基本信息
刘凡宇 男 硕导 中国科学院微电子研究所
电子邮件: liufanyu@ime.ac.cn
通信地址: 北京市海淀区北土城西路3号
邮政编码: 100029
电子邮件: liufanyu@ime.ac.cn
通信地址: 北京市海淀区北土城西路3号
邮政编码: 100029
招生信息
招生专业
080903-微电子学与固体电子学085400-电子信息
招生方向
先进SOI材料与器件可靠性表征与建模模拟集成电路设计可靠性集成电路设计
教育背景
2011-09--2015-09 法国格勒诺布尔-阿尔卑斯大学 研究生,博士2008-10--2010-12 国防科技大学 研究生,硕士2004-09--2008-06 四川大学 本科,学士
工作经历
工作简历
2021-11~2023-03,中国科学院微电子研究所, 副研究员,青年研究员2019-12~2021-11,中国科学院微电子研究所, 副研究员,特别科研助理,博士后2015-12~2019-12,北京高技术研究所, 助理研究员2011-09~2015-09,法国格勒诺布尔-阿尔卑斯大学, 研究生,博士2008-10~2010-12,国防科技大学, 研究生,硕士2004-09~2008-06,四川大学, 本科,学士
专利与奖励
奖励信息
(1) 中国科学院青年创新促进会, 院级, 2021(2) 第四届辐射物理年会优秀墙报, 其他, 2021
专利成果
( 1 ) 一种半导体器件及其制造方法, 2021, 第 4 作者, 专利号: CN113224167A( 2 ) 一种基于背栅结构的SRAM存储单元、SRAM存储器以及上电方法, 2021, 第 4 作者, 专利号: CN112992221A( 3 ) 一种SRAM存储单元、存储器及SRAM存储单元的读写方法, 2021, 第 4 作者, 专利号: CN112992224A( 4 ) 一种SRAM存储单元、SRAM存储器以及数据存储方法, 2021, 第 4 作者, 专利号: CN112885391A
出版信息
发表论文
(1) Transient Measurement of Radiation-induced Interface Traps under the effect of Total dose effect, 2022 IEEE Nuclear and Space Radiation Effects Conference(NSREC2021), 2022, 第 1 作者(2) Single Event Induced Crosstalk of Monolithic 3D Circuits Based on a 22 nm FD-SOI Technology, 2022 IEEE International Reliability Physics Symposium (IRPS), 2022, 第 1 作者(3) Ultra-High-Energy Heavy Ion Induced Single Event Effect of TSV-Based 3D Integrated SOI SRAM Circuits, 2022 22rd European Conference on Radiation and Its Effects on Components and Systems(RADECS), 2022, 第 1 作者(4) Dependence of Temperature and Back-Gate Bias on Single-Event Upset Induced by Heavy Ion in 0.2-mu m DSOI CMOS Technology, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2021, 通讯作者(5) Pseudo-MOSFET transient behavior: Experiments, model, substrate and temperature effect, SOLID-STATE ELECTRONICS, 2021, (6) Layout-based mitigation of single-event transient for monolithic 3D CMOS integrated circuits, MICROELECTRONICS RELIABILITY, 2021, 通讯作者(7) A current model for FOI FinFETs with back-gate bias modulation, SOLID-STATE ELECTRONICS, 2021, (8) Comparison of Total Ionizing Dose Effects in SOI FinFETs between RT and High Temperature, 2021 IEEE Nuclear and Space Radiation Effects Conference(NSREC2021), 2021, 第 1 作者(9) 基于TSV转接板的3D SRAM单粒子多位翻转效应, Single Event Multiple Bit Upset Effect of 3D SRAM Based on TSV Interposer, 半导体技术, 2021, 第 4 作者(10) Radiation Hardening Using Back-gate Bias in Double-SOI Structure, NSREC国际会议, 2021, (11) Revisited parasitic bipolar effect in FDSOI MOSFETs: Mechanism, gain extraction and circuit applications, SOLID-STATE ELECTRONICS, 2021, (12) X-ray Irradiation Induced Degradation in Hf0.5Zr0.5O2 FDSOI nMOSFETs, Rare Metals, 2020, (13) The Current Model for FOI FinFETs with Back-Gate Bias, 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon(EUROSOI-ULIS), 2020, 第 1 作者(14) FinFET器件总剂量效应研究进展, 微电子学, 2020, 第 3 作者(15) Pseudo-MOSFET transient behavior: experiments, model and substrate effect, 2020 Joint International EUROSOI Workshop andInternational Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2020, 第 1 作者(16) FinFET器件总剂量效应研究进展, A Review of Total Ionizing Dose Effects in FinFETs, 微电子学, 2020, 第 3 作者(17) Revisited parasitic bipolar effect in FDSOI MOSFETs: Mechanism, current gain extraction and its circuit applications, 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon(EUROSOI-ULIS), 2020, 第 1 作者(18) Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature, MICROELECTRONICS RELIABILITY, 2020, 通讯作者(19) 考虑背栅偏置的FOI FinFET电流模型, Current Model of FOI FinFETs with Back-Gate Bias, 半导体技术, 2020, 第 2 作者(20) A radiation electrostatic potential model for FOI FinFET, 2020 20th European Conference on Radiation and Its Effects on Components and Systems(RADECS), 2020, 第 1 作者(21) Dependency of Temperature and Back-gate Bias on Single Event Upset Induced by Heavy Ion in a 0.2 μm DSOI CMOS Technology, 2020 20th European Conference on Radiation and Its Effects on Components and Systems(RADECS), 2020, 第 1 作者
科研活动
科研项目
( 1 ) 兆级抗辐射应用的特种绝缘体上硅晶圆及新型器件研究, 负责人, 国家任务, 2022-11--2026-11
参与会议
(1)Radiation Hardening Using Back-gate Bias in Double-SOI Structure 2021-07-19