基本信息
冼爱平 男 博导 金属研究所
电子邮件:ap.xian@imr.ac.cn
通信地址:沈河区文化路80-24号
邮政编码:110016
电子邮件:ap.xian@imr.ac.cn
通信地址:沈河区文化路80-24号
邮政编码:110016
招生信息
招生专业
080502-材料学
080503-材料加工工程
080501-材料物理与化学
080503-材料加工工程
080501-材料物理与化学
招生方向
无铅焊料
金属晶须生长
液态金属的氧化
金属晶须生长
液态金属的氧化
教育背景
2004-03--2004-07 美国伊利诺斯大学香滨分校 高级访问学者
1996-09--1998-05 加拿大多仑多大学 访问学者
1986-12--1991-08 中国科学院金属研究所 博士
1982-09--1985-08 中国科学院金属研究所 硕士
1978-10--1982-08 东北重型机械学院 学士
1996-09--1998-05 加拿大多仑多大学 访问学者
1986-12--1991-08 中国科学院金属研究所 博士
1982-09--1985-08 中国科学院金属研究所 硕士
1978-10--1982-08 东北重型机械学院 学士
学历
-- 研究生
学位
-- 博士
工作经历
工作简历
1993-11--今 中国科学院金属研究所 研究员
1992-08--1993-11 中国科学院金属研究所 副研究员
1991-08--1992-07 中国科学院金属研究所 助理研究员
1985-08--1986-12 中国科学院金属研究所 实习研究员
1992-08--1993-11 中国科学院金属研究所 副研究员
1991-08--1992-07 中国科学院金属研究所 助理研究员
1985-08--1986-12 中国科学院金属研究所 实习研究员
发表论文
1. Liu M, Xian AP, TEM observation of tin whisker, SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 54: 6 , (2011), 1546-1550
2. Shi H.C. and Xian A.P. J. Electron. Mater., Tin whisker growth in NdSn3 powder, Journal of Electronic Materials, (2011), DOI:10.1007/s11664-011-1701-2
3. M.Liu, A.P.Xian, Tin Whisker growth on the surtace of Sn-0.7cu Lead-free solder With a Rare earth(Nd) addition, J.Electro, Mater. 38[11], 2009,2353-2361
4. M.Liu, A.P.Xian ,Tin whisker growth on bulk Sn-Pb tutectic doping Nd, Microelectronics Reliability, 49,(2009).667-672
5. M.Liu, A.P.Xian, Spontaneous growth of whiskers on re-BE-bearing intermetallic compounds of Sn-RE, In-RE and Pb-RE, J. Alloy Compounds, 486,(2009) 590-596.
6. A.P.Xian and M.Liu, Observation of continuos tin whisker growth in NdSn3 intermetallic compound, J. Mater. Res., 24[9], (2009), 2775-2783
7. Gao SA, Xian AP, Cao LH, et al. , Influence of calcining temperature on photoresponse of TiO2 film under nitrogen and oxygen in room temperature, SENSORS AND ACTUATORS B-CHEMICAL, 134 [ 2 ], (2008), 718-726
8. Xian AP, Gong GL, Surface oxidation of molten Sn-0.07 wt% P in air at 280 degrees C, JOURNAL OF MATERIALS RESEARCH, 23[ 6 ], (2008), 1532-1536
9. B.Jiang and A.P.Xian, Whisker growth on tin finishes of different electrolyes, Microelectronics Reliability, 48[1], 105-110(2008)
10. Jiang B, Xian AP, Spontaneous growth of tin whiskers on tin-rare earth alloys, Phil. Mag. Lett.,Vol.87,No7, 657-662, 2007
11. Jiang B, Xian AP,Observation of ribbon-like whiskers on tin finish surface, J. Mater Sci-Mater Electro 18 (5): (2007), 513 -518
12. Xian AP, Gong GL, Oxidation behavior of molten tin doped with phosphorus, JOURNAL OF ELECTRONIC MATERIALS, 36[12], (2007),1669-1678
13. Gong GL, Xian AP, Influence of trace Ge on oxidation of liquid tin in atmosphere, ACTA METALLURGICA SINICA, 43 [7 ], (2007), 759-763
14. Wang W, Wang ZG, Xian AP, Shang JK, Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 23 (1), (2007), 85-91
15. Guo, JJ; Zhang, L; Xian, AP, et al, Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder, J. MATER. SCI. TECHNOL., 23, (2007), 811-816
16. Guo JJ, Xian AP, Shang JK, Degradation of solderability of electroless nickel by phosphide particles, SURFACE & COATINGS TECHNOLOGY, 202[2], (2007), 268-274
