基础研究：异种材料精密连接机理、金属力学性能与损伤机制

应用研究：高端合金材料、金属电子材料、表面（增材）改性

   

080502-材料学
080503-材料加工工程

材料连接技术与工程
表界面化学与物理

2007-09--2012-08   中国科学院金属研究所   博士
2003-09--2007-07   西安交通大学   学士

2017-03~今, 中国科学院宁波材料技术与工程研究所, 副研究员(2017)
2012-08~2017-02, 郑州机械研究所, 工程师(2013)、高级工程师(2016)

   

(66) Q.K. Zhang*, C.W. An, Z.L. Song. Thermal cycling-electric current coupling damage mechanisms of SnAgCu/Cu solder joints under different temperature ranges. Journal of Electronic Materials. 2024, 53: 2544-2553.

(65) Qingke Zhang*, Chenwei An, Zhenlun Song. Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization. Journal of Materials Science: Materials in Electronics. 2024, 35: 306.

(64) Jinyang Fang, Chaofeng Li, Feng Liu, Huilin Hou, Xinli Zhang, Qingke Zhang*, Lijing Yang, Cheng Xu, Zhenlun Song. Effects of grain orientation and grain size on etching behaviors of high-strength and high-conductivity Cu alloy. Materials Today Communications. 2024, 38:108111.

(63) Jiazhen Huang, Jianyong Wang, Lijing Yang*, Wenwen Du, Minghua Wu, Qingke Zhang*, Zhenlun Song. Comparative study on microstructure and mechanical properties of a novel nano-composite strengthening heat-resistant steel and two typical heat-resistant steels. Materials Today Communications. 2023, 36: 106679.

(62) Shizhu Liao, Lijing Yang*, Qingke Zhang, Bizhang Zheng, Chi Yang, Jisi Zheng, Duohong Zou, Zhenlun Song. Effect of annealing on the mechanical properties and cytocompatibility of CoCrMo alloy with tantalum coating. Surface & Coatings Technology. 2023, 469: 129789.

(61) ShiZhu Liao, LiJing Yang, ZhenLun Song, ZhengYin Zhou, QingKe Zhang, Chi Yang, JiSi Zheng. Effect of nitrogen content on the mechanical and biological properties of tantalum nitride coatings. Surface & Coatings Technology. 2023, 464: 129544.

(60) Tao Chen, Qingke Zhang*, Feng Liu, Xiaolong Feng, Cheng Xu, Zhenlun Song. Influences of cold rolling and aging on microstructure and property of CuCrSn alloy. Materials. 2023, 16: 3780.

(59) C.W. An, Q.K. Zhang*, Z.L. Song. High temperature thermal-electrical coupling damage mechanisms of SnAgCu/Cu solder joints.  Journal of Electronic Materials. 2023, 52: 3807-3817.

(58) Xin Li, Qingke Zhang*, Lijing Yang, Cheng Xu, Tinghui Wang, Bizhang Zheng, Wei Pan, Zhenlun Song*. Induction brazing of NdFeB magnet with PVD-deposited AgCu alloy.  Journal of Magnetism and Magnetic Materials. 2023, 569: 170432.

(57) Q.K. Zhang, B.Q. Li, W.X. Li, K.Q. Sun, C. Xu, L.J. Yang, P. Cui and Z.L. Song*. Severe Elastic Modulus Shift of Deformed CoNiCrMo (MP35N) Alloy Under Relative Low Temperature Exposure.  Physical Review B. 2023, 107: L020102.

(56) Q.K. Zhang*, J. Yang, W.S. Sun, Z.L. Song. Evolution in microstructure and mechanical properties of Cu alloy during wire and arc additive manufacture. Journal of Central South University. 2023, 30: 100-411.

(55) T.K. Zhu, Q.K. Zhang*, H.L. Bai, L.Y. Zhao, J.K. Yan. Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation. Microelectronics Reliability, 2022, 135: 114574.

(54) F.K. Shi, Q.K. Zhang*, C. Xu, F.Q. Hu*, L.J. Yang, B.Z. Zheng, Z.L. Song. In-situ synthesis of NiCoCrMnFe high entropy alloy coating by laser cladding. Optics and Laser Technology, 2022,151: 108020.

(53) Lipeng Deng, Tao Chen, Jie Yang, Feng Liu, Qingke Zhang*, Zheshuai Zheng, Cheng Xu, Zhenlun Song. Evolutions in precipitates, microstructure and properties of cold-worked CuNiCoSi alloy during short-time solid solution. Materials Today Communications, 2022, 30: 103150.

