080503-材料加工工程

微电子封装材料与工艺

   

2020-05~现在, 中国科学院深圳先进技术研究院, 副研究员
2017-12~2020-04,华中科技大学, 博士后

   

（ 1 ） 一种用于低温焊接的免清洗纳米浆料制备方法, 发明, 2018, 第 2 作者, 专利号: ZL201610040154.2.
（ 2 ） 一种基于可自修复铜纳米颗粒浆料的低温铜铜键合方法, 发明, 2020, 第 2 作者, 专利号: ZL201811506264.9.
（ 3 ） 用于芯片封装中图形化纳米颗粒的微焊点互连方法及产品, 发明, 2019, 第 3 作者, 专利号: CN201911299346.5.
（ 4 ） 一种基于可自还原银离子浆料的低温键合方法, 发明, 2018, 第 2 作者, 专利号: CN201810671279.4.

   

[1] Feng, Chen, Liu, Shiyuan, Li, Junjie, Li, Maoyuan, Cheng, Siyi, Chen, Chen, Shi, Tielin, Tang, Zirong. Molecular Understanding of Electrochemical-Mechanical Responses in Carbon-Coated Silicon Nanotubes during Lithiation. NANOMATERIALS[J]. 2021, 11(3): https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7996296/.
[2] Zhang, Xiwen, Liu, Jiaxin, Liu, Jinglong, Peng, Yang, Li, Junjie, Shi, Tielin. Reliable and Efficient Phosphor-in-Glass-Based Chip-Scale Packaging for High-Power White LEDs. IEEE TRANSACTIONS ON ELECTRON DEVICES[J]. 2021, 68(9): 4473-4477, [3] 史铁林, 李俊杰, 朱朋莉, 赵涛, 孙蓉. 基于纳米铜烧结互连键合技术的研究进展. 集成技术. 2021, 10(1): 3-13, http://lib.cqvip.com/Qikan/Article/Detail?id=7103981239.
[4] Liu, Xingyue, Li, Junjie, Liu, Zhiyong, Tan, Xianhua, Sun, Bo, Xi, Shuang, Shi, Tielin, Tang, Zirong, Liao, Guanglan. Vapor-assisted deposition of CsPbIBr2 films for highly efficient and stable carbon-based planar perovskite solar cells with superior V-oc. ELECTROCHIMICA ACTA[J]. 2020, 330: http://dx.doi.org/10.1016/j.electacta.2019.135266.
[5] Feng, Chen, Li, Junjie, Cheng, Siyi, Li, Maoyuan, Chen, Chen, Liao, Guanglan, Shi, Tielin, Tang, Zirong. An atomistic perspective on lithiation kinetics and morphological evolution in void-involved silicon/carbon nanohybrid. MATERIALS & DESIGN[J]. 2020, 195: http://dx.doi.org/10.1016/j.matdes.2020.109037.
[6] Li, Junjie, Zhang, Xiwen, Liu, Xingyue, Liang, Qi, Liao, Guanglan, Tang, Zirong, Shi, Tielin. Conductivity and foldability enhancement of Ag patterns formed by PVAc modified Ag complex inks with low-temperature and rapid sintering. MATERIALS & DESIGN[J]. 2020, 185: http://dx.doi.org/10.1016/j.matdes.2019.108255.
[7] Liang, Qi, Li, Junjie, Li, Tianxiang, Liao, Guanglan, Tang, Zirong, Shi, Tielin. Patterning Ag nanoparticles by selective wetting for fine size Cu-Ag-Cu bonding. NANOTECHNOLOGY[J]. 2020, 31(35): https://www.webofscience.com/wos/woscc/full-record/WOS:000543076500001.
[8] Liu, Xingyue, Liu, Zhiyong, Li, Junjie, Tan, Xianhua, Sun, Bo, Fang, Han, Xi, Shuang, Shi, Tielin, Tang, Zirong, Liao, Guanglan. Ultrafast, self-powered and charge-transport-layer-free photodetectors based on high-quality evaporated CsPbBr3 perovskites for applications in optical communication. JOURNAL OF MATERIALS CHEMISTRY C[J]. 2020, 8(10): 3337-3350, https://www.webofscience.com/wos/woscc/full-record/WOS:000520979400036.
