General

Ji Li,  Professor
Email: jili@ucas.ac.cn
Telephone: +86-13522278866
Address: Yu-Quan-Lu Road 19A, Shijingshan District, Beijing, China
Postcode: 100049
Advanced Thermal Management technologies
School of Engineering Science, University of Chinese Academy of Sciences

Research Areas

(i) Liquid-vapor phase change mechanism; 
(ii) Heat Pipe; Loop Heat Pipe
(ii) Electronic Cooling; MEMS; Micro-fluidics;
(iii) Thermal Storage. 


For more details , please visit:  https://www.researchgate.net/profile/Ji_Li8

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Prof. Li is recruiting PhD students each year from developing countries in Thermal Engineering area (currently focusing on two-phase flow heat transfer and thin film thermal interface materials). The interested young scholars should apply for the fellowship through: http://www.fellowship.cas.cn/dms.

The other admission information could be found here:
http://english.ucas.ac.cn/Admissions/Pages/CASInstitutesforInternationalPrograms.aspx

Education

1. 1998.9-2001.7, Ph.D. in Thermophysics , Institute of Engineering Thermophysics, Chinese Academy of Sciences - Beijing, China.
2. 1994.9-1997.7, M.S. in Power Engineering, Institute of Engineering Thermophysics, Chinese Academy of Sciences - Beijing, China.
3. 1988.9-1992.7, B.S. in Mechanical Engineering, Xi’an Jiaotong University – Xian, China.

Experience

   
Work Experience
1.2012.5-present, Professor, College of Physical Sciences,  University of Chinese Academy of Sciences, China.
2.2008.3-2012.5, Associate Professor, College of Physical Sciences, Graduate University of Chinese Academy of Sciences, China.
3. 2005.7-2008.3, Research Assistant Professor, Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.
4. 2003.10-2005.7, Postdoctoral Research Associate, Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.
5. 2001.7-2003.2, Visiting Scholar, Department of Mechanical Engineering, Hong Kong University of Science & Technology – Hong Kong SAR, China.
6. 1997.10-2001.6, Research Assistant Professor, Laboratory of Heat Pipe and Phase Change Heat Transfer, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, China.
Teaching Experience
1.(347001Z) Seminar on Advanced Thermal Transportation Systems;
2.(341003Z ) Principle and Technologies in Experimental Thermophyscis;
3.(343002Z)  Fundamentals of MEMS (MicroElectroMechanical Systems); 
4.(347003Z)  Seminars on Advanced Experimental Practice in Thermophysics; 
5.(3WXYD05)  Literature Review in Power Engineering and Thermophysics Engineering

Honors & Distinctions

   

Publications

   
Papers

Refereed Journals (SCI Cited more than 800 times)

1.        Lucang Lv and Ji Li*, Managing high heat flux up to 500W/cm2 through an ultra-thin flat heat pipe with superhydrophilic wick, Applied Thermal Engineering, Volume 122, 25 July 2017, Pages 593–600.

2.        Guohui Zhou, Ji Li*, Lucang Lv,and GP Peterson, Comparative study on thermal performance of ultra-thin miniature loop heat pipes with different internal wicks, ASME Journal of  Heat Transfer, 2017 (accepted).

3.        Lucang Lv and Ji Li*, Microscale superconductive thermal ground plane supported by superhydrophilic wick, International Communication in Heat and Mass Transfer, 2017().

4.        Lv, L., Li, J.*, and Zhou, G. A robust pulsating heat pipe cooler for integrated high power LED chips,  Heat and Mass Transfer (2017). doi:10.1007/s00231-017-2050-3.

5.        Li, Z., Li, J.*, Li, X., Ni, M.-J Free surface flow and heat transfer characteristics of liquid metal Galinstan at low flow velocityExperimental Thermal and Fluid Sciencevol. 82, pp. 240- 248, 2017.

