基本信息
曹立强  男  博导  中国科学院微电子研究所
电子邮件: caoliqiang@ime.ac.cn
通信地址: 北京市朝阳区北土城西路3号
邮政编码: 100029

招生信息

   
招生专业
080903-微电子学与固体电子学
085208-电子与通信工程
招生方向
三维集成与系统封装技术

教育背景

1999-08--2005-01   瑞典查尔默斯大学   博士
1992-09--1997-06   中国科学技术大学   学士

工作经历

   
工作简历
2009-02~现在, 中国科学院微电子研究所, 研究员,博士生导师,室主任
2005-10~2009-01,英特尔(INTEL)技术开发有限公司, 资深研究员,技术研发经理
2004-03~2005-09,北欧微系统集成技术中心,瑞典查尔莫斯大学, 资深研究员
2000-07~2004-03,瑞典国家工业产品研究所电子产品部(IVF), 研究助理
社会兼职
2009-12-31-今,国家集成电路封测产业链技术创新联盟, 副理事长、副秘书长、专家咨询委员会副主任

专利与奖励

   
奖励信息
(1) 基于TSV的2.5D/3D 封装制造及系统集成技术, 二等奖, 部委级, 2017
(2) 高密度三维系统级封装的关键技术研究, 二等奖, 部委级, 2016
专利成果
( 1 ) 一种具有周期叠层铁电薄膜的电容及其制备方法, 发明, 2011, 第 3 作者, 专利号: 201110070503.2
( 2 ) 一种制作多层有机液晶聚合物基板结构的方法, 发明, 2011, 第 2 作者, 专利号: 201110055380.5
( 3 ) 一种封装系统, 发明, 2011, 第 1 作者, 专利号: 201110351244.0
( 4 ) 一种碳纳米管束垂直互连的制作方法, 发明, 2012, 第 1 作者, 专利号: 201210038865.8
( 5 ) 转接板结构及其制造方法, 发明, 2012, 第 3 作者, 专利号: 201210345771.5
( 6 ) 一种采用转移法制作碳纳米管柔性微凸点的方法, 发明, 2013, 第 2 作者, 专利号: 201310317189.2
( 7 ) 一种通孔结构及其制作方法, 发明, 2013, 第 1 作者, 专利号: 201310317725.9
( 8 ) 一种三维互连结构, 发明, 2013, 第 2 作者, 专利号: 201320608900.5
( 9 ) 三维垂直互连硅基光电同传器件及其制作方法, 发明, 2014, 第 4 作者, 专利号: 201410042670.X
( 10 ) 一种悬空结构微机械微波滤波器的制备方法, 发明, 2017, 第 5 作者, 专利号: 201711268056.5
( 11 ) 一种芯片封装结构及其封装方法, 发明, 2018, 第 2 作者, 专利号: 201810322554.1
( 12 ) 一种电路板结构及其制作方法, 发明, 2018, 第 2 作者, 专利号: 201810327449.7
( 13 ) 一种芯片封装结构及其封装方法, 发明, 2018, 第 2 作者, 专利号: 201810322550.3
( 14 ) ミリ波導波管通信システム, 发明, 2014, 第 1 作者, 专利号: JP5939657B2

