基本信息
徐高卫  男  硕导  中国科学院上海微系统与信息技术研究所
电子邮件: xugw@mail.sim.ac.cn
通信地址: 上海市长宁路865号
邮政编码:

招生信息

   
招生专业
080903-微电子学与固体电子学
085400-电子信息
招生方向
微电子学与固体电子学
先进电子封装及可靠性
低温超导封装

教育背景

2004-04--2007-07   中国科学院研究生院   博士
1990-08--1993-02   西安电子科技大学   硕士
1986-07--1990-07   西安电子科技大学   学士学位

工作经历

   
工作简历
2020-06~2023-06,中国科学院上海微系统与信息技术研究所, 副研究员
2015-09~2020-06,中国科学院上海微系统与信息技术研究所, 副研究员
2015-03~2015-09,德国弗赖堡大学, 访问学者
2004-04~2015-02,中国科学院上海微系统与信息技术研究所, 副研究员
2004-04~2007-07,中国科学院研究生院, 博士
1990-08~1993-02,西安电子科技大学, 硕士
1986-07~1990-07,西安电子科技大学, 学士学位
社会兼职
2018-06-22-2021-06-21,上海市电子学会SMT/MPT专业委员会, 委员

专利与奖励

   
奖励信息
(1) 高灵敏度光电传感器芯片及其便携式嵌入式光谱仪关键技术, 二等奖, 省级, 2015
专利成果
( 1 ) 有源基板及其制备方法, 2020, 第 1 作者, 专利号: ZL201811495818.X
( 2 ) 一种倒装芯片的凸点结构及其制备方法, 2020, 第 1 作者, 专利号: 202010636480.6
( 3 ) 圆片级封装结构及其制备方法, 2019, 第 3 作者, 专利号: 2017106864542 
( 4 ) 可拆卸封装结构及其制备方法, 2018, 第 1 作者, 专利号: 201811497519.X
( 5 ) 滤波器封装结构及其封装方法, 2018, 第 3 作者, 专利号: 2018111103508
( 6 ) 圆片级硅基集成小型化分形天线及其制备方法, 2018, 第 3 作者, 专利号: 2018110920658
( 7 ) 无缺陷穿硅通孔结构的制备方法, 2018, 第 3 作者, 专利号: 2018110193386
( 8 ) 半导体结构及其制备方法, 2018, 第 3 作者, 专利号: 2018109970497
( 9 ) 集成无源元件转接板及其制备方法, 2018, 第 3 作者, 专利号: 2016101277063
( 10 ) 纳米孪晶铜再布线的制备方法, 2017, 第 5 作者, 专利号: 2014105818026 
( 11 ) 图像传感器圆片级封装方法及封装结构, 2017, 第 2 作者, 专利号: 201710256171.4
( 12 ) 纳米孪晶铜布线层的制备方法, 2017, 第 4 作者, 专利号: 2017101240839 
( 13 ) 基于粘接剂的晶圆键合方法, 2016, 第 3 作者, 专利号: 201210465809.2
( 14 ) 一种电镀铜的方法, 2016, 第 3 作者, 专利号: 201210419100.9
( 15 ) 折叠槽天线结构及其制作方法, 2015, 第 3 作者, 专利号: 201210559635.6
( 16 ) 折叠槽天线结构及其制作方法, 2015, 第 3 作者, 专利号: 201210559635.6
( 17 ) 硅转接板结构及其圆片级制作方法, 2015, 第 4 作者, 专利号: 201310492853.7
( 18 ) 一种高品质因数电感制造方法, 2015, 第 3 作者, 专利号: 2015105512814
( 19 ) 一种高密度电感的制造方法, 2015, 第 3 作者, 专利号: 2015105512829 
( 20 ) 一种高品质因数电容制造方法, 2015, 第 3 作者, 专利号: 2015105512833
( 21 ) 一种可用于微波频段的圆片级穿硅传输结构及制造方法, 2015, 第 4 作者, 专利号: 201110324618.X
( 22 ) 基于纳米孪晶铜的凸点下金属层及制备方法, 2015, 第 3 作者, 专利号: 201510395468.X
( 23 ) 一种利用于微波频段的穿硅同轴线的制造方法, 2015, 第 3 作者, 专利号: 201010522672.0
( 24 ) MEMS圆片级三维混合集成封装结构及方法, 2015, 第 1 作者, 专利号: 201110129333.0
( 25 ) 一种集成宽频带天线及其制作方法, 2015, 第 3 作者, 专利号: 201210100299.9
( 26 ) 高深宽比深孔的种子层的制备方法, 2014, 第 3 作者, 专利号: 201110457844.5
( 27 ) 一种基于BCB/Au制作集成射频贴片微带天线的方法, 2014, 第 3 作者, 专利号: 201110434081.2
( 28 ) 一种基于铟凸点的无助焊剂回流工艺方法, 2012, 第 3 作者, 专利号: 201010515444.0
( 29 ) 一种基于电镀工艺制备铟焊球阵列方法, 2011, 第 3 作者, 专利号: 201010143745.5

出版信息

   
发表论文
(1) Design and Test of Transmission Line in SFQ Circuit, IEEE-22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 通讯作者
(2) A Novel Bumping Method for Flip-Chip Interconnection, IEEE-22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 通讯作者
(3) 基于铅铟合金线的SFQ多芯片超导互连方法研究, 低温物理学报, 2021, 通讯作者
(4) An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer, Microelectronics Journal, 2020, 第 3 作者
(5) Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss, Microwave and Optical Technology letters, 2020, 第 3 作者
(6) A Novel Superconducting Interconnection for Superconducting MCM Using Wire Bonding Method with Pb-In Alloy, IEEE- 21st International Conference on Electronic Packaging Technology (ICEPT), 2020, 第 1 作者
(7) Calibrations of Parameters of Passive Transmission Lines for Interconnections on Superconducting Chips toward MCM Application, Applied Superconductivity Conference (ASC), 2020, 第 1 作者
(8) 硅基BCB工艺X波段发夹型带通滤波器的实现, 传感器与微系统, 2019, 通讯作者
(9) 应用于MOEMS集成的TSV技术研究, 传感技术学报, 2019, 通讯作者
(10) Effects of microstructure of copper used in redistribution layer on wafer warpage evolution during the thermal process, Journal of Materials Science-Materials in Electronics, 2019, 通讯作者
(11) In-Sn Bumping Design and Fabrication for High Speed Interconnects of Superconducting MCM via Laser Melting/Jetting and Distribution, 17th International Superconductive Electronics Conference, 2019, 第 1 作者
(12) Influence of observed anelasticity of Cu on the wafer warpage evolution during thermal processes, IEEE-19th International Conference on Electronic Packaging Technology (ICEPT), 2018, 第 2 作者
(13) A novel interposer fabrication method for integration of bandpass filter applied in high frequency, IEEE-2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, 第 2 作者
(14) Deep understanding the role of Cu in RDL to warpage by exploring the warpage evolution with microstructural changes, IEEE-2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, 第 2 作者
(15) Interconnection Reliability for MCM of Large Micromirror Arrays and High Voltage Driving ASIC Based on High-density Substrate, 2018 19th International Conference on Electronic Packaging Technology (ICEPT 2018), 2018, 通讯作者
(16) Reduce the wafer warpage introduced by Cu in RDL through adjusting the cooling temperatures, IEEE 68th Electronic Components and Technology Conference, 2018, 第 2 作者
(17) In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films, Scientific Reports, 2017, 通讯作者
(18) High performance suspended spiral inductor and band-pass filter by wafer level packaging technology, Microsystem Technologies, 2017, 第 2 作者
(19) Design and fabrication of wafer level suspended high Q MIM capacitors for RF integrated passive devices, Microsystem Technologies, 2017, 第 3 作者
(20) Wafer level high‑density trench capacitors by using a two-step trench-filling process, Microsystem Technologies, 2017, 第 2 作者
(21) 一种基于TSV和激光刻蚀辅助互连的改进型CIS封装, 半导体技术, 2017, 通讯作者
(22) Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurements, IEEE-18th International Conference on Electronic Packaging Technology (ICEPT), 2017, 第 1 作者
(23) Study of the Wafer Warpage Evolution by Cooling to Extremely Low Temperatures, IEEE-18th International Conference on Electronic Packaging Technology (ICEPT), 2017, 第 3 作者
(24) Simulation and optimization of X-band microstrip filters based on high-resistance silicon wafer with BCB dielectric and new shielding TSV structure, IEEE-18th International Conference on Electronic Packaging Technology (ICEPT), 2017, 通讯作者
(25) A new fabrication method of RF interposer applied in the integration of band pass filter in the frequency range of X band, IEEE-18th International Conference on Electronic Packaging Technology (ICEPT), 2017, 第 3 作者
(26) Integrated Manufacturing of Microphone-array Node for Wireless Sensor Network (WSN), IEEE-International Conference on Electronic Packaging Technology (ICEPT), 2016, 第 1 作者
(27) Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite, Journal of Materials Science, 2016, 第 3 作者
(28) Experimental identification of thermal induced warpage in polymer–metal composite films, Microelectronics Reliability, 2016, 第 3 作者
(29) The nonlinearity of stress evolution in polymer-metal composite thin films during thermal treatment, 2016 Electronic Components & Technology Conference (ECTC), 2016, 第 3 作者
(30) A novel wafer level high Q planar inductor using Ni-Zn ferrite/BCB composite thick film, 17th International Conference on Electronic Packaging Technology, 2016, 第 2 作者
(31) Controllable large scaled nanotwin formation in Cu film at lower temperatures, Journal of Physics D: Applied Physics, 2016, 第 4 作者
(32) Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of GaAs CCD, Microsystem Technologies, 2016, 第 4 作者
(33) High performance suspended spiral inductor and band-pass filter by wafer level packaging technology, Microsystem Technologies, 2016, 第 2 作者
(34) Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling, Journal of Materials Science, 2016, 第 3 作者
(35) Ku波段的新型分形小型化天线, 传感器与微系统, 2016, 第 3 作者
(36) A Novel Mechanical Diced Trench Structure for Warpage Reduction in Wafer Level Packaging Process, Microelectronics Reliability, 2015, 第 3 作者
(37) Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of GaAs CCD, Microsystem Technologies, 2015, 第 3 作者
(38) Thermomechanical Behavior of Nanotwinned Copper Interconnection Line In Wafer Level Packaging And The Influence on Wafer Warpage, 2015 Electronic Components & Technology Conference (ECTC), 2015, 第 4 作者
(39) Design and fabrication of wafer level suspended high Q MIM capacitors for RF integrated passive devices, Microsystem Technologies, 2015, 第 3 作者
(40) Wafer level high-density trench capacitors by using a two-step trench-filling process, Microsystem Technologies, 2015, 第 2 作者
(41) A Novel WL-Integrated Low-Insertion-Loss Filter with Suspended High-Q Spiral Inductor and Patterned Ground Shields, Progress In Electromagnetics Research, 2015, 第 3 作者
(42) Design and Fabrication of Suspended high Q MIM Capacitors by Wafer Level Packaging Technology, The 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, 第 3 作者
(43) A Novel Die Sawed Trench Structure for Warpage Reduction in Wafer Level Packaging Process, Smart System Integration Conference 2015, 2015, 第 3 作者

科研活动

   
科研项目
( 1 ) 集成电路Cu 布线塑性应变与微结构的关系及其对硅圆片翘曲的影响, 主持, 省级, 2013-07--2016-06
( 2 ) 圆片级封装新型纳米孪晶铜重布线塑性应变机理与晶圆翘曲特性研究, 参与, 国家级, 2016-01--2019-12
( 3 ) 数字微波芯片及无线传感网微型节点集成技术, 主持, 国家级, 2016-01--2020-12
( 4 ) 面向航磁测量的SQUID平面梯度计运动噪声机理研究, 参与, 国家级, 2018-01--2020-12
( 5 ) 微反射镜阵列单元研制(封装任务), 主持, 国家级, 2018-01--2020-12
( 6 ) 低温多芯片混合封装技术, 主持, 部委级, 2020-01--2022-12
( 7 ) 整机SiP芯片热应力耦合分析技术, 主持, 院级, 2019-05--2021-12
参与会议
(1)Design and Test of Transmission Line in SFQ Circuit   Quan Zhou, Kun Li, Gaowei Xu, Lingyun Li, Le Luo, Jie Ren, Zhen Wang and Xiaoming Xie   2021-08-11
(2)A Novel Bumping Method for Flip-Chip Interconnection   Kun Li, Gaowei Xu, Quan Zhou, Wei Gai, Yanhong Wu, Jie Ren and Zhen Wang   2021-08-11
(3)SFQ电路中的PTL设计和测试   第十六届全国超导薄膜和超导电子器件学术研讨会   2020-11-22
(4)A Novel Superconducting Interconnection for Superconducting MCM Using Wire Bonding Method with Pb-In Alloy   第二十一届电子封装技术国际会议   2020-08-12
(5)In-Sn Bumping Design and Fabrication for High Speed Interconnects of Superconducting MCM via Laser Melting/Jetting and Distribution   Gaowei Xu, Wei Gai, Le Luo, Jie Ren   2019-07-27
(6) Influence of observed anelasticity of Cu on the wafer warpage evolution during thermal processes   2018-08-08
(7)A novel interposer fabrication method for integration of bandpass filter applied in high frequency    2018-08-08
(8)Deep understanding the role of Cu in RDL to warpage by exploring the warpage evolution with microstructural changes   2018-05-29
(9)Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurements   2017-08-16
(10)Study of the Wafer Warpage Evolution by Cooling to Extremely Low Temperatures   2017-08-16
(11)Simulation and optimization of X-band microstrip filters based on high-resistance silicon wafer with BCB dielectric and new shielding TSV structure   2017-08-16
(12) A new fabrication method of RF interposer applied in the integration of band pass filter in the frequency range of X band   2017-08-16
(13)Integrated Manufacturing of Microphone-array Node for Wireless Sensor Network (WSN)   2016-08-16
(14)A novel wafer level high Q planar inductor using Ni-Zn ferrite/BCB composite thick film   2016-08-16
(15)The nonlinearity of stress evolution in polymer-metal composite thin films during thermal treatment    2016-05-31
(16)Thermomechanical Behavior of Nanotwinned Copper Interconnection Line In Wafer Level Packaging And The Influence on Wafer Warpage   2015-05-26
(17)Design and Fabrication of Suspended high Q MIM Capacitors by Wafer Level Packaging Technology   2015-05-11