[9] Feng, Chen, Shi, Tielin, Li, Junjie, Cheng, Siyi, Liao, Guanglan, Tang, Zirong. Effects of pre-existing interfacial defects on the structural evolution of alumina coated Si electrode during delithiation. APPLIED SURFACE SCIENCE[J]. 2020, 520: http://dx.doi.org/10.1016/j.apsusc.2020.146366.
[10] Li, Junjie, Liang, Qi, Shi, Tielin, Fan, Ji, Gong, Bo, Feng, Chen, Fan, Jinhu, Liao, Guanglan, Tang, Zirong. Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2019, 772: 793-800, http://dx.doi.org/10.1016/j.jallcom.2018.09.115.
[11] Li, Junjie, Shi, Tielin, Feng, Chen, Liang, Qi, Yu, Xing, Fan, Jinhu, Cheng, Siyi, Liao, Guanglan, Tang, Zirong. The novel Cu nanoaggregates formed by 5 nm Cu nanoparticles with high sintering performance at low temperature. MATERIALS LETTERS[J]. 2018, 216: 20-23, http://dx.doi.org/10.1016/j.matlet.2017.12.094.
[12] Li, Junjie, Yu, Xing, Shi, Tielin, Cheng, Chaoliang, Fan, Jinhu, Cheng, Siyi, Li, Tianxiang, Liao, Guanglan, Tang, Zirong. Depressing of Cu-Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2017, 709: 700-707, https://www.webofscience.com/wos/woscc/full-record/WOS:000401042300087.
[13] Cheng, Chaoliang, Li, Junjie, Shi, Tielin, Yu, Xing, Fan, Jinhu, Liao, Guanglan, Li, Xiaoping, Cheng, Siyi, Zhong, Yan, Tang, Zirong. A novel method of synthesizing antioxidative copper nanoparticles for high performance conductive ink. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2017, 28(18): 13556-13564, https://www.webofscience.com/wos/woscc/full-record/WOS:000409027000036.
[14] Li, Junjie, Yu, Xing, Shi, Tielin, Cheng, Chaoliang, Fan, Jinhu, Cheng, Siyi, Liao, Guanglan, Tang, Zirong. Low-Temperature and Low-Pressure Cu-Cu Bonding by Highly Sinterable Cu Nanoparticle Paste. NANOSCALE RESEARCH LETTERS[J]. 2017, 12(1): http://dx.doi.org/10.1186/s11671-017-2037-5.
[15] Yu, Xing, Li, Junjie, Shi, Tielin, Cheng, Chaoliang, Liao, Guanglan, Fan, Jinhu, Li, Tianxiang, Tang, Zirong. A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2017, 724: 365-372, http://dx.doi.org/10.1016/j.jallcom.2017.07.045.
[16] Li, J J, Cheng, C L, Shi, T L, Fan, J H, Yu, X, Cheng, S Y, Liao, G L, Tang, Z R. Surface effect induced Cu-Cu bonding by Cu nanosolder paste. MATERIALS LETTERS[J]. 2016, 184: 193-196, http://dx.doi.org/10.1016/j.matlet.2016.08.085.

   

（ 1 ） 面向高密度封装的低温自修复铜互连形成研究, 主持, 国家级, 2019-01--2021-12
（ 2 ） 博士后创新人才支持计划:基于铜纳米焊料自还原的高品质铜-铜键合研究, 主持, 研究所（学校）, 2018-05--2021-04
（ 3 ） 博士后科学基金面上项目:面向低温互连的高可靠铜纳米焊料研究, 主持, 研究所（学校）, 2018-05--2020-04
（ 4 ） 多场作用下的三维密排阵列互连结构形成及性能调控, 参与, 国家级, 2015-01--2019-12

（1）Low-temperature MOD assisted sintering of Ag nanoparticles for power device die-attach   2021-06-01
（2）Low-temperature Cu-Cu bonding by self-reduction of particle-free Ag ion paste   Junjie Li   2019-12-15
（3）Cu-Cu bonding by low-temperature sintering of self-healable Cu nanoparticles   Junjie Li   2019-06-01
（4）Low-temperature and low-pressure Cu-Cu bonding by pure Cu nanosolder paste for wafer-level packaging   Junjie Li   2017-06-01