出版信息

   
发表论文
[1] Yang, Peng, Sun, Siwei, Xue, Haiyun, Zheng, Qi, He, Huimin, Meng, XiangXu, Liu, Fengman, Cao, Liqiang. Efficient and scalable edge coupler based on silica planar lightwave circuits and lithium niobate thin films. OPTICS AND LASER TECHNOLOGY[J]. 2023, 158: http://dx.doi.org/10.1016/j.optlastec.2022.108867.
[2] Rongwei Gao; Rui Ma; Jun Li; Meiying Su; Fengze Hou; Liqiang Cao. selection and characteriazation of photosensitive polyimide for fan-out wafer-level packaging. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2022, 12(2): 368-374, [3] Xue, Mei, Wan, Weikang, Wang, Qidong, Cao, Liqiang. Low-profile millimetre-wave wideband microstrip antenna with parasitic patch arrays. IET MICROWAVES ANTENNAS & PROPAGATION[J]. 2021, 15(4): 364-370, https://www.webofscience.com/wos/woscc/full-record/WOS:000621456700001.
[4] Luo, Suibin, Ansari, Talha Qasim, Yu, Junyi, Yu, Shuhui, Xu, Pengpeng, Cao, Liqiang, Huang, Haitao, Sun, Rong. Enhancement of dielectric breakdown strength and energy storage of all-polymer films by surface flattening. CHEMICAL ENGINEERING JOURNAL[J]. 2021, 412: http://dx.doi.org/10.1016/j.cej.2021.128476.
[5] Zhu, Hanxiang, Li, Jun, Cao, Liqiang, Cao, Jia, Chen, Pengwei. Si-based Ka-band SIW band-pass filter using wafer level manufacturing process. IEICE ELECTRONICS EXPRESSnull. 2021, 18(1): https://www.webofscience.com/wos/woscc/full-record/WOS:000614032100003.
[6] Zhu, Hanxiang, Li, Jun, Wang, Qidong, Cao, Liqiang. Design of a Ka-band receiver front end using Si-based system in package. IEICE ELECTRONICS EXPRESS[J]. 2021, 18(8): http://dx.doi.org/10.1587/elex.18.20210100.
[7] Xue, Mei, Wan, Weikang, Wang, Qidong, Cao, Liqiang. Low-Profile Millimeter-Wave Broadband Metasurface Antenna With Four Resonances. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS[J]. 2021, 20(4): 463-467, https://www.webofscience.com/wos/woscc/full-record/WOS:000638401200009.
[8] Chu, Jiao, Li, Jun, Zhou, Yunyan, Cao, Jia, Chen, Pengwei, Cao, Liqiang. Si-based system-in-package design with broadband interconnection for E-band applications. IEICE ELECTRONICS EXPRESS[J]. 2021, 18(8): http://dx.doi.org/10.1587/elex.18.20210140.
[9] Hou, Fengze, Wang, Wenbo, Ma, Rui, Li, Yonghao, Han, Zhonglin, Su, Meiying, Li, Jun, Yu, Zhongyao, Song, Yang, Wang, Qidong, Chen, Min, Cao, Liqiang, Zhang, Guoqi, Ferreira, Braham. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS[J]. 2020, 8(1): 367-380, [10] Wei, Juan, Liu, Fengman, Xue, Haiyun, Hou, Fengze, He, Huimin, Sun, Yu, Sun, Siwei, Li, Zhixiong, Cao, Liqiang. Design, modeling and fabrication of low cost and miniaturized optical engine based on organic optical bench. JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS[J]. 2020, 22(3-4): 106-115, [11] Hou, Fengze, Wang, Wenbo, Cao, Liqiang, Li, Jun, Su, Meiying, Lin, Tingyu, Zhang, Guoqi, Ferreira, Braham. Review of Packaging Schemes for Power Module. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICSnull. 2020, 8(1): 223-238, http://dx.doi.org/10.1109/JESTPE.2019.2947645.