(52) Yixuan Shi, Lijing Yang*, Qingke Zhang, Xinglong Zhu, Zhenlun Song, Huinan Liu. A novel MAO-PLA coating on zinc alloy for potential orthopedic implant material. Materials Letters. 2022, 317: 132058.

(51) Yixuan Shi, Lijing Yang*, Lucai Wang*, Qingke Zhang, Xinglong Zhu, Wensheng Sun, Jianwei Shen, Ting Lu, Zhenlun Song, Huinan Liu. Corrosion and Biocompatibility of Pure Zn with a Micro-Arc-Oxidized Layer Coated with Calcium Phosphate. Coatings. 2021, 11, 1425. 

(50) Q.K. Zhang*, X.M. Wang, Z.L. Song. Effects of thin cladding layer and annealing treatments on mechanical properties of AISI4340 steel. Engineering Fracture Mechanics, 2021, 256: 107997.

(49) T.K. Zhu, Q.K. Zhang*, H.L. Bai, L.Y. Zhao, J.K. Yan*. Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying. Materials Today Communications, 2021, 29: 102768.

(48) J. Yang, Q.K. Zhang*, Z.L. Song. Influences of Ag and In alloying on microstructure and mechanical properties of Sn-58Bi solder. Journal of Electronic Materials, 2021, 50: 283-290.

(47)  Y.X. Zhu, J.J. Jiang, L.J. Yang, C. Xu, Q.K. Zhang, X.L. Zhu, X. Li , J. Jin*, Q. Zhou, Z.L. Song*. Study of Ag-Sb coatings prepared by non-cyanide electrodeposition. Surface & Coatings Technology, 2021, 421: 127415.

(46) P.S. Guo, X.L. Zhu, L.J. Yang, L. Deng, Q.K. Zhang, B.Q. Li, K. Cho, W.S. Sun, T.T. Ren, Z.L. Song. Ultrafine- and uniform-grained biodegradable Zn-0.5Mn alloy: Grain refinement mechanism, corrosion behavior, and biocompatibility in vivo. Materials Science & Engineering C, 2021, 118: 111391.

(45) Q.K. Zhang*, F.Q. Hu, Z.L. Song. Transient soldering reaction mechanisms of SnCu solder on CuNi nano conducting layer and fracture behavior of the joint interfaces. Journal of Electronic Materials, 2020, 49: 3383-3390.

(44) J. Yang, S. Xiao, Q.K. Zhang*, C. Xu, W.D. Li, B.Z. Zheng, F.Q. Hu, J. Yin, Z.L. Song. In-situ synthesis of Ti-Al intermetallic compounds coating on Ti alloy by magnetron sputtering deposition followed by vacuum annealing, Vacuum, 2020, 172: 109060.

(43) W.D. Li, L.J. Yang, Q.K. Zhang, C. Xu, Q.H. Zhu, *Z.L. Song, B.Z. Zheng, F.Q. Hu, J.J. Jiang. Effect of the grain boundary Tb/Dy diffused microstructure on the magnetic properties of sintered Nd-Fe-B magnets. Journal of Magnetism and Magnetic Materials, 2020, 502:166491.

(42) 胡方勤, 曹振亚, 张青科, 杨丽景, 宋振纶*. 负偏压和本底真空度对Al 膜表面形貌和耐蚀性能的影响. 中国表面工程, 2020, 33(4): 128-135 

(41) Q.K. Zhang*, Z. Wang, F.Q. Hu, Z.L. Song. Preparation of thin NiCrBSi laser cladding layers with no microcracking and low dilution. Journal of Laser Applications, 2019, 31, 032015.

(40) Z. Wang, Q.K. Zhang*, R. Bagheri, P.S. Guo, Y.R. Yao, L.J. Yang, *Z.L. Song. Influence of laser surface remelting on microstructure and degradation mechanism in simulated body fluid of Zn-0.5Zr alloy. Journal of Materials Science & Technology, 2019, 35(11): 2705-2713.

(39) J.J. Jiang, Q.K. Zhang*, F.Q. Hu, Z.L. Song. Solderability of AZ31B magnesium alloy coated by copper and strength of the solder joints. Journal of Materials Engineering and Performance, 2019, 28(9): 5450-5457.

(38) Z. Wang, Q. K. Zhang*, Y. X. Chen, Z. L. Song. Inluences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints, Journal of Materials Science: Materials in Electronics, 2019, 30(20): 18524-18538.

