基本信息

宁圃奇  男  博导  中国科学院电工研究所
电子邮件: npq@mail.iee.ac.cn
通信地址: 中关村北二条6号1号楼401
邮政编码: 100190

研究领域

1)宽禁带半导体前沿探索;

2)功率模块封装新技术;

3)高功率密度变频器


招生信息

2020级招收硕士研究生

2021级招收博士研究生

招生专业
080804-电力电子与电力传动
招生方向
宽禁带功率半导体应用
高功率密度变频器
功率器件封装

教育背景

2006-08--2010-05   美国弗吉尼亚理工大学   获得博士学位
2004-09--2006-07   清华大学   获得硕士学位
2000-09--2004-07   清华大学   获得学士学位

工作经历

   
工作简历
2014-05~现在, 中科院电工所, 任研究员
2013-07~2014-05,中科院电工所, 任副研究员
2011-12~2013-06,美国橡树岭国家实验室, 任副研究员
2010-05~2011-12,美国橡树岭国家实验室, 博士后
社会兼职
2018-04-21-2021-04-30,中国电力企业联合会电力系统用电力电子器件标准化技术委员会委员,
2016-07-01-今,中关村天合宽禁带半导体创新联盟标准化委员会委员, 委员
2015-03-01-今,电源学会第七届元器件专委会委员, 专委会委员
2015-01-01-2018-12-31,《电源学报》第二届编委会委员, 编委会委员

教授课程

现代电力电子与控制技术
电力电子与现代控制

专利与奖励

   
奖励信息
(1) IEEE EVS34会议最佳论文奖, 其他, 2021
(2) 电工技术学会技术发明奖, 一等奖, 其他, 2020
(3) 第五届电源学会技术发明一等奖, 二等奖, 省级, 2019
(4) IEEE CIEEC 2019最佳论文奖, 一等奖, 其他, 2019
(5) IEEE PCIM ASIA 2017最佳论文奖, 一等奖, 其他, 2019
(6) 首届CASA第三代半导体卓越创新青年, 一等奖, 其他, 2016
专利成果
( 1 ) Power Module Packaging With Double Sided Planar Interconnection And Heat Exchangers, 发明, 2011, 第 3 作者, 专利号: 61/509312
( 2 ) 一种电流测量装置, 发明, 2014, 第 2 作者, 专利号: 201410525869.8
( 3 ) 用于电磁干扰仿真分析的IGBT模型, 发明, 2015, 第 2 作者, 专利号: 201510763167.8
( 4 ) 一种电机驱动系统共模电磁干扰滤波器的设计方法, 发明, 2015, 第 2 作者, 专利号: 201510895429.6
( 5 ) 一种IGBT输出特性测试装置, 发明, 2015, 第 2 作者, 专利号: 201510983141.4
( 6 ) 一种可调脉宽的双脉冲发生器, 发明, 2015, 第 2 作者, 专利号: 201510745579.9
( 7 ) 一种IGBT结温测量装置, 发明, 2016, 第 2 作者, 专利号: 201610525421.5
( 8 ) 一种功率变换器布局方法, 发明, 2017, 第 2 作者, 专利号: 201710645651.X
( 9 ) 一种Si IGBT和SiC MOSFET的混合电力电子模块, 发明, 2018, 第 2 作者, 专利号: 2018102555559