[12] 曹睿, 戴风伟, 陈立军, 周云燕, 曹立强. TSV转接板空腔金属化与再布线层一体成型技术. 半导体技术[J]. 2020, 45(10): 790-795, http://lib.cqvip.com/Qikan/Article/Detail?id=7103164538.
[13] Chen, Chuan, Su, Meiying, Ma, Rui, Hou, Fengze, Cao, Liqiang, Li, Jun. Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2020, 10(6): 1000-1009, http://dx.doi.org/10.1109/TCPMT.2020.2982012.
[14] Chen, Chuan, Hou, Fengze, Su, Meiying, Ma, Rui, Li, Jun, Cao, Liqiang. Pressure Drop and Thermal Characteristic Prediction for Staggered Strip Fin Microchannel. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2020, 10(3): 435-443, https://www.webofscience.com/wos/woscc/full-record/WOS:000520493900010.
[15] Luo, Suibin, Yu, Junyi, Ansari, Talha Qasim, Yu, Shuhui, Xu, Pengpeng, Cao, Liqiang, Huang, Haitao, Sun, Rong, Wong, ChingPing. Elaborately fabricated polytetrafluoroethylene film exhibiting superior high-temperature energy storage performance. APPLIED MATERIALS TODAY[J]. 2020, 21: http://dx.doi.org/10.1016/j.apmt.2020.100882.
[16] 李志雄, 何慧敏, 刘丰满, 薛海韵, 孙瑜, 隗娟, 曹立强. 4×25 Gbit/s光电收发模块的封装设计与实现. 光通信研究[J]. 2020, 37-42, https://doaj.org/article/e6827be300344f478876e757e3ba9579.
[17] Wan, Weikang, Xue, Mei, Cao, Liqiang, Ye, Tianchun, Wang, Qidong. Low-Profile Broadband Patch-Driven Metasurface Antenna. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS[J]. 2020, 19(7): 1251-1255, https://www.webofscience.com/wos/woscc/full-record/WOS:000546898200042.
[18] 宗小雪, 苏梅英, 周云燕, 马瑞, 曹立强. 基于扇出型封装塑封材料性能的表征研究. 电子元件与材料[J]. 2020, 39(5): 90-96, http://lib.cqvip.com/Qikan/Article/Detail?id=7101789962.
[19] Hou, Fengze, Wang, Wenbo, Lin, Tingyu, Cao, Liqiang, Zhang, G Q, Ferreira, J A. Characterization of PCB Embedded Package Materials for SiC MOSFETs. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2019, 9(6): 1054-1061, https://www.webofscience.com/wos/woscc/full-record/WOS:000470984600006.
[20] 马瑞, 苏梅英, 刘晓芳, 王旭刚, 曹立强. TSV电迁移影响因素的有限元分析. 电子元件与材料[J]. 2019, 38(2): 93-97, http://lib.cqvip.com/Qikan/Article/Detail?id=7001367907.
[21] Cen, WuRong, Wu, XiaoMeng, Cao, LiQiang, Wang, QiDong, Wen, LiangJian. Novel fused-silica charge detection tile for particle detectors. 辐射探测技术与方法(英文)[J]. 2019, 3(2): 22-26, http://lib.cqvip.com/Qikan/Article/Detail?id=7106713473.
[22] 隗娟, 刘丰满, 薛海韵, 孙瑜, 何慧敏, 李志雄, 曹立强. 基于硅转接板的光电混合集成共封装技术研究. 微纳电子与智能制造[J]. 2019, 126-130, http://lib.cqvip.com/Qikan/Article/Detail?id=00002FUILH387JP167DO6JP16BR.
[23] 马鹏程, 孙思维, 刘丰满, 薛海韵, 孙瑜, 何慧敏, 李志雄, 曹立强. 一种高性能硅基锗单行载流子光电探测器设计. 光通信研究[J]. 2019, 26-30, https://doaj.org/article/03b5817ca05f454f8f71bc8b8aeecc8c.
[24] Liqiang Cao. Signiicantly Enhanced Electrostatic Energy Storage Performance of Flexible Polymer Composites by Introducing Highly Insulating-Ferroelectric Microhybrids as Fillers. Advanced. Energy Materials. 2019, [25] 彭刚彬, 周云燕, 曹立强. 基于5G通信的硅基IPD滤波器设计与仿真. 微电子学与计算机[J]. 2019, 10-13, http://lib.cqvip.com/Qikan/Article/Detail?id=87888974504849574853484851.
[26] 赵慢, 孙瑜, 刘丰满, 薛海韵, 曹立强. 基于有机基板的光耦合系统设计与制作. 光通信研究[J]. 2019, 40-45, https://doaj.org/article/b109b754088c4793951fea854b294faa.