17. Dong CX, Xian AP, Han EH, et al., Acid-mediated sol-gel synthesis of visible-light active photocatalysts, JOURNAL OF MATERIALS SCIENCE, 41 [18], (2006), 6168-6170
18. Cao H, Min JY, Wu SD, et al., Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu-Fe-P alloy, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 431[1-2], (2006), 86-91
19. Jiang B, Xian AP,Discontinuous growth of tin whiskers, Phil. Mag. Lett.,Vol.86,No.8 : 521-527, 2006, philo-dis-whisker.pdf
20. Wang W, Wang ZG, Xian AP, et al., Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling, ACTA METALLURGICA SINICA, 42[6], (2006), 647-652
21. Wang LW, Xian AP, Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method , JOURNAL OF ELECTRONIC MATERIALS 34 (11): 1414-1419 NOV 2005
22. Cao H, Min JY, Xian AP, Shang JK, Re-precipitation of coherent gamma-Fe particles following annealing of equal-channel angular pressed Cu-Fe alloy , PHILOSOPHICAL MAGAZINE LETTERS 85 (2): (2005), 61-66
23. Zeng QL, Wang ZG, Xian AP, Shang JK, Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure, JOURNAL OF ELECTRONIC MATERIALS 34 (1): (2005), 62-67
24. 石红昌, 冼爱平, 镀层表面晶须自发生长现象的研究进展, 中国有色金属学报, 21[5], (2011), 1021-1030
25. 杨泽焱 冼爱平, 液态铅在大气条件下的氧化行为, 电源技术, 35[1], (2011), 66-70
26. 高世安 冼爱平, 聚乙烯吡咯烷酮改进TiO2薄膜的可见光增强氧敏特性, 传感技术学报, 21[9], (2008), 1481-1486
27.崔晓云,冼爱平, 尚建库, 铜掺杂纳米TiO2氢气敏感性研究, 传感技术学报, 20[1], (2007), 5-10
28. 江波 冼爱平, 锡镀层表面晶须问题的研究现状与进展, 表面技术, 35[4], (2006), 1-4, 12
29. 王薇, 王中光, 冼爱平, 尚建库, CBGA结构热循环条件下无铅焊点的显微组织和断裂, 金属学报, 42[6], (2006), 647-652
30. 李英梅 黄宝宗, 冼爱平, 尚建库, 王中光, 电子封装元件的高阶层离散均匀化分析, 力学学报, 37[4], (2005), 428-434
2. Shi H.C. and Xian A.P. J. Electron. Mater., Tin whisker growth in NdSn3 powder, Journal of Electronic Materials, (2011), DOI:10.1007/s11664-011-1701-2
3. M.Liu, A.P.Xian, Tin Whisker growth on the surtace of Sn-0.7cu Lead-free solder With a Rare earth(Nd) addition, J.Electro, Mater. 38[11], 2009,2353-2361
4. M.Liu, A.P.Xian ,Tin whisker growth on bulk Sn-Pb tutectic doping Nd, Microelectronics Reliability, 49,(2009).667-672
5. M.Liu, A.P.Xian, Spontaneous growth of whiskers on re-BE-bearing intermetallic compounds of Sn-RE, In-RE and Pb-RE, J. Alloy Compounds, 486,(2009) 590-596.
6. A.P.Xian and M.Liu, Observation of continuos tin whisker growth in NdSn3 intermetallic compound, J. Mater. Res., 24[9], (2009), 2775-2783
7. Gao SA, Xian AP, Cao LH, et al. , Influence of calcining temperature on photoresponse of TiO2 film under nitrogen and oxygen in room temperature, SENSORS AND ACTUATORS B-CHEMICAL, 134 [ 2 ], (2008), 718-726
8. Xian AP, Gong GL, Surface oxidation of molten Sn-0.07 wt% P in air at 280 degrees C, JOURNAL OF MATERIALS RESEARCH, 23[ 6 ], (2008), 1532-1536
9. B.Jiang and A.P.Xian, Whisker growth on tin finishes of different electrolyes, Microelectronics Reliability, 48[1], 105-110(2008)
10. Jiang B, Xian AP, Spontaneous growth of tin whiskers on tin-rare earth alloys, Phil. Mag. Lett.,Vol.87,No7, 657-662, 2007
11. Jiang B, Xian AP,Observation of ribbon-like whiskers on tin finish surface, J. Mater Sci-Mater Electro 18 (5): (2007), 513 -518
12. Xian AP, Gong GL, Oxidation behavior of molten tin doped with phosphorus, JOURNAL OF ELECTRONIC MATERIALS, 36[12], (2007),1669-1678