出版信息

   
发表论文
[1] 宁圃奇, 郑丹, 康玉慧, 柴晓光, 曹瀚, 温旭辉. 基于大电流导通压降法的车用IGBT结温监测方法综述. 电源学报. 2021, https://t.cnki.net/kcms/detail?v=3uoqIhG8C46NmWw7YpEsKHTPvOGrUOOqX1coEOzL8AEvKtpN7Wh7h3-99SthoXG4T6wWfWAtGwH5u5j_rX4-Gju8vS60e8AH.
[2] Han Cao, Puqi Ning, Xuhui Wen, Tianshu Yuan. A Genetic Algorithm Based Motor Controller System Automatic Layout Method. 2019 10th International Conference on Power Electronics and ECCE Asia : Volume 2 of 4.. 2021, 1499-1504, [3] Lei Li, Puqi Ning, Xuhui Wen, Qiongxuan Ge, Yaohua Li. A 30kW Three-Phase Voltage Source Inverter Based on The Si IGBT/SiC MOSFET Hybrid Switch. 2019 IEEE Applied Power Electronics Conference and Exposition : Volume 3 of 5. 2021, 1397-1401, [4] Cao, Han, Ning, Puqi, Chai, Xiaoguang, Zheng, Dan, Kang, Yuhui, Wen, Xuhui. Online monitoring of IGBT junction temperature based on V-ce measurement. JOURNAL OF POWER ELECTRONICS[J]. 2021, 21(2): 451-463, https://www.webofscience.com/wos/woscc/full-record/WOS:000590924600002.
[5] 范涛. Accurate evaluation of cooling system capability of three-phase IGBT-based inverter. CJEE. 2021, [6] Cao, Han, Ning, Puqi, Wen, Xuhui, Yuan, Tianshu, Li, Huakang. An Electrothermal Model for IGBT Based on Finite Differential Method. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS[J]. 2020, 8(1): 673-684, [7] Kang Yuhui, Cao Han, Chai Xiaoguang, Fan Tao, Ning Puqi, Zheng Dan. Monitoring of SiC MOSFET Junction Temperature with On-state Voltage at High Currents. Chinese Journal of Electrical Engineering[J]. 2020, 6(3): 1-7, [8] 宁圃奇. 宽禁带器件应用技术专辑主编评述. 电源学报[J]. 2020, 18(4): 1-3, http://lib.cqvip.com/Qikan/Article/Detail?id=7102445630.
[9] 曹瀚, 余玮宸, 柴晓光, 宁圃奇, 温旭辉. 基于遗传算法的SiC MOSFET导通电阻模型. 电源学报[J]. 2020, 18(4): 38-44, http://lib.cqvip.com/Qikan/Article/Detail?id=7102445636.
[10] 柴晓光, 宁圃奇, 曹瀚, 温旭辉. 基于大电流通态压降的IGBT功率模块结温监测方法的研究. 电源学报[J]. 2020, 18(4): 77-84, http://lib.cqvip.com/Qikan/Article/Detail?id=7102445641.
[11] Ning Puqi, Li Huakang, Huang Yunhao, Kang Yuhui. Review of Power Module Automatic Layout Optimization Methods in Electric Vehicle Applications. Chinese Journal of Electrical Engineering[J]. 2020, 6(3): 8-24, [12] 张瑾, 仇志杰, 王磊, 宁圃奇. 汽车级IGBT模块功率循环及温度循环寿命对比与分析. 中国电力[J]. 2019, 52(9): 54-60, http://lib.cqvip.com/Qikan/Article/Detail?id=7100094540.
[13] Ning Puqi, Yuan Tianshu, Cao Han, Li Lei, Kang Yuhui, IEEE. The Development of a 1200V/400A SiC Hybrid Module. 2019 31ST INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD)null. 2019, 247-250, [14] Ning Puqi, Yuan Tianshu, Kang Yuhui, Han Cao, Li Lei. Review of Si IGBT and SiC MOSFET Based on Hybrid Switch. Chinese Journal of Electrical Engineering[J]. 2019, 5(3): 20-29, [15] Xu, Hongyan, Ning, Puqi, Zheng, Libing, Xu, Ju, Zhang, Shuting, IEEE. Investigation on thermal stress of bondline based on Cu@Sn preform at high temperature application. ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGYnull. 2019, http://dx.doi.org/10.1109/ICEPT47577.2019.245109.
[16] Cao, Han, Ning, Puqi, Wen, Xuhui, Yuan, Tianshu. Practical SPICE Model for IGBT and PiN Diode Based on Finite Differential Method. JOURNAL OF POWER ELECTRONICS[J]. 2019, 19(6): 1591-1600, https://www.webofscience.com/wos/woscc/full-record/WOS:000504659300025.
[17] Ning Puqi, Yuan Tianshu, Cao Han, Li Lei, Kang Yuhui, IEEE. The development of 1200 V SiC Hybrid Switched power modules. 2019 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)null. 2019, 7-11, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000503446700002.
[18] 范涛, 温旭辉, 宁圃奇, 白云. 新能源汽车用全SiC电机驱动控制器研究进展. 中国基础科学. 2019, 21(S01): 29-35, http://lib.cqvip.com/Qikan/Article/Detail?id=7100847624.
[19] 张栋, 范涛, 温旭辉, 宁圃奇, 李磊, 邰翔, 李晔, 段卓琳, 何国林, 张少昆, 郑丹. 电动汽车用高功率密度碳化硅电机控制器研究. 中国电机工程学报[J]. 2019, 39(19): 5624-5634, http://lib.cqvip.com/Qikan/Article/Detail?id=7100486816.
[20] Ning, Puqi, Yuan, Tianshu, Kang, Yuhui, IEEE. The Engineering Design of SiC Hybrid Switch Series. PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC)null. 2019, 1337-1342, http://dx.doi.org/10.1109/CIEEC47146.2019.CIEEC-2019486.
[21] Ning Puqi, Li Lei, Wen Xuhui, Ge Qiongxuan, Li Yaohua, Mei Yunhui, IEEE. Top Die Surface Reprocessing for Planar Package with Double Sided Cooling. THIRTY-THIRD ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2018)null. 2018, 2780-2785, [22] Li Lei, Ning Puqi, Li Ye, Wen Xuhui, Zhang Dong, Ge Qiongxuan, Li Yaohua, IEEE. Temperature Dependency of The On-state Voltage of IGBT And Its Application in Thermal Resistance Test. THIRTY-THIRD ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2018)null. 2018, 2786-2791, [23] 宁圃奇, 韦统振, 肖立业, 齐智平, 严萍. 智能电网与能源网融合中的新材料与新装备技术. 中国工程科学[J]. 2018, 20(3): 125-131, http://lib.cqvip.com/Qikan/Article/Detail?id=7000853397.