6.        Lucang Lv and Ji Li*, Effect of charging ratio on thermal performance of a miniaturized two-phase super-heat-spreader, International Journal of Heat and Mass Transfer, Vol.104, pp.489-492,  2017. 

7.        Guohui Zhou, Ji Li*, Lucang Lv, An ultra-thin miniature loop heat pipe cooler for mobile electronics, Applied Thermal Engineering, Vol.109, pp. 514–523, 2016.

8.        ZW Li, LC LV, and J Li*, Combination of thermal spreading and heat storage for high power portable electronics, International Journal of Heat and Mass Transfer, Vol. 98, pp.550-557, 2016 .

9.        J Li*, WK Tian, and LC LV, A Thermosyphon Heat Pipe Cooler for High Power LEDs Cooling, Heat and Mass Transfer, Vol.52, pp1541-1548, 2016.

10.    J Li* and LC Lv, Experimental Studies on a Novel Thin Flat Heat Pipe Heat Spreader, Applied Thermal Engineering, Vol.93, pp. 139-146, 2016.

11.    GW Niu, and J Li*, A comparative study of pool boiling heat transfer with nano-fluids on porous surface, Heat and Mass Transfer, Vol.51, pp.1769-1777,  2015.

12.    J Li*, and LC Lv, Performance Investigation of a Compact Loop Heat Pipe with Parallel Condensers, Experimental Thermal and Fluid Science, Vol.62, pp.40-51, 2015.

13.    J Li*, F Lin and GW Niu, An insert-type two-phase closed loop thermosyphon for split-type solar water heaters, Applied Thermal Engineering, Vol.70, pp.441-450, 2014.

14.  LC Lv, J Li*, Micro Flat Heat Pipes for Microelectronics Cooling: Review, Recent Patents on Mechanical Engineering, 6(3), pp169-184, 2013.

15.  J Li*, A Compound Thermodynamic Model for Transient Bubble Growth in Microscale, International Journal of Heat and Mass Transfer, Vol.65, pp. 739-749 , 2013.

16.    J Li*, F Lin, DM Wang, and WK Tian, A Loop-heat-pipe Heat Sink with Parallel Condensers for High-power Integrated LED Chips, Applied Thermal Engineering, Vol.56, pp.18-26, 2013.

17.    Y Jiang, G Carbajal, CB Sobhan, and J Li*, 3D Heat Transfer Analysis of a Miniature Copper-water Vapor Chamber with Wicked Pillars Array, ISRN Mechanical Engineering, Paper ID194908, 2013.

18.     J Li*, Zhongshan Shi, 3D numerical optimization of a heat sink base for electronics cooling, International Communications in Heat and Mass Transfer, Vol.39, No.2, pp.204-208, 2012.

19.     J Li*, DM Wang, GP Peterson, A Compact Loop Heat Pipe With Flat Square Evaporator for High Power Chip Cooling, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.1, No.4, pp.519-527, 2011.

20.     Ji Li* and GP Peterson, 3D Numerical Simulation of Heat and Mass Transfer in a Square Flat Evaporator of a Loop Heat Pipe with Fully Saturated Wick, International Journal of Heat and Mass Transfer, Vol.54, pp.564-574, 2011.

21.     Ji Li*, Daming Wang, G.P. Peterson, Experimental Studies on a High Performance Compact Loop Heat Pipe with a Square Flat Evaporator, Applied Thermal Engineering, Vol.30, pp.741-        752,2010.

22.    PH Chen, SW Chang, KF Chiang and J Li, Patents Review for cooling of high power electronic components, Recent Patents on Engineering, Vol. 2, No.3, pp.174-188, 2008.

23.     J Li*, G P Peterson and P Cheng, Bubble Dynamics from Boiling Incipience to Bubble Collapse on a Square Platinum Microheater under millisecond Pulsed Heating, International Journal of Heat and Mass Transfer, Vol.51, No. 1-2, pp. 273-282, 2008.