13. Gong GL, Xian AP, Influence of trace Ge on oxidation of liquid tin in atmosphere, ACTA METALLURGICA SINICA, 43 [7 ], (2007), 759-763
14. Wang W, Wang ZG, Xian AP, Shang JK, Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 23 (1), (2007), 85-91
15. Guo, JJ; Zhang, L; Xian, AP, et al, Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder, J. MATER. SCI. TECHNOL., 23, (2007), 811-816
16. Guo JJ, Xian AP, Shang JK, Degradation of solderability of electroless nickel by phosphide particles, SURFACE & COATINGS TECHNOLOGY, 202[2], (2007), 268-274
17. Dong CX, Xian AP, Han EH, et al., Acid-mediated sol-gel synthesis of visible-light active photocatalysts, JOURNAL OF MATERIALS SCIENCE, 41 [18], (2006), 6168-6170
18. Cao H, Min JY, Wu SD, et al., Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu-Fe-P alloy, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 431[1-2], (2006), 86-91
19. Jiang B, Xian AP,Discontinuous growth of tin whiskers, Phil. Mag. Lett.,Vol.86,No.8 : 521-527, 2006, philo-dis-whisker.pdf
20. Wang W, Wang ZG, Xian AP, et al., Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling, ACTA METALLURGICA SINICA, 42[6], (2006), 647-652
21. Wang LW, Xian AP, Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method , JOURNAL OF ELECTRONIC MATERIALS 34 (11): 1414-1419 NOV 2005
22. Cao H, Min JY, Xian AP, Shang JK, Re-precipitation of coherent gamma-Fe particles following annealing of equal-channel angular pressed Cu-Fe alloy , PHILOSOPHICAL MAGAZINE LETTERS 85 (2): (2005), 61-66
23. Zeng QL, Wang ZG, Xian AP, Shang JK, Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure, JOURNAL OF ELECTRONIC MATERIALS 34 (1): (2005), 62-67
24. 石红昌, 冼爱平, 镀层表面晶须自发生长现象的研究进展, 中国有色金属学报, 21[5], (2011), 1021-1030
25. 杨泽焱 冼爱平, 液态铅在大气条件下的氧化行为, 电源技术, 35[1], (2011), 66-70
26. 高世安 冼爱平, 聚乙烯吡咯烷酮改进TiO2薄膜的可见光增强氧敏特性, 传感技术学报, 21[9], (2008), 1481-1486
27.崔晓云,冼爱平, 尚建库, 铜掺杂纳米TiO2氢气敏感性研究, 传感技术学报, 20[1], (2007), 5-10
28. 江波 冼爱平, 锡镀层表面晶须问题的研究现状与进展, 表面技术, 35[4], (2006), 1-4, 12
29. 王薇, 王中光, 冼爱平, 尚建库, CBGA结构热循环条件下无铅焊点的显微组织和断裂, 金属学报, 42[6], (2006), 647-652
30. 李英梅 黄宝宗, 冼爱平, 尚建库, 王中光, 电子封装元件的高阶层离散均匀化分析, 力学学报, 37[4], (2005), 428-434
发表论文
[1] Shi, HongChang, Xian, AiPing. Tin Whisker Growth on NdSn3 Powder. JOURNAL OF ELECTRONIC MATERIALS[J]. 2011, 40(9): 1962-1966, http://www.irgrid.ac.cn/handle/1471x/409751.[2] 杨泽焱, 冼爱平. 液态铅在大气条件下的氧化行为. 电源技术[J]. 2011, 35(1): 66-70, http://lib.cqvip.com/Qikan/Article/Detail?id=36429183.[3] 石红昌, 冼爱平. 镀层表面锡晶须自发生长现象的研究进展. 中国有色金属学报[J]. 2011, 21(5): 1021-1030, http://lib.cqvip.com/Qikan/Article/Detail?id=38341580.[4] Liu Meng, Xian AiPing. TEM observation of tin whisker. SCIENCE CHINA-TECHNOLOGICAL SCIENCES[J]. 2011, 54(6): 1546-1550, http://lib.cqvip.com/Qikan/Article/Detail?id=37559151.
指导学生
已指导学生
曹辉 博士研究生 080503-材料加工工程
高世安 博士研究生 080503-材料加工工程
郭建军 博士研究生 080501-材料物理与化学
刘振伟 博士研究生 080503-材料加工工程
江波 硕士研究生 080501-材料物理与化学
崔晓云 硕士研究生 080501-材料物理与化学
王薇 硕士研究生 080503-材料加工工程
周志明 博士研究生 080503-材料加工工程
贡国良 硕士研究生 080503-材料加工工程
黄文克 博士研究生 080503-材料加工工程
刘萌 硕士研究生 080503-材料加工工程
杨泽焱 硕士研究生 080503-材料加工工程
石红昌 硕士研究生 080502-材料学
现指导学生
颜忠 硕士研究生 080502-材料学
赵子寿 硕士研究生 080502-材料学