[24] Xu Fei, Zhao Feng, Ning Puqi, Wen Xuhui, IEEE. Analyzing ZVS Soft Switching Using Single Phase Shift Control Strategy of Dual Active Bridge Isolated DC-DC Converters. 2018 21ST INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS (ICEMS)null. 2018, 2378-2381, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000456286600441.
[25] Xu Hongyan, Li Jianqiang, Ning Puqi, Xu Ju, IEEE. Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2018, 1709-1715, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000450155700375.
[26] Jiang Dong, Ning Puqi, Lai Rixin, Fang Zhihao, Wang Fred. Modular Design Method for Motor Drives. Chinese Journal of Electrical Engineering[J]. 2018, 4(1): 1-10, [27] 徐红艳, 周润晖, 宁圃奇, 徐菊. 基于Cu、Sn预成型焊片的高温SiC芯片焊接材料研究. 电工电能新技术[J]. 2018, 37(10): 39-43, http://lib.cqvip.com/Qikan/Article/Detail?id=7000883802.
[28] 曹瀚, 宁圃奇, 温旭辉, 李磊. 基于遗传算法的电机控制器布局与优化设计. 电力电子技术[J]. 2018, 52(8): 41-44, http://lib.cqvip.com/Qikan/Article/Detail?id=676038593.
[29] 宁圃奇, 李磊, 曹瀚, 温旭辉. 基于Si IGBT/SiC MOSFET的混合开关器件综述. 电工电能新技术[J]. 2018, 37(10): 1-9, http://lib.cqvip.com/Qikan/Article/Detail?id=7000883796.
[30] Li Lei, Ning Puqi, Wen Xuhui, Bian Yuanjun, Zhang Dong, IEEE. Gate Drive Design for a Hybrid Si IGBT/SiC MOSFET Module. 2018 1ST WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA)null. 2018, 34-+, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000491999000016.
[31] Li Lei, Ning Puqi, Wen Xuhui, Li Yaohua, Ge Qiongxuan, Zhang Dong, Tai Xiang, IEEE. A Turn-off Delay Time Measurement And Junction Temperature Estimation Method for IGBT. 2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC)null. 2017, 2290-2296, [32] 宁圃奇. A Double-Sided Cooling Package Design with Pinfin. IEEE PCIM ASIA. 2017, [33] Ning, Puqi, Li, Lei, Wen, Xuhui, IEEE. Engineering Investigation on Compact Power Module for EV Application. IECON 2017 - 43RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETYnull. 2017, 6623-6627, [34] 宁圃奇. An improved planar module automatic layout method for large number of dies. CES Transactions on Electrical Machines and Systems. 2017, [35] Zhang, Dong, Ning, Puqi, Duan, Zhuolin, Zhang, Jinping, IEEE. Analysis and Prediction of Electromagnetic Interference in Power Electronic Converter. 2017 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO, ASIA-PACIFIC (ITEC ASIA-PACIFIC)null. 2017, 338-343, [36] Li, Lei, Ning, Puqi, Zhang, Dong, Wen, Xuhui, IEEE. An Exploration of Thermo-Sensitive Electrical Parameters to Estimate the Junction Temperature of Silicon Carbide MOSFET. 2017 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO, ASIA-PACIFIC (ITEC ASIA-PACIFIC)null. 2017, 46-50, [37] Ning, Puqi, Wen, Xuhui, Li, Lei, IEEE. Interpretation Method Investigation of Converter System Layout Design. IECON 2017 - 43RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETYnull. 2017, 4949-4954, [38] 宁圃奇. A finite difference method modeling for IGBT and diode in PSPICE. Chinese Journal of Electrical Engineering. 2017, [39] 宁圃奇. A hybrid Si IGBT and SiC MOSFET module development. CES Transactions on Electrical Machines and Systems. 2017, [40] Lei, Li, Ning Puqi, Xiang, Tai, Wen Xuhui, Dong, Zhang, IEEE. A Genetic Algorithm High Power Density Converter System Packing Method. 2017 19TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'17 ECCE EUROPE)null. 2017, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000418374407011.
[41] Ning, Puqi, Wen, Xuhui, Li, Yaohua, Ge, Qiongxuan, IEEE. A Finite Differential Method Based Compact Thermal Model in PSPICE. 2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC)null. 2017, 1015-1019, [42] 李磊, 宁圃奇, 温旭辉, 张栋. 1200V碳化硅MOSFET与硅IGBT器件特性对比性研究. 电源学报[J]. 2016, 14(4): 32-38,58, http://lib.cqvip.com/Qikan/Article/Detail?id=669443977.
[43] 张栋, 孔亮, 宁圃奇, 温旭辉. 一种基于转移函数的电机驱动系统共模EMI滤波器设计方法. 电工技术学报[J]. 2016, 31(1): 103-111, http://lib.cqvip.com/Qikan/Article/Detail?id=667593251.
[44] Ning Puqi, Wen Xuhui, Li Yaohua, Ge Xiongxuan, IEEE. An Improved Automatic Layout Method for Planar Power Module. APEC 2016 31ST ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITIONnull. 2016, 3080-3085, [45] Qiu, Zhijie, Zhang, Jin, Ning, Puqi, Wen, Xuhui, IEEE. Lifetime Evaluation of Inverter IGBT Modules for Electric Vehicles Mission-profile. 2016 19TH INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS (ICEMS 2016)null. 2016, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000398541900322.