(37) W.D. Li, Q.K. Zhang, Q.H. Zhu, S. Xiao, C. Xu, L.J. Yang, B.Z. Zheng, S.D. Mao, Z.L. Song*. Formation of anti-shell/core structure of heavy rare earth elements (Tb, Dy) in sintered Nd-Fe-B magnet after grain boundary diffusion. Scripta Materialia, 2019, 163: 40-43.

(36) P.S. Guo, F.X. Li, L.J. Yang*, R. Bagheri, Q.K. Zhang, B.Q. Li, Kailynn Cho, Z.L. Song, W.S. Sun, H.N Li. Ultra-fine-grained Zn-0.5Mn alloy processed by multi-pass hot extrusion: Grain refinement mechanism and room-temperature superplasticity. Materials Science and Engineering A, 2019, 748, 262-266

(35) 肖松, 杨杰, 张青科, 杨丽景, 宋振纶*, 李谋成. 真空热处理提高烧结钕铁硼镀Cu层结合力研究. 表面技术. 2019, 48(10): 276-284.

(34) F.Q. Hu, Q.K. Zhang*, J.J.Jiang, Z.L. Song*, Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction, Materials Letters, 2018, 214, 142-145.

(33) B.H. Wu, X.F. Ding, Q.K. Zhang, L.J. Yang, B.Z. Zheng, F.Q. Hu, Z.L. Song*. The dual trend of diffusion of heavy rare earth elements during the grain boundary diffusion process for sintered Nd-Fe-B magnets. Scripta Materialia, 2018, 148: 29-32.

(32) Z. Wang, Q.K. Zhang*, P.S. Guo, X. Gao, L.J. Yang, Z.L. Song*, Effects of laser surface remelting on microstructure and properties of biodegradable Zn-Zr alloy, Materials Letters, 2018, 226, 52-54.

(31) Q.K. Zhang*, F.Q. Hu, Z.L.Song, Z.F. Zhang, Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain, Materials Science and Engineering A, 2017, 701, 187-195.

(30)  张青科*, 钟素娟, 张雷, 龙伟民, 王德智. 奥氏体不锈钢-铜钎料钎焊界面反应行为. 焊接学报. 2017, 38(3): 75-78.

(29) 龙伟民, 董博文, 张青科*, 何鹏, 薛鹏. 基于银合金先导润湿的铜磷钎料钎焊钢. 焊接学报. 2017, 38(1): 1-4.

(28) P. Xue, K.H. Wang, Q. Zhou*, J. Huang, W.M. Long, Q.K. Zhang. Effect of Nd on tin whisker growth in Sn-Zn soldered joint. Journal of Materials Science: Materials in Electronics. 2016, 27(4), 3742-3747.

(27) J.L. Yang, S.B. Xue*, P. Xue, Z.P. Lv, W.M. Long, G.X. Zhang, Q.K. Zhang, P. He. Development of Zn-15Al-xZr filler metals for Brazing 6061 aluminum alloy to stainless steel. Materials Science and Engineering A, 2016, 651: 425-434.

(26) Y.L. Han, S.B. Xue*, J.L. Yang, W.M. Long, Q.K. Zhang. Effects of trace amount praseodymium and neodymium on microstructure and mechanical properties of Sn-0.3Ag-0.7Cu-0.5Ga solder, Journal of Materials Science: Materials in Electronics, 2016, 27(1): 351-358.

(25) J.C. Xu, S.B. Xue*, P. Xue, W.M. Long, Q.K. Zhang. Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd. Journal of Materials Science: Materials in Electronics, 2016, 27(8): 8771-8777.

(24)  W.M. Long, G.X. Zhang, Q.K. Zhang*. In situ synthesis of high strength Ag brazing filler metals during induction brazing process. Scripta Materialia, 2016, 110: 41-43.

(23)  Q.K. Zhang*, W.M. Long, X.Q. Yu, Y.Y. Pei, P. X. Qiao. Effects of Ga addition on microstructure and properties of Sn-Ag-Cu/Cu solder joints, Journal of Alloys and Compounds, 2015, 622: 973-978.

(22)  Q.K. Zhang*, W.M. Long, Z.F. Zhang*, Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging, Journal of Alloys and Compounds, 2015, 646: 405-411.

(21) 龙伟民, 张冠星, 张青科*, 何鹏, 薛鹏. 钎焊过程中原位合成高强度银钎料. 焊接学报. 2015, 36(11): 1-4.

