基本信息
聂志强  男  硕导  中国科学院西安光学精密机械研究所
电子邮件: niezq@opt.ac.cn
通信地址: 陕西省西安市信息大道17号
邮政编码:

招生信息

   
招生专业
080903-微电子学与固体电子学
招生方向
半导体激光器封装与表征,非线性光学

教育背景

2005-09--2011-09   西安交通大学   研究生,获得博士学位
2001-09--2005-07   西安交通大学   本科,获得学士学位

工作经历

   
工作简历
2016-01~现在, 中科院西安光机所, 副研究员
2011-10~2015-12,中科院西安光机所, 助理研究员

出版信息

   
发表论文
(1) Effect of Sintering Conditions on Electrochemical Properties of LiNi0.8Co0.1Mn0.1O2 as Cathode Material, INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2020, 通讯作者
(2) Preparation and properties of Co0.85Se/RGO composite counter electrodes for quantum-dot-sensitized solar cells, JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2020, 通讯作者
(3) 高功率半导体激光器低温特性分析, Analysis of Cryogenic Characteristics of High Power Semiconductor Lasers, 光子学报, 2019, 第 3 作者
(4) 基于韦布尔分布和对数正态分布的高功率半导体激光器寿命估计和失效分析研究, High power semiconductor laser lifetime prediction and failure analysis based on Weibull and Log-normal distribution, 红外与激光工程, 2019, 第 1 作者
(5) 传导冷却高功率半导体激光器单巴器件CW工作模式下的热加速寿命试验, Thermally Accelerated Aging Test of Conduction-cooled-packaged High Power Diode Laser Bar in CW Mode, 发光学报, 2019, 第 1 作者
(6) Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 第 1 作者
(7) Optimization of microchannel cooler of high power diode laser array package, COMPONENTS AND PACKAGING FOR LASER SYSTEMS III 2017, 2017, 第 3 作者
(8) 千瓦级传导冷却半导体激光器阵列热特性, Thermal characteristics of kW-level conduction-cooled semiconductor laser array, 红外与激光工程, 2017, 第 4 作者
(9) Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays, GUANGZI XUEBAO/ACTA PHOTONICA SINICA, 2017, 第 8 作者
(10) 传导冷却单巴高功率半导体激光器热应力和smile研究, 光子学报, 2017, 通讯作者
(11) Thermal characteristics of kW-level conduction-cooled semiconductor laser array, HONGWAI YU JIGUANG GONGCHENG/INFRARED AND LASER ENGINEERING, 2017, 第 1 作者
(12) 温度对高功率半导体激光器阵列“smile”的影响, Influence of Temperature on \"Smile\" in High Power Diode Laser Bars, 光子学报, 2016, 第 4 作者
(13) Influence of temperature on "Smile" in high power diode laser bars, GUANGZIXUEBAOACTAPHOTONICASINICA, 2016, 第 4 作者
(14) Thermal behavior of microchannel cooled high power diode laser arrays, 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2016, 2016, 第 3 作者
(15) Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode, 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2016, 2016, 第 1 作者
(16) Numerical simulation of thermo-mechanical behavior in high power diode laser arrays, 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2016, 2016, 第 2 作者
(17) Slow axis collimation lens with variable curvature radius for semiconductor laser bars, OPTICS AND LASER TECHNOLOGY, 2016, 第 6 作者
(18) A compact QCW conduction-cooled high power semiconductor laser array, 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2016, 2016, 第 5 作者
(19) Double-cutting beam shaping technique for high-power diode laser area light source, OPTICAL ENGINEERING, 2013, 第 6 作者
(20) 大功率半导体激光器阵列热串扰行为, Thermal crosstalk of high-power diode laser array, 强激光与粒子束, 2013, 第 3 作者
(21) Thermal modeling and analysis of high power semiconductor laser arrays, ICEPT-HDP 2012 PROCEEDINGS - 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING, 2012, 第 6 作者
(22) Influence of Package Structure on the Performance of the Single Emitter Diode Laser, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 第 6 作者
(23) High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology, HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, 2012, 第 4 作者
(24) Dressed multi-wave mixing in a V-type four-level atomic system, CHINESE PHYSICS, 2007, 第 3 作者
发表著作
(1) Coherent Control of Four-Wave Mixing, Springer, 2008-10, 第 2 作者

科研活动

   
科研项目
( 1 ) 半导体激光器测试与分析仪器计算分析方法研究, 负责人, 国家任务, 2013-02--2020-12
( 2 ) 极端温度下高功率半导体激光器线阵热应力演变行为动态研究, 负责人, 国家任务, 2014-01--2017-12
( 3 ) 特定温区高效大功率准连续半导体激光巴条研究, 参与, 国家任务, 2018-01--2020-12
( 4 ) 半导体激光器微光学整形及光纤耦合平台, 参与, 研究所自主部署, 2019-01--2021-12