.[42] Niu Gengwen, Li Ji, ASME. Visualization study of pool boiling on polished and porous coated surfaces for deionized water and Al2O3-water nano-fluids. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 8C. 2014, 第 2 作者http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000360032800043.[43] Li Ji. Micro Flat Heat Pipes for Microelectronics Cooling: Review. Recent Patents on Mechanical Engineering. 2013, 第 1 作者[44] 史忠山, 李骥. 自然对流板肋热沉的三维数值结构优化. 制冷学报[J]. 2013, 第 2 作者45-51, http://lib.cqvip.com/Qikan/Article/Detail?id=44826233.[45] Li, Ji, Lin, Feng, Wang, Daming, Tian, Wenkai. A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips. APPLIED THERMAL ENGINEERING[J]. 2013, 第 1 作者 通讯作者 56(1-2): 18-26, http://dx.doi.org/10.1016/j.applthermaleng.2013.03.016.[46] Jiang Yong, Carbajal Gerardo, Sobhan C B, Li Ji, Chang S W, Dineva P, Ismail K, Juncu G, Reis P. 3D Heat Transfer Analysis of a Miniature Copper-Water Vapor Chamber with Wicked Pillars Array. ISRN MECHANICAL ENGINEERING[J]. 2013, 第 4 作者[47] Li, Ji. A compound thermodynamic model for transient bubble growth in microscale. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2013, 第 1 作者 通讯作者 65: 739-749, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2013.07.004.[48] Li, Ji, Shi, Zhongshan. 3D numerical optimization of a heat sink base for electronics cooling. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER[J]. 2012, 第 1 作者 通讯作者 39(2): 204-208, http://dx.doi.org/10.1016/j.icheatmasstransfer.2011.12.001.[49] 李骥, 史忠山. 铜铝微通道热沉的三维数值结构优化. 机械工程学报[J]. 2012, 第 1 作者48(16): 102-109, http://lib.cqvip.com/Qikan/Article/Detail?id=43337580.[50] 姜勇, 李骥. 均热板散热器的数值分析与结构优化. 中国科学院研究生院学报[J]. 2012, 第 2 作者29(2): 169-174, http://lib.cqvip.com/Qikan/Article/Detail?id=41045433.[51] 李骥. 均热板散热器的数值研究和结构优化. 中国科学院研究生院学报. 2012, 第 1 作者 通讯作者 [52] Li, Ji, Wang, Daming, Peterson, G P Bud. A Compact Loop Heat Pipe with Flat Square Evaporator for High Power Chip Cooling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2011, 第 1 作者 通讯作者 1(4): 519-527, https://www.webofscience.com/wos/woscc/full-record/WOS:000292827500007.[53] 李骥, 史忠山. 电子冷却热沉基板的三维数值优化. 电力电子技术[J]. 2011, 第 1 作者45(12): 109-111, http://lib.cqvip.com/Qikan/Article/Detail?id=40369250.[54] Li, Ji, Peterson, G P. 3D heat transfer analysis in a loop heat pipe evaporator with a fully saturated wick (vol 54, pg 564, 2011). INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. 2011, 第 1 作者 通讯作者 54(17-18): 4152-4152, https://www.webofscience.com/wos/woscc/full-record/WOS:000292360500037.[55] Li, Ji, Peterson, G P. 3D heat transfer analysis in a loop heat pipe evaporator with a fully saturated wick. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2011, 第 1 作者 通讯作者 54(1-3): 564-574, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.09.014.[56] 李骥. 环路热管蒸发器三维数值传热分析. International Journal of Heat and Mass Transfer. 2011, 第 1 作者[57] 姜勇, 李骥. 均热板散热器的实验研究与数值分析. 制冷学报[J]. 2011, 第 2 作者32(5): 20-24, http://lib.cqvip.com/Qikan/Article/Detail?id=39638785.[58] Li, Ji, Wang, Daming, Peterson, G P, ASME. DEVELOPMENT OF A ROBUST MINIATURE LOOP HEAT PIPE FOR HIGH POWER CHIP COOLING. PROCEEDINGS OF THE ASME MICRO/NANOSCALE HEAT AND MASS TRANSFER INTERNATIONAL CONFERENCE, VOL 3. 2010, 第 1 作者347-354, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000290920600049.[59] Li, Ji, Wang, Daming, Peterson, G P. Experimental studies on a high performance compact loop heat pipe with a square flat evaporator. APPLIED THERMAL ENGINEERING[J]. 2010, 第 1 作者 通讯作者 30(6-7): 741-752, http://www.corc.org.cn/handle/1471x/2413582.[60] High Power Electronic Component: Review. Recent Patents on Engineering. 2008, [61] Li, J, Peterson, G P, Cheng, P. Dynamic characteristics of transient boiling on a square platinum microheater under millisecond pulsed heating. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER[J]. 2008, 51(1-2): 273-282, http://dx.doi.org/10.1016/j.ijheatmasstransfer.2007.03.045.