24.    J Li*, G P Peterson, 3-Dimentional Numerical Optimization of Silicon-based High Performance Parallel-channel Micro Heat Sink with Liquid Flow, International Journal of Heat and Mass Transfer, Vol.50, No.15-16, pp. 2895-2904, 2007.

25.     J Li*, G P Peterson, Suppression of Heterogeneous Bubble Nucleation by Upstream Subcooled Liquid Flow, Applied Physics Letters, Vol.88, 201910, 2006.

26.    J Li*, G P Peterson, Geometric Optimization of an Integrated Micro Heat Sink with liquid Flow, IEEE Trans. Components and Packaging Technologies, Vol.29, No.1, pp.145-154, 2006.

27.    J Li*, G P Peterson, Boiling Nucleation and Two-Phase Flow Patterns under Forced Liquid Convection in Microchannels, International Journal of Heat and Mass Transfer, Vol.48, No.23-24, pp.4797-4810, 2005.

28.    J Li, G P Peterson, Microscale Heterogeneous Boiling on Smooth Surface-from Bubble Nucleation to Bubble Dynamics, International Journal of Heat and Mass Transfer, Vol.48, No.21-22, pp.4316-4332, 2005.

29.    J Li, G P Peterson, and P Cheng, Mechanical Non-equilibrium Consideration of Homogeneous Bubble Nucleation for an Unsteady-state Boiling Process, International Journal of Heat and Mass Transfer, Vol.48, No.15, pp.3081-3096, 2005.

30.    J Li, P Cheng, G P Peterson and J Z Xu, Rapid Transient Heat Conduction in Multi-layer material with Pulsed heating Boundary, Numerical Heat Transfer - A, Vol.47, No.7, pp633-652, 2005.

31.    J Li, G P Peterson and P Cheng, Three-dimensional Analysis of Heat Transfer in a Micro Heat Sink with Single Phase Flow, International Journal of Heat and Mass Transfer, Vol.47 (19-20), pp.4215-4231, 2004.

32.    J Li, P Cheng, Bubble Cavitation in a Microchannel, International Journal of Heat and Mass Transfer, Vol.47 (12-13), pp.2689-2698, 2004.

33.    J H Zhou, D Y Liu, J Li, Performance of a Small Solid-liquid Phase-change Heat sink for electronical cooling, Journal of Thermal Science, Vol.10, No.3, pp.254-259, 2001.

34.    J Li, Z F Zhang, D Y Liu, Experimental and Theoretical Study on the Rapid Transient Nucleated Boiling Heat Transfer, Progress in Natural Science, Vol.11, No.7, pp.529-535, 2001.

35.    J Li, Z F Zhang, D Y Liu, Difference Scheme for Hyperbolic Heat Conduction Equation with Pulsed Heating Boundary, Journal of Thermal Science, Vol.9, No.2, pp.152-157, 2000.

36.     J Li, Z F Zhang, Transient Temperature of Liquid on Micro Metal Layer Heated by Pulsed Laser, Journal of Thermal Science, Vol.18, No.2, pp.125-130, 1999.

37.  F Li, MJ Ni, and J Li, Numerical Study of Transient Bubble Growth and Collapse in Microscale, Journal of  University of Chinese Academy of Sciences, Vol.32, No.1, pp.31-37, 2015 . (In Chinese)

38.  ZS Shi, J Li, 3D Numerical Geometric Optimization of Plate Fin Heat Sinks in Natural Convection Heat Transfer, Journal of Refrigeration, Vol.34, No.1, pp.45-51, 2013. (In Chinese)

39.  J Li, ZS Shi, 3D Numerical Geometric Optimization of copper and Aluminum Microchannel Heat Sinks, Journal of Mechanical Engineering, Vol.48, No.5, pp.81-88,2012. (In Chinese)

40.    Jiang Y, Li J. Numerical simulation and structural optimization of a vapor chamber, Journal of Graduate University of Chinese Academy of Sciences,Vol.29, No.2,pp.169-174,2012.(In Chinese)