[27] 杨海博, 戴风伟, 王启东, 曹立强. 基于双面TSV互连技术的超厚硅转接板制备. 微纳电子技术[J]. 2019, 56(7): 580-585, http://lib.cqvip.com/Qikan/Article/Detail?id=7002288096.
[28] 彭刚彬, 周云燕, 曹立强. 基于5G通信的硅基IPD滤波器研究与验证. 电子设计工程[J]. 2019, 27(20): 175-179, http://lib.cqvip.com/Qikan/Article/Detail?id=7003027513.
[29] Luo, Suibin, Yu, Junyi, Yu, Shuhui, Sun, Rong, Cao, Liqiang, Liao, WeiHsin, Wong, ChingPing. Significantly Enhanced Electrostatic Energy Storage Performance of Flexible Polymer Composites by Introducing Highly Insulating-Ferroelectric Microhybrids as Fillers. ADVANCED ENERGY MATERIALS[J]. 2019, 9(5): [30] Liqiang Cao. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages. Applied Thermal Engineering. 2019, [31] Xu, Pengpeng, Luo, Suibin, Yu, Junyi, Cao, Liqiang, Yu, Shuhui, Sun, Rong, Wong, ChingPing. Simultaneously Enhanced Permittivity and Electric Breakdown Strength of Polyacrylonitrile Composites by Introducing Ultralow Content BaSrTiO3 Nanofibers. ADVANCED ENGINEERING MATERIALS[J]. 2019, 21(12): https://www.webofscience.com/wos/woscc/full-record/WOS:000487679000001.
[32] 苏梅英, 高溶唯, 李君, 曹立强. 基于系统级扇出封装热管理仿真分析. 电力电子技术[J]. 2018, 52(8): 52-55, http://lib.cqvip.com/Qikan/Article/Detail?id=676038596.
[33] Albert, J B, Anton, G, Arnquist, I J, Badhrees, I, Barbeau, P, Beck, D, Belov, V, Bourque, F, Brodsky, J P, Brown, E, Brunner, T, Burenkov, A, Cao, G F, Cao, L, Cen, W R, Chambers, C, Charlebois, S A, Chiu, M, Cleveland, B, Coon, M, Craycraft, A, Cree, W, Cote, M, Dalmasson, J, Daniels, T, Daugherty, S J, Daughhetee, J, Delaquis, S, MesrobianKabakian, A Der, DeVoe, R, Didberidze, T, Dilling, J, Ding, Y Y, Dolinski, M J, Dragone, A, Fabris, L, Fairbank, W, Farine, J, Feyzbakhsh, S, Fontaine, R, Fudenberg, D, Giacomini, G, Gornea, R, Graham, K, Gratta, G, Hansen, E V, Harris, D, Hasan, M, Heffner, M, Hoppe, E W, House, A, Hufschmidt, P, Hughes, M, Hoessl, J, Ito, Y, Iverson, A, Jamil, A, Jewell, M, Jiang, X S, Johnson, T N, Johnston, S, Karelin, A, Kaufman, L J, Killick, R, Koffas, T, Kravitz, S, Krucken, R, Kuchenkov, A, Kumar, K S, Lan, Y, Leonard, D S, Li, G, Li, S, Li, Z, Licciardi, C, Lin, Y H, MacLellan, R, Michel, T, Mong, B, Moore, D, Murray, K, Newby, R J, Ning, Z, Njoya, O, Nolet, F, Odgers, K, Odian, A, Oriunno, M, Orrell, J L, Ostrovskiy, I, Overman, C T, Ortega, G S, Parent, S, Piepke, A, Pocar, A, Pratte, J F, Qiu, D, Radeka, V, Raguzin, E, Rao, T, Rescia, S, Retiere, F, Robinson, A, Rossignol, T, Rowson, P C, Roy, N, Saldanha, R, Sangiorgio, S, Schmidt, S, Schneider, J, Schubert, A, Sinclair, D, Skarpaas, K, Soma, A K, StHilaire, G, Stekhanov, V, Stiegler, T, Sun, X L, Tarka, M, Todd, J, Tolba, T, Tsang, R, Tsang, T, Vachon, F, Veeraraghavan, V, Visser, G, Vogel, P, Vuilleumier, J L, Wagenpfeil, M, Wang, Q, Weber, M, Wei, W, Wen, L J, Wichoski, U, Wrede, G, Wu, S X, Wu, W H, Yang, L, Yen, Y R, Zeldovich, O, Zettlemoyer, J, Zhang, X, Zhao, J, Zhou, Y, Ziegler, T, nEXO Collaboration. Sensitivity and discovery potential of the proposed nEXO experiment to neutrinoless double-beta decay. PHYSICAL REVIEW C[J]. 2018, 97(6): https://www.webofscience.com/wos/woscc/full-record/WOS:000435348300002.