(20)  Q.K. Zhang, Z.F. Zhang*, Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude, Materials Science and Engineering A, 2013, 580: 374-384.

(19)  张青科*, 裴夤崟, 龙伟民. 奥氏体不锈钢钎焊界面裂纹形成机制研究. 金属学报. 2013, 49(10): 1177-1184.

(18)  Q.K. Zhang, Z.F. Zhang*, In-situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron back-scatter diffraction. Scripta Materialia, 2012, 67: 289-292.

(17)  Q.K. Zhang, Z.F. Zhang*, Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints. Journal of Applied Physics, 2012, 112: 064508.

(16)  L.M. Yang, Q.K. Zhang, Z.F. Zhang*, Effects of solder dimension on interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints. Scripta Materialia, 2012, 67: 637-640.

(15)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate. Materials Science and Engineering A, 2012, 532: 167-177.

(14) 张青科, 邹鹤飞, 张哲峰*. SnBi/Cu界面Bi偏聚机制与时效脆性抑制(邀请综述). 中国科学E辑-技术科学. 2012, 42(1): 13-21.

(13)  Q.K. Zhang, Z.F. Zhang*, In-situ observations on creep-fatigue fracture behaviors of Sn-4Ag/Cu solder joints, Acta Materialia, 2011, 59: 6017-6028.

(12)  Q.K. Zhang, J. Tan, Z.F. Zhang*, Fracture behaviors and strength of Cu6Sn5 intermetallic compounds by indentation testing, Journal of Applied Physics, 2011, 110: 014502.

(11)  Q.K. Zhang, Z.F. Zhang*, In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints, Materials Science and Engineering A, 2011, 528: 2686-2693.

(10)  Q.K. Zhang, Z.F. Zhang*, In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates, Materials Science and Engineering A, 2011, 530: 452-461.

(9)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Influences of substrate alloying and reflow temperature on Bi segregation behaviors at SnBi/Cu interface, Journal of Electronic Materials, 2011, 40: 2320-2328.

(8)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Transition of Bi embrittlement of SnBi/Cu joint couples with the reflow temperature, Journal of Materials Research, 2011, 26: 449-454.

(7)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4wt%Ag/Cu-X (X=Zn, Ag, Sn) Couples, Journal of Electronic Materials, 2011, 40: 1542-1548.

(6)  Q.K. Zhang, Q.S. Zhu, H.F. Zou, Z.F. Zhang*, Fatigue fracture mechanisms of Cu/lead-free solders interfaces, Materials Science and Engineering A, 2010, 527: 1367-1376.

(5)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate, Journal of Materials Research, 2010, 25: 303-314.

(4)  Q.K. Zhang, H.F. Zou, Z.F. Zhang*, Tensile and fatigue behaviors of aged Cu/Sn-4Ag solder joints, Journal of Electronic Materials, 2009, 28: 852-859.

(3)  Q.K. Zhang, Z.F. Zhang*, Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times, Journal of Alloys and Compounds, 2009, 485: 853-861.

(2)  H.F. Zou, Q.K. Zhang, Z.F. Zhang*, Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu couple by alloying Cu substrate, Scripta Materialia, 2009, 61: 308-311.

(1) 张哲峰*, 张鹏, 田艳中, 张青科, 屈伸, 邹鹤飞, 段启强, 李守新, 王中光. 金属材料疲劳损伤的界面效应(邀请论文). 金属学报. 2009, 45(7): 788-800.

(4) Qingke Zhang，独著，《Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces》，Springer出版社，2016年，ISBN: 978-3-662-48821-8.

(3) 张青科，参编. 《钎焊手册》第3版（第13章 半导体材料硅、砷化镓的钎焊），机械工业出版社，2017年，ISBN：978-7-111-57708-9.

(2) 张青科，参编. 《焊接材料手册》, 机械工业出版社, 2014年，ISBN：978-7-111-46777-9.

(1) 张青科，参编. 《超硬工具钎焊技术》, 河南省科技出版社, 2016年，ISBN：9787534974298.