[46] 温旭辉, 宁圃奇, 孟金磊, 张瑾, 刘钧, 孔亮. 车用大功率电力电子器件研究进展. 科技导报(北京)[J]. 2016, 34(6): 69-73, [47] 孟金磊, 宁圃奇, 温旭辉, 张栋. 一种有限差分IGBT/FWD模型研究. 电源学报[J]. 2015, 13(4): 46-52, http://lib.cqvip.com/Qikan/Article/Detail?id=665702246.
[48] 宁圃奇. A Finite Differential Method Based IGBT Model in PSPICE. IEEE APEC. 2015, [49] Li, Qi, Fan, Tao, Wen, Xuhui, Ning, Puqi. An Analytical Approach to Magnet Eddy-Current Losses for Interior Permanent-Magnet Synchronous Machines During Flux Weakening. IEEE TRANSACTIONS ON MAGNETICS[J]. 2015, 51(8): https://www.webofscience.com/wos/woscc/full-record/WOS:000358613900021.
[50] Fu, Shancan, Mei, Yunhui, Li, Xin, Ning, Puqi, Lu, GuoQuan. Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (a parts per thousand yen100 mm(2)) Power Chips at Low Temperatures for Electronic Packaging. JOURNAL OF ELECTRONIC MATERIALS[J]. 2015, 44(10): 3973-3984, https://www.webofscience.com/wos/woscc/full-record/WOS:000360672900103.
[51] 宁圃奇. A fast universal power module layout method. IEEE ECCE. 2015, [52] Liang, Zhenxian, Ning, Puqi, Wang, Fred. Development of Advanced All-SiC Power Modules. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2014, 29(5): 2289-2295, https://www.webofscience.com/wos/woscc/full-record/WOS:000329991500016.
[53] Zhong, Yulin, Meng, Jinlei, Ning, Puqi, Wen, Xuhui, IEEE. Design & Analysis of a Novel IGBT Package with Double-Sided Cooling. 2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014null. 2014, [54] Ning, Puqi, Wang, Fei Fred, Ngo, Khai D T. Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2014, 29(4): 1998-2007, https://www.webofscience.com/wos/woscc/full-record/WOS:000329990500044.
[55] Ning, Puqi, Wang, Fei, Zhang, Di. A High Density 250 degrees C Junction Temperature SiC Power Module Development. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS[J]. 2014, 2(3): 415-424, https://www.webofscience.com/wos/woscc/full-record/WOS:000358607400007.
[56] Zhong Yulin, Meng Jinlei, Ning Puqi, Zhang Dong, Wen Xuhui, IEEE. Comprehensive Comparative Analysis of Two Types of Commonly-used Layouts of IGBT Packages. 2014 17TH INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS (ICEMS)null. 2014, 1952-1956, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000382946502002.
[57] Ning, Puqi, Wang, Fei Fred, Ngo, Khai D T. Automatic Layout Design for Power Module. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2013, 28(1): 481-487, https://www.webofscience.com/wos/woscc/full-record/WOS:000314694500047.
[58] 宁圃奇. A High-Temperature SiC Three-Phase AC - DC Converter Design for over 100 degree C Ambient Temperature. 2013, [59] Xu, Zhuxian, Jiang, Dong, Li, Ming, Ning, Puqi, Wang, Fei Fred, Liang, Zhenxian. Development of Si IGBT Phase-Leg Modules for Operation at 200 degrees C in Hybrid Electric Vehicle Applications. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2013, 28(12): 5557-5567, https://www.webofscience.com/wos/woscc/full-record/WOS:000320331000012.
[60] Ning, Puqi, Zhang, Di, Lai, Rixin, Jiang, Dong, Wang, Fred, Boroyevich, Dushan, Burgos, Roland O, Karimi, Kamiar, Immanuel, Vikram D, Solodovnik, Eugene V. High-Temperature Hardware Development of a 10-kW High-Temperature, High-Power-Density, Three-Phase ac-dc-ac SiC Converter. IEEE INDUSTRIAL ELECTRONICS MAGAZINE[J]. 2013, 7(1): 6-15, https://www.webofscience.com/wos/woscc/full-record/WOS:000318227400003.
[61] Ning, Puqi, Wang, Fred, Ngo, Khai D T. High-Temperature SiC Power Module Electrical Evaluation Procedure. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2011, 26(11): 3079-3083, https://www.webofscience.com/wos/woscc/full-record/WOS:000297355900002.
[62] Ning, Puqi, Lai, Rixin, Huff, Daniel, Wang, Fei Fred, Ngo, Khai D T, Immanuel, Vikram D, Karimi, Kamiar J. SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2010, 25(1): 16-23, https://www.webofscience.com/wos/woscc/full-record/WOS:000277758400002.
[63] Ning, Puqi, Lei, Thomas Guangyin, Wang, Fei Fred, Lu, GuoQuan, Ngo, Khai D T, Rajashekara, Kaushik. A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module. IEEE TRANSACTIONS ON POWER ELECTRONICS[J]. 2010, 25(8): 2059-2067, https://www.webofscience.com/wos/woscc/full-record/WOS:000281833300012.
[64] Lai, Rixin, Wang, Fred, Ning, Puqi, Zhang, Di, Jiang, Dong, Burgos, Rolando, Boroyevich, Dushan, Karimi, Kamiar J, Immanuel, Vikram D. A High-Power-Density Converter. IEEE INDUSTRIAL ELECTRONICS MAGAZINE[J]. 2010, 4(4): 4-12, https://www.webofscience.com/wos/woscc/full-record/WOS:000285245100003.
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发表著作
(1) 电力电子模块设计与制造, 机械工业出版社, 2016-10, 第 2 作者
(2) 电力电子中的控制电路实用设计指南, 机械工业出版社, 2019-05, 第 1 作者