[34] Chen Kai, Ling Huiqin, Guo Fayao, Li Ming, Zhang Wenqi, Cao Liqiang, IEEE. Effect of Ni barrier layer thickness on IMCs evolution in Phi 5 mu m Cu/Ni/Sn pillar bumps. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2018, 190-194, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000450155700043.
[35] Jewell, M, Schubert, A, Cen, W R, Dalmasson, J, DeVoe, R, Fabris, L, Gratta, G, Jamil, A, Li, G, Odian, A, Patel, M, Pocar, A, Qiu, D, Wang, Q, Wen, L J, Albert, J B, Anton, G, Arnquist, I J, Badhrees, I, Barbeau, P, Beck, D, Belov, V, Bourque, F, Brodsky, J P, Brown, E, Brunner, T, Burenkov, A, Cao, G F, Cao, L, Chambers, C, Charlebois, S A, Chiu, M, Cleveland, B, Coon, M, Craycraft, A, Cree, W, Cote, M, Daniels, T, Daugherty, S J, Daughhetee, J, Delaquis, S, MesrobianKabakian, A Der, Didberidze, T, Dilling, J, Ding, Y Y, Dolinski, M J, Dragone, A, Fairbank, W, Farine, J, Feyzbakhsh, S, Fontaine, R, Fudenberg, D, Giacomini, G, Gornea, R, Hansen, E V, Harris, D, Hasan, M, Heffner, M, Hoppe, E W, House, A, Hufschmidt, P, Hughes, M, Hoessl, J, Ito, Y, Iverson, A, Jiang, X S, Johnston, S, Karelin, A, Kaufman, L J, Koffas, T, Kravitz, S, Krucken, R, Kuchenkov, A, Kumar, K S, Lan, Y, Leonard, D S, Li, S, Li, Z, Licciardi, C, Lin, Y H, MacLellan, R, Michel, T, Mong, B, Moore, D, Murray, K, Newby, R J, Ning, Z, Njoya, O, Nolet, F, Odgers, K, Oriunno, M, Orrell, J L, Ostrovskiy, I, Overman, C T, Ortega, G S, Parent, S, Piepke, A, Pratte, J F, Radeka, V, Raguzin, E, Rao, T, Rescia, S, Retiere, F, Robinson, A, Rossignol, T, Rowson, P C, Roy, N, Saldanha, R, Sangiorgio, S, Schmidt, S, Schneider, J, Sinclair, D, Skarpaas, K, Soma, A K, StHilaire, G, Stekhanov, V, Stiegler, T, Sun, X L, Tarka, M, Todd, J, Tolba, T, Tsang, R, Tsang, T, Vachon, F, Veeraraghavan, V, Visser, G, Vuilleumier, J L, Wagenpfeil, M, Weber, M, Wei, W, Wichoski, U, Wrede, G, Wu, S X, Wu, W H, Yang, L, Yen, Y R, Zeldovich, O, Zhang, X, Zhao, J, Zhouh, Y, Ziegler, T, nEXO Collaboration. Characterization of an Ionization Readout Tile for nEXO. JOURNAL OF INSTRUMENTATION[J]. 2018, 13: http://www.corc.org.cn/handle/1471x/2177887.
[36] Tian, Gengxin, Li, Jun, Hou, Fengze, Zhang, Wenwen, Guo, Xueping, Cao, Liqiang, Wan, Lixi. Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY[J]. 2018, 8(11): 1967-1978, https://www.webofscience.com/wos/woscc/full-record/WOS:000450607800011.
[37] 王健, 万里兮, 侯峰泽, 李君, 曹立强. 微波芯片倒装金凸点热疲劳可靠性分析及优化. 半导体技术[J]. 2018, 43(7): 555-560, http://lib.cqvip.com/Qikan/Article/Detail?id=675590365.
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发表著作
(1) 中国学科发展战略-----微纳电子学(第5章), 科学出版社, 2013-05, 第 1 作者
(2) 可靠性物理与工程-----失效时间模型, 科学出版社, 2013-05, 第 4 作者
(3) 中国集成电路封测产业链技术创新路线图, 电子工业出版社, 2013-06, 第 2 作者
(4) 硅通孔3D集成技术, 科学出版社, 2014-03, 第 1 作者
(5) 三维电子封装的硅通孔技术, 化学工业出版社, 2015-05, 第 2 作者