   

(1)  一种制备金刚石-铜复合材料的钎焊方法, 发明, 2016, 第1发明人, 专利号: ZL2015100613293
(2)  适用于铜铝异种金属钎焊的复合钎剂, 发明, 2017, 第1发明人, 专利号: ZL201310443951.1
(3)  驻波约束的大面积硬质合金钎焊方法, 发明, 2015, 第2发明人, 专利号: ZL201310443951.1
(4)  软钎料焊丝的车削成型方法, 发明, 2015, 第2发明人, 专利号: ZL201210523494.2
(5)  一种火焰预热钨极氩弧钎焊方法, 发明, 2017, 第1发明人, 专利号: ZL201510941980.X
(6)  用于制备粉状钎料的专用车刀, 实用新型, 2013, 第1发明人, 专利号: ZL201220671731.5
(7)  用于软钎料焊丝的成型切刀, 实用新型, 2013, 第1发明人, 专利号: ZL201220671734.9
(8)  制备金刚石-铜复合材料的活性钎焊装置, 实用新型, 2015, 第1发明人, 专利号: ZL201520083186.1
(9)  驻波约束的大面积硬质合金钎焊设备, 实用新型, 2014, 第1发明人, 专利号: ZL201320596501.1
(10) 一种铝靶材组件的摩擦扩散焊方法, 发明, 2019, 第1发明人, 专利号: ZL201711148895.3
(11) 一种钕铁硼永磁体用铜基钎焊材料及其制备方法, 发明, 2019, 第2发明人, 专利号: ZL201710995258.3
(12) 一种单晶焊点及其制备方法、电子组件, 发明, 2019, 第1发明人, 专利号: ZL201910219240.3
(13) 一种化学蚀刻减薄FeNi合金箔带的方法, 发明, 2021, 第1发明人, 专利号: ZL202110847470.
(14) 复合柱状软焊材料及其制备方法与应用, 发明, 2022, 第1发明人, 专利号: 2022106506435
(15) 铜合金薄板及其表面处理方法, 发明, 2022, 第1发明人, 专利号: ZL202210720682.8
(16) CuCrSn合金及其变形热处理方法, 发明, 2022, 第1发明人, 专利号: ZL202210721110.1

(16) 浙江省科学技术进步奖，二等奖，2023.
(15) 甬江育才工程领军拔尖人才项目第1层次, 2022.
(14) 宁波市“领军人才”, 2021.
(13) 宁波市“拔尖人才”, 2019.
(12)  中国专利优秀奖, 第2，部委级, 2017.
(11) 中国科学院宁波材料技术与工程研究所“春蕾人才”, 2017.
(10)  中国有色金属工业科技进步奖, 二等奖, 第4，部委级, 2016.
(9)  河南省科学技术进步奖, 二等奖, 第3，省级, 2016. 
(8)  中国机械工业科学技术奖, 一等奖, 第5，部委级, 2015.
(7)  中国机械工业科学技术奖, 二等奖, 第2，部委级, 2014. 
(6)  河南省科学技术进步奖, 二等奖, 第3，省级, 2014. 
(5)  CAS-Springer优秀博士论文奖, 院级, 2015.
(4)  中国科学院优秀博士学位论文, 院级, 2014. 
(3)  郑州市自然科学优秀论文奖, 特等奖，第1, 市地级, 2014. 
(2)  中国科学院院长优秀奖, 院级, 2013. 
(1)  中国科学院金属研究所“师昌绪奖学金”, 一等奖, 研究所（学校）, 2013.

   

（ 1 ） 冲压用高性能宽带轴承钢关键技术研发及产业化, 负责人, 地方任务, 2022-05--2025-04
（ 2 ） ***等领域用超高纯不锈钢材料及管件研发与产业化, 负责人, 地方任务, 2022-07--2025-06
（ 3 ） 超薄**合金制造技术研发, 负责人, 境内委托项目, 2022-12--2025-11
（ 4 ） **异种材料连接技术研发, 负责人, 境内委托项目, 2023-01--2023-12
（ 5 ） 高性能微型处理器高精密LQFP框架关键技术研发, 负责人, 地方任务, 2023-03--2025-08
（ 6 ） **用高强度、耐腐蚀特种不锈钢关键技术研发与产业化, 负责人, 地方任务, 2024-01--2026-12
（ 7 ） 颞下颌关节盘原位仿生重建及性能评估, 负责人, 国家任务, 2024-01--2026-12