科研活动

   
科研项目
( 1 ) 第三代半导体高密度封装工艺技术与关键材料, 主持, 国家级, 2015-01--2017-12
( 2 ) 电动车电机驱动系统电磁兼容设计技术与应用, 主持, 国家级, 2013-01--2016-12
( 3 ) IGBT产品模块方案设计, 主持, 国家级, 2011-01--2017-06
( 4 ) 用于高功率密度变频器的模块优化, 主持, 国家级, 2016-01--2018-12
( 5 ) 碳化硅模块封装及新能源汽车应用, 主持, 部委级, 2016-01--2017-12
( 6 ) 高温SiC集成功率模块研究, 主持, 国家级, 2016-07--2020-12
( 7 ) SiC电力电子器件及系统高温运行理论研究, 主持, 部委级, 2016-07--2021-06

指导学生

已指导学生

许飞  硕士研究生  085207-电气工程  

袁天舒  硕士研究生  080804-电力电子与电力传动  

柴晓光  硕士研究生  085207-电气工程  

现指导学生

黄允昊  硕士研究生  085207-电气工程  

李华康  硕士研究生  080804-电力电子与电力传动  

陈永胜  硕士研究生  080804-电力电子与电力传动  

崔健  硕士研究生  080804-电力电子与电力传动  

回晓双  博士研究生  080804-电力电子与电力传动