41.    Li Ji, Shi Zhongshan, 3D numerical optimization of a heat sink base for electronics cooling. Power Electronics, Vol.45.No.12,pp.109-111, 2011. (In Chinese)

42.     Jiang Yong,Li Ji,Numerical simulation and experimental investigation of a vapor chamberJournal of Refrigeration, Vol.32, No.5, pp.20-24, 2011. (In Chinese)

43.    J Li, Z F Zhang, D Y Liu, A New Bubble Dynamics Model for Nucleate Boiling, Journal of Engineering Thermophysics, Vol.23, No.1, pp.71-74, 2002. (In Chinese)

44.    J Li, Z F Zhang, D Y Liu, Rapid Transient Nucleated Boiling induced by pulsed laser, Progress in Natural Science, Vol.11, No.4, pp.386-391, 2001. (In Chinese)


Patents
China Invention Patent: A nano-rod wick vapor chamber.

Research Interests

 Phase Change Heat Transfer;

Thermal Storage;

Heat Pipes;

Advanced Thermal Management Systems;

Microfluids


Conferences

1.        Guohui Zhou, Ji Li*, Lucang LvExperimental study on heat transfer capability of a miniature loop heat pipe, Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE2016-66566, Phoenix, Arizona, USA, November 11-17, 2016.

2.        ZW Li, LC Lv, and J Li, Combination of thermal storage and heat spreading for high power portable electronics cooling, Joint 18th IHPC and 12th IHPS, Jeju, Korea, June 12-16, 2016.

3.        LC Lv, J Li, and GH Zhou, An Unique Pulsating Heat Pipe Cooler for Intergrated High Power LEDs,  Joint 18th IHPC and 12th IHPS, Jeju, Korea, June 12-16, 2016.

4.        Lc Lv and Ji Li, A passive pulsating heat pipe  cooler for high power LED illumination device, Paper #153185, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference, Dalian, China, 2015.(in Chinese)

5.        Zhiwei Li, LC Lv and Ji Li, Experimental investigations on thin passive cooler with composite mechanism for portable electronics, Paper #153314, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference, Dalian, China, 2015.(in Chinese)

6.        LC Lv and Ji Li, Development of a thin flat heat pipe heat spreader for mobile electronics, 14th national heat pipe conference, Beijing, China, 2015. (in Chinese)

7.        Ji Li, Feng Lin, Gengwen Niu, Fan Li Visualization Study of An Unique Two-phase Closed Loop Thermosyphon for Split-type Solar Water HeatersGlobal Warming Conference (GCGW-2014), Beijing, China, 2014.

8.        J Li, and LC Lv, Influence of Condenser Configurations on Thermal Performance of a Loop Heat Pipe, International Heat Transfer Symposium  2014,  HTS140012, Beijing, China, 2014.

9.        GW Niu, J Li, Visualization study of pool boiling on copper porous coated and polished surfaces for deionized water and Al2O3-water nano-fluid, ASME 2013 International Mechanical Engineering Congress & Exposition , Paper # IMECE2013-62346, San Diego, USA, 2013.

10.    GW Niu, J Li, Visualization study of pool boiling on porous coated surfaces for Al2O3-water nano-fluid, Paper #133758, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference, Chongqing, China, 2013.(in Chinese)

11.    F Li, J Li, MJ Ni, VOF Simulation of film boiling, Paper#133756, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference, Chongqing, China,2013. (in Chinese)

12.    DM Wang, J Li, Investigations on a compact loop heat pipe with parallel condensers, Paper#133757, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference, Chongqing, China, 2013. (in Chinese)

13.    J Li, F Lin and DM Wang, Experimental investigations on a loop heat pipe with parallel condensers, 12CHPC,Shanghai China,2012. (in Chinese)

14.    J Li, DM Wang and GP Peterson, A novel compact loop heat pipe with a square flat evaporator ,12CHPC, Shenzhen China,2010. (in Chinese)