(1) 973计划课题，三维集成互连材料的服役损伤行为与多场失效特性，2010/01-2014/12，参与
(2) 973计划前期研究专项课题，钎缝缺欠表征方法及形成机制的基础研究，2013/01-2014/12，负责执行
(3) 国家国际科技合作计划项目，****特种环境下钎焊接头行为及特性的合作研究，2014/04-2016/03，参与，负责执行
(4) 国家国际科技合作计划项目，热能储存材料承载体的高温钎焊研究，2015/04-2018/03，参与，课题负责人
(5) 机械科学研究总院技术发展基金专项，铜铝钎焊接头组织及性能研究，2013/04-2014/12，项目负责人
(6) 东北***公司技术开发项目，板翅式换热器用铝合金箔材抗高温塌陷性能研究，2013/10-2014/05，项目负责人
(7) 宁波市自然基金项目，SnBi(AgIn)/Cu低温光伏焊带焊接界面反应与时效可靠性研究, 2018/03--2020/03，项目负责人
(8) 中科院宁波材料所春蕾人才项目，激光制备金属材料表面防护层研究, 2017/03--2021/02，项目负责人
(9) 宁波市科技创新2025重大专项子课题，高强高导铜合金带材关键技术开发及产业化技术研究, 2019-07-2022-06，课题负责人
(10) 浙江省自然基金，微互连焊点热疲劳-电迁移耦合损伤机制及晶粒取向的影响研究, 2020-01-2022-12，项目负责人
(11) 国家自然基金, 初始晶粒取向对互连焊点热-电耦合损伤与组织演变的影响研究, 2021-01-2023-12, 项目负责人
(12) 宁波市科技创新2025重大专项子课题，高精密蚀刻引线框架用铜合金板带研发与产业化, 2020-08-2023-07, 课题负责人
(13) 宁波市科技创新2025重大专项，极大规模集成电路先进封装用引线框架及关键装备研发, , 2021-07-2023-11, 项目负责人

(14) “第八届全国有色金属结构材料制备加工及应用技术交流会”，题目：“固溶条件对CuNiCoSi合金组织性能的影响研究”, 邀请报告, 2022, 南京, 中国. 
(13) “第四届全国青年疲劳学术研讨会”，题目：“薄层熔覆及热处理对AISI4340钢强度与疲劳性能的影响”, 分会报告, 2021, 上海, 中国.
(12) “第七届全国有色金属结构材料制备加工及应用技术交流会”，题目：“AgIn元素对SnBi及SnBiCu焊点组织与力学性能的影响研究”, 邀请报告, 2021, 镇江, 中国. 
(11) “第二届异质材料焊接与连接先进技术研究应用发展论坛”，题目：“SnCu-CuNi纳米导电层界面反应与焊点断裂机制研究”, 分会报告, 2021, 南昌, 中国. 
(10) “第6届全国有色金属结构材料制备加工及应用技术交流会”，题目：“原位合成TiAl金属间化合物表面层研究”, 邀请报告, 2020, 长沙, 中国. 
(9) “第五届海峡两岸绿色电子制造学术交流会”，题目：“光伏及集成电路无铅焊接研究”, 分会报告, 2019, 上海, 中国. 
(8) “第18届全国疲劳与断裂学术会议”，题目：“异种材料连接界面疲劳损伤行为”, 分会报告, 2016, 郑州, 中国. 
(7) “LÖT 2016--11th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding”, Title: ”In-situ synthesis of difficult-to-form brazing filler metals”, Plenary Lectures, 2016, Aachen, Germany. 
(6) ”2015 International Symposium on Green Manufacturing and Applications (ISGMA 2015)”, Titl: “Recent Development of Eco friendly Brazing and Soldering Materials”, Oral Presentation, 2015, Qingdao, China. 
(5) ” 2014 International Conference on Brazing, Soldering and Special Joining Technologies”, Title: ”Growth behaviors of intermetallic compounds at Sn-Ag/Cu interface”, Oral Presentation, 2014, Beijing, China. 
(4) ”The 6th Korean-Sino Seminar on the Advanced Manufacturing Technology”, Title: ”Interfacial growth behaviors of intermetallic compounds at SnAg-Cu solder joint”, Plenary Lectures, 2014, Busan, South Korea.
(3) “Sino-German Symposium on Green Joining Material and Remanufacturing”, Title: ”Research and Application of Green Brazing and Soldering Materials”, Invited Talk, 2013, Beijing, China. 
(2) ”2011 International Symposium on Advanced Packaging Materials”, Title: ”Low cycle creep-fatigue behaviors of Sn-4Ag/Cu solder joints”, Oral Presentation, 2011, Xiamen, China. 
(1) ”2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)”, Title: ”Fatigue fracture mechanisms of Cu/lead-free solders interfaces”, Oral Presentation, 2010, Xi’an, China.