科研活动

   
科研项目
( 1 ) 高密度三维系统级封装的关键技术研究, 参与, 国家级, 2009-01--2012-12
( 2 ) 高端封装工艺及高容量闪存集成封装技术开发与产业化, 主持, 国家级, 2009-01--2011-12
( 3 ) 中国科学院创新团队国际合作伙伴计划, 主持, 国家级, 2009-10--2012-10
( 4 ) 系统级封装中芯片与封装互联的低应力可靠性研究, 主持, 国家级, 2010-06--2012-06
( 5 ) 三维高密度封装基板及高性能CPU封装技术研发与产业化, 主持, 国家级, 2011-01--2013-12
( 6 ) 高密度三维封装TSV电迁移可靠性机理研究, 主持, 国家级, 2014-09--2018-12
( 7 ) 三维系统级封装/集成先导技术研究, 主持, 国家级, 2013-01--2015-12
( 8 ) 微凸点均匀生长的能量梯度影响规律与物质流能量流表征, 主持, 国家级, 2015-01--2019-08
( 9 ) 航天高可靠硅基微系统三维集成技术基础研究, 主持, 国家级, 2016-01--2019-12
( 10 ) 高密度三维系统集成技术开发与产业化, 主持, 国家级, 2014-01--2018-12

指导学生

已指导学生

潘茂云  硕士研究生  430110-集成电路工程  

汪鑫  硕士研究生  080903-微电子学与固体电子学  

何毅  博士研究生  080903-微电子学与固体电子学  

王启东  博士研究生  080903-微电子学与固体电子学  

宋曼谷  硕士研究生  085208-电子与通信工程  

王祺翔  硕士研究生  085208-电子与通信工程  

邱德龙  博士研究生  080903-微电子学与固体电子学  

吴鹏  博士研究生  080903-微电子学与固体电子学  

林来存  博士研究生  080903-微电子学与固体电子学  

苏华伟  硕士研究生  085208-电子与通信工程  

何慧敏  博士研究生  080903-微电子学与固体电子学  

现指导学生

薛梅  博士研究生  080903-微电子学与固体电子学  

杨海博  硕士研究生  085209-集成电路工程  

陈钏  博士研究生  080903-微电子学与固体电子学  

郑奇  博士研究生  080903-微电子学与固体电子学  

江文斌  博士研究生  080903-微电子学与固体电子学  

罗遂斌  博士研究生  080903-微电子学与固体电子学  

李刚  博士研究生  080903-微电子学与固体电子学  

隗娟  博士研究生  080903-微电子学与固体电子学