15.    J LiGP PetersonY JiangSteady boiling and evaporation phase flow in micro-channel Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference,#103056, Shanghai China,2010. (in Chinese)

16.    Y JiangJ Li,Numerical simulation and structural optimization of a vapor chamberChinese Society of Engineering Thermo-physics, Heat and Mass Transfer Conference #103057, Shanghai China,2010. (in Chinese)

17.    Ji LI, Daming Wang, G.P. Peterson, Development of a Robust Miniature Loop Heat Pipe for High Power Chip Cooling, Paper No. MNHMT2009-18011, ASME 2009 2nd Micro/Nanoscale Heat & Mass Transfer International Conference, Shanghai, China, 2009.

18.    Ji LI, G.P. Peterson, Chen LI, Guoguang SU, A Stabilized Boiling/Evaporation Two-Phase Flow in Microchannels, Paper No. MNHMT2009-18012, ASME 2009 2nd Micro/Nanoscale Heat & Mass Transfer International Conference, Shanghai, China, 2009.

19.    Li, C, G.P. Peterson, and J. Li, Visualization of boiling and evaporation of water on micro porous media, Paper No. HT2008-56352, ASME summer heat transfer conference, Jacksonville, Florida, 2008 .

20.    X.Huang, X.Huai, S.Liang, X.Wang and J.Li, Molecular Dynamics Simulation of Thermal Conductivity in Nanocomposites, Paper No. IMECE2008-66856, 2008 ASME International Mechanical Engineering Congress & Exposition, Boston, USA, 2008.  

21.    Y P Chen, J Li and G P Peterson, Influence of Hydraulic diameter on flow condensation insilicon microchannels, 13th International Heat Transfer Conference, Sydney, Australia, Augusr, 2006 .

22.    J Li, G P Peterson, Bubble Dynamics from Boiling Incipience to Bubble Collapse under pulsed heating on a Microheater, 9th Joint AIAA/ASME Thermophysics and Heat Transfer Conference, San Francisco, California, 2006.

23.    J H Zhou, D Y Liu, J Li, a Small Solid-liquid Phase-change Heat sink for electronical cooling, International Symposium for Millennium Thermal Science, Xian, October, 2000.

24.    J Li, Z F Zhang, D Y Liu, Hyperbolic Heat Conduction with Pulsed Heating Boundary in multi-layer materials, International symposium for Millennium Thermal Science, Xian, October, 2000.

25.    J Li, Z F Zhang, D Y Liu, Bubble Dynamics of Boiling Explosion in Pure Liquid Induced by Pulsed Heating, Heat Transfer and Transport Phenomena in Microscale System, Degell House Inc., New York, 2000: 209-216 .

26.    J Li, Z F Zhang, D Y Liu, Rapid Transient Nucleate Boiling on a Metal Film Heated by Pulsed Laser, Heat Transfer Science and Technology 2000, Higher Education Press, Beijing, 2000: 427-432.

27.    J Li, Z F Zhang, D Y Liu,vapor bubble behavior while nucleate boiling under effect of pulse laser heating, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference,1999. (in Chinese)

28.    J Li, X L Sun, A design and use of heat flow meter for fluidized boilers, Chinese Society of Engineering Thermo-physics, Heat&Mass Transfer Conference,1997. (in Chinese)


Collaboration

1. Present Fund, Graduate University of Chinese Academy of Sciences;
2. Ministry of Education;
3. NSFC

Students

已指导学生

姜勇  02  19227  

史忠山  02  19227  

田文凯  02  19577  

林峰  02  19577  

王大明  02  19227  

李帆  02  19227  

牛耕文  02  63219  

吕鲁仓  02  63219  

李志伟  02  63219  

现指导学生

李星萍  02  19227  

吕鲁仓  01  19200  

秦勇  02  63219  

丁志鹏  02  19227  

周国